Advanced time-multiplexed plasma etching of high aspect ratio silicon structures (original) (raw)

The Fabrication of an Applicative Device for Trench Width and Depth Using Inductively Coupled Plasma and the Bulk Silicon Etching Process

Jong-Chang Woo

Transactions on Electrical and Electronic Materials

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Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher

Arturo Ayon

Journal of The Electrochemical Society, 1999

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The black silicon method: a universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control

miko elwenspoek

Journal of Micromechanics and Microengineering, 1995

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Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

Frederic Marty

Microelectronic Engineering, 2014

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The black silicon method. VI. High aspect ratio trench etching for MEMS applications

miko elwenspoek

IEEE Transactions on Magnetics, 1996

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Modeling of Aspect Ratio Dependent Etching in an Inductively Coupled Plasma

Jim McVittie

MRS Online Proceedings Library (OPL) , 1995

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Silicon Reactive Ion Etching for Micromachining Applications

Homero Maciel

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Nanometer scale high-aspect-ratio trench etching at controllable angles using ballistic reactive ion etching

R. Dynes, Erick Ulin-Avila

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A survey on the reactive ion etching of silicon in microtechnology

miko elwenspoek

Journal of Micromechanics and Microengineering, 1996

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Suitability of reactive ion etching on 0.13 micro_m silicon technology

Ibrahim Hamammu

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Single-Run Single-Mask Inductively-Coupled-Plasma Reactive-Ion-Etching Process for Fabricating Suspended High-Aspect-Ratio Microstructures

Kuang-Chao Fan

Japanese Journal of Applied Physics, 2006

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Etching with electron beam generated plasmas

Darrin Leonhardt

Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2004

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Very High Aspect Ratio Deep Reactive Ion Etching of Sub-micrometer Trenches in Silicon

Anand Summanwar

2013

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The chemistry screening for ultra low-k dielectrics plasma etching

Mikhail Krishtab, Mikhail Baklanov, A. Zotovich

International Conference on Micro- and Nano-Electronics 2014, 2014

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Electrical and plasma property measurements of a deep reactive ion etching Bosch process

Cristian Abraham

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2003

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Low Temperature Plasma Etching Control through Ion Energy Angular Distribution and 3-Dimensional Profile Simulation

Y Fan

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Flux based modeling and simulation of dry etching for fabrication of silicon deep trench structures

Rizwan malik

Journal of Physics: Conference Series, 2011

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Fabrication of Reactive Ion Etching Systems for Deep Silicon Machining

Seong Kong

IEEJ Transactions on Sensors and Micromachines

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Tailoring etch directionality in a deep reactive ion etching tool

Steven Nagle

2000

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BSM 7: RIE lag in high aspect ratio trench etching of silicon

Meint de Boer

Microelectronic Engineering, 1997

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Maximum achievable aspect ratio in deep reactive ion etching of silicon due to aspect ratio dependent transport and the microloading effect

Junghoon Yeom

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2005

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The black silicon method II:The effect of mask material and loading on the reactive ion etching of deep silicon trenches

miko elwenspoek

Microelectronic Engineering, 1995

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OES diagnostics as a universal technique to control the Si etching structures profile in ICP

Armenak Osipov

Scientific Reports, 2022

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RIE lag in high aspect ratio trench etching of silicon

miko elwenspoek

Microelectronic Engineering, 1997

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Deep trench etching in silicon with fluorine containing plasmas

Homero Maciel

Applied Surface Science, 1996

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Plasma etching for micromechanical sensor applications

P. Dumania

Microelectronic Engineering, 1994

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APPLIED PHYSICS REVIEWS—FOCUSED REVIEW High aspect ratio silicon etch: A review

Cass Xanthi

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TOPICAL REVIEW: Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment

miko elwenspoek

J Micromechanic Microengineer, 2009

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Sample rocking and rotation in ion beam etching

John Walls

Journal of Materials Science, 1986

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