Deformations in Structures of Electronic Systems under External Impacts (original) (raw)

2021 IEEE International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo), 2021

Abstract

The paper represents analysis and control of deformations and stresses in small-size structural parts in electronic packages subjected to static and dynamic mechanical, thermal and pressure impacts by using methods of mathematical modeling and experimental research by electrotensometry, acoustic emission, vibration analysis and high-speed video-shooting. Mathematical models have been designed for stress and strain estimation in structural parts of circuit card assemblies subjected to static mechanical forces; for thermal stress and strain estimation in sealed packages; for dynamic stress and deflection calculation in complex structures of electronic packages. Conducted research benefits from introducing methods ensuring strength and stiffness condition for complex structures of electronic packages.

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