Circuit bending, breaking and mending (original) (raw)

Circuit-Bending: A Micro History Introduction to topic of discussion

2017

The topic of this discussion is to collect and analyse the evidence for Circuit-Bending as a legitimate form of art and its place in the musicological canon. Further, there will be a short examination on potential and current applications of this tool outside of the field of music and art. Circuit-Bending in and of itself is not a musical genre or sub-genre; rather it is a way of creating and building your own instrument by repurposing and augmenting electronic objects such as toys.

Developing design rules to avert cracking and debonding in integrated circuit structures

2000

In an integrated circuit, stresses come from many sources (eg, differential thermal expansion and electromigration). The circuit structures are never perfect, possibly containing crack-like flaws. The stresses may drive the pre-existing cracks to grow and cause circuit failure. We explore a fracture mechanics approach to formulate design rules to avert crack growth. We adopt a strategy based on two attributes of integrated circuits.

Topological Synthesis of Planar Metamorphic Mechanisms for Low-Voltage Circuit Breakers

This article presents a systematic graph theory-based method for the topological synthesis of planar metamorphic mechanisms including metamorphic transformations of links and changes in the degrees-of-freedom. The parts to move, with input and output motion defined, and the topological design space, are represented by graphs of simplejointed mechanisms. The topological requirements involving link transformations are expressed in terms of subgraphs with a given degrees-of-freedom containing prescribed input and output parts. The algorithm executes two subgraph searches inside atlases of mechanisms with different degrees-of-freedom. An application to the design of a family of low-voltage circuit-breaker mechanisms is shown.

Bending machine for testing reliability of flexible electronics

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2017

A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowing reliability prediction models to be developed. Four sets of test samples with different combinations of substrate, routing, interconnect technology and components were examined. A poor level of reliability was observed when using anisotropic conductive paste to form interconnects, whereas a significantly higher level of reliability was observed when using a bismuth-tin solder paste. The assembly of larger components resulted in shortened time to failure, whereas increasing the bending radius prolonged the observed lifetimes.

Automated Design Analysis : Comprehensive Modeling of Circuit Card Assemblies

2011

It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the product development cycle is extremely costly. The worst case situation is discovering design problems after failures occur in the field. Designing for reliability has been “easier said than done” due in large part to the many competing interests involved in a design. For example, the designer is challenged with increasing the product performance while continually reducing the form factor. The reliability engineer may raise concerns about design risks, but without the ability to quantify the potential impact, they are often unable to meaningfully influence the design decisions. Implementing a newly developed reliability prediction analysis tool, Sherlock, will forever change this equation. Before a single product is built, this valuable new tool enables the engineer to import the design files...

Low voltage modular circuit breakers: FEM employment for modelling of arc chambers

Bulletin of the Polish Academy of Sciences, Technical Sciences 68(1):61-70, 2020

FEM (finite element method) is an essential and powerful numerical method that can explicitly optimize the design process of electrical devices. In this paper, the employment of FEM tools such as SolidWorks, COMSOL and ANSYS is proposed in order to aid electrical apparatuses engineering and modeling-those are arc chambers of modular circuit breakers. Procured models of arc chambers have been undergoing simulations concerning heating, electric potential distribution, electric charge velocity and traverse paths. The data acquired has been juxta-positioned against experimental data procured in the Short-Circuit Laboratory, Warsaw University of Technology. The reflection of the theoretical approach was clearly noted in the experimental results. Mutual areas of the modeled element expressed the same physical properties and robustness errors when tested under specific conditions-faithfully reflecting those which were experimented with. Moreover, the physical phenomena essential for electrical engineering could be determined already at the model stage. This procedure proved highly valuable during designing/engineering work in terms of material economy.