A Technique for Improving the Yields of Fine Feature Prints *Presented at the APEX 2003 Show (original) (raw)

2011

Abstract

A technique that enhances the release of solder paste from stencils during the print process has been developed. The technique is based on applying variable high frequency and low amplitude vibrations to the stencil during the stencil/substrate separation sequence. The effects of the technique are demonstrated in the context of bumping wafers. It is shown that the enhanced print technique produces wafers with less defects, greater bump heights and better height uniformity than when conventional stencil printing is used without the enhancement technique.

Gerald Pham-van-diep hasn't uploaded this paper.

Let Gerald know you want this paper to be uploaded.

Ask for this paper to be uploaded.