Circuit bending, breaking and mending (original) (raw)

Circuit-Bending: A Micro History Introduction to topic of discussion

2017

The topic of this discussion is to collect and analyse the evidence for Circuit-Bending as a legitimate form of art and its place in the musicological canon. Further, there will be a short examination on potential and current applications of this tool outside of the field of music and art. Circuit-Bending in and of itself is not a musical genre or sub-genre; rather it is a way of creating and building your own instrument by repurposing and augmenting electronic objects such as toys.

Developing design rules to avert cracking and debonding in integrated circuit structures

2000

In an integrated circuit, stresses come from many sources (eg, differential thermal expansion and electromigration). The circuit structures are never perfect, possibly containing crack-like flaws. The stresses may drive the pre-existing cracks to grow and cause circuit failure. We explore a fracture mechanics approach to formulate design rules to avert crack growth. We adopt a strategy based on two attributes of integrated circuits.

Topological Synthesis of Planar Metamorphic Mechanisms for Low-Voltage Circuit Breakers

This article presents a systematic graph theory-based method for the topological synthesis of planar metamorphic mechanisms including metamorphic transformations of links and changes in the degrees-of-freedom. The parts to move, with input and output motion defined, and the topological design space, are represented by graphs of simplejointed mechanisms. The topological requirements involving link transformations are expressed in terms of subgraphs with a given degrees-of-freedom containing prescribed input and output parts. The algorithm executes two subgraph searches inside atlases of mechanisms with different degrees-of-freedom. An application to the design of a family of low-voltage circuit-breaker mechanisms is shown.

Bending machine for testing reliability of flexible electronics

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2017

A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowing reliability prediction models to be developed. Four sets of test samples with different combinations of substrate, routing, interconnect technology and components were examined. A poor level of reliability was observed when using anisotropic conductive paste to form interconnects, whereas a significantly higher level of reliability was observed when using a bismuth-tin solder paste. The assembly of larger components resulted in shortened time to failure, whereas increasing the bending radius prolonged the observed lifetimes.

Automated Design Analysis : Comprehensive Modeling of Circuit Card Assemblies

2011

It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the product development cycle is extremely costly. The worst case situation is discovering design problems after failures occur in the field. Designing for reliability has been “easier said than done” due in large part to the many competing interests involved in a design. For example, the designer is challenged with increasing the product performance while continually reducing the form factor. The reliability engineer may raise concerns about design risks, but without the ability to quantify the potential impact, they are often unable to meaningfully influence the design decisions. Implementing a newly developed reliability prediction analysis tool, Sherlock, will forever change this equation. Before a single product is built, this valuable new tool enables the engineer to import the design files...

Low voltage modular circuit breakers: FEM employment for modelling of arc chambers

Bulletin of the Polish Academy of Sciences, Technical Sciences 68(1):61-70, 2020

FEM (finite element method) is an essential and powerful numerical method that can explicitly optimize the design process of electrical devices. In this paper, the employment of FEM tools such as SolidWorks, COMSOL and ANSYS is proposed in order to aid electrical apparatuses engineering and modeling-those are arc chambers of modular circuit breakers. Procured models of arc chambers have been undergoing simulations concerning heating, electric potential distribution, electric charge velocity and traverse paths. The data acquired has been juxta-positioned against experimental data procured in the Short-Circuit Laboratory, Warsaw University of Technology. The reflection of the theoretical approach was clearly noted in the experimental results. Mutual areas of the modeled element expressed the same physical properties and robustness errors when tested under specific conditions-faithfully reflecting those which were experimented with. Moreover, the physical phenomena essential for electrical engineering could be determined already at the model stage. This procedure proved highly valuable during designing/engineering work in terms of material economy.

Predicting Deformation and Strain Behavior in Circuit Board Bend Testing

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Circuit-bending and sustainability transitions. Exploring ways of re- thinking and re-using technologies

Article in press. Please cite as: Cagol, M., Dodman, M. (2015) Circuit-bending and sustainability transitions. Exploring ways of rethinking and re-using technologies. Abstract. This paper examines the relationship between circuit-bending-a form of adjustment of technological artifacts involving the modification of circuits in electronic devices-and sustainability. Sustainability is considered in terms of the wider context of socio-cultural and technological change and a necessary shift in patterns of human behavior related to harnessing creativity and innovation. It is argued that from both educational and environmental perspectives circuit-bending offers examples of rethinking and re-using processes and products that are typical of human activity and which can be used to support a sustainability transition.

RECENT TRENDS IN COMPUTER ADIED FIXTURE DESIGN: REVIEW ON APPROACHES

The smart consumer demands for quality product along with the variety, so to cope up with this demand we need a smart market too, having quality and variety as its key factors. For effective respond to this demand we need efficient flexible manufacturing methods, which will let us to gain fast product development. According to studies, fixtures play a very vital role in product manufacturing quality, productivity and cost of the product. Hence designing a fixture according to requirements of the process is very crucial work. This paper is a review of literature survey about Computer Adied Fixture Design and its approaches. It includes the basic importance of fixture and appropriate fixturing techniques, also the design consideration and requirements that are the non negligible factor while fixture designing. It deals with how proper fixture and fixturing techniques are directly proportional to the problem free machining.

Crafting technology with circuit stickers

Proceedings of the 14th International Conference on Interaction Design and Children, 2015

Chibitronics circuit stickers are a new toolkit for crafting with electronics. Circuit stickers are modular, flexible circuit components with conductive adhesive pads. They feel like stickers but behave like electronic units and can be stuck to any conductive connector, such as copper foil tape, conductive ink or conductive thread, to make circuits. The toolkit includes, LEDs, sensors, pre-programmed function generators and a programmable microcontroller. Along with the circuit stickers, we have also created a suite of educational support resources such as the Circuit Sticker Sketchbook, which contains lessons and activities for crafting circuits onto templates inside the book. In this paper we describe the design and initial public adoption of the Chibitronics circuit sticker toolkit.

INTELLIGENT FABRICATION -DIGITAL BRIDGES

2017

Students of the Ecole nationale supérieure d'architecture de Versailles participated in the workshop 'Intelligent Fabrication – Digital Bridges' where they investigated bridge designs using parametric simulation tools and numerical fabrication techniques. Working in the environment of CAD software (Rhino), extended with parametric plug-ins (Grasshopper and Karamba) the workshop focused on combining complex parametric modelling techniques with FEM simulation. Students developed an intuitive design approach through the analysis of digital and physical models. This paper explains the processes and outcomes of the two week workshop where three designs were constructed at 1:1 and others at 1:5 and 1:10. The proposals displayed a broad range of design and structural concepts, with some investigating topological and geometric optimization and others, the process of fabrication using 3d printing and laser-cutting. Fig. 1. Bridge designs developed over the two week workshop

An application of physical methods to the computer aided design of electronic circuits

Journal de Physique Lettres

2014 Certaines méthodes et algorithmes utilisés dans les simulations de phénomènes physiques sont appliqués à la conception automatisée des circuits intégrés ou imprimés. Des exemples de résultats obtenus à l'aide de ces algorithmes sont présentés. Ils montrent que l'arrangement des composants et des connexions d'un circuit intégré peut être considéré comme le passage d'un état désordonné à un état partiellement ordonné ; cette comparaison conduit à une méthode efficace qui permet d'obtenir un placement optimum des composants et un tracé des connexions. Abstract 2014 Methods and algorithms used in simulations of physical phenomena are applied to the automated design of integrated or printed circuits. Representative results, obtained by these algorithms, are presented. They show that the design of the layout of an integrated circuit may be viewed as a transition from a disordered state to a partially ordered state; this comparison leads to an efficient method allowing an optimum placement of the components and a routing of the connections.

Flexible, durable printed electrical circuits

Journal of the Textile Institute, 2009

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Advances in Architectural Geometry 2015 - Force Adaptive Hot-Wire Cutting: Integrated Design, Simulation, and Fabrication of Double-Curved Surface Geometries

This paper discusses a robotic cutting technique-Spatial Wire Cutting (SWC)-performed by the coordinated movement of two six-axis robotic arms which control the curvature of a hot-wire adopting itself against the resistance of the processed material. By escaping from the linearity of the cutting medium, combined with an integrated approach towards computational design, simulation and automated fabrication, this technique fosters the efficient manufacturing of double-curved surface objects by single cutting procedures and significantly expands the set of possible hot-wire cutting geometries. This paper presents a custom fabrication-informed computational design and simulation framework. It also outlines comparative analytical studies between digitally created SWC objects and their physically fabricated counterparts. Finally, it concludes with the architectural potentials of the discussed technique.

A new concept in post-arc analysis applied to power circuit-breakers

IEEE Transactions on Power Delivery, 1988

T h i s paper r e p o r t s on a new computera i d e d t e c h n i q u e t h a t p r o v i d e s an adequate model of t h e p o s t -a r c r e s i s t a n c e of c i r c u i t b r e a k e r s . It i s based mainly on p r e c i s e measurement of p o s t -a r c c u r r e n t and a p p r o p r i a t e r e p r e s e n t a t i o n of a r c r e s i s t a n c e u s i n g a modified Mayr model where t h e p a r a m e t e r s a r e e v a l u a t e d from t e s t d a t a by means of d e d i c a t e d computer s o f tware. S u c c e s s f u l l y used t o p r e d i c t f a i l u r e s d u r i n g t h e thermal-recovery p e r i o d on f u l l -s i z e d 200-kV a i r -b l a s t and SF6 c i r c u i t b r e a k e r s , t h i s new t e c h n i q u e promises t o p r o v i d e v a l u a b l e a s s i s t a n c e i n c i r c u i t -b r e a k e r development.

Petri Seppänen Application Independent Finite Element Analysis in Digital Design Thesis submitted in partial fulfillment of the requirements for the degree of Master of Science in Technology Espoo , January 23 , 2012

2012

This thesis is conducted as a part of a larger research project "Silicom" in the Aalto University School of Engineering. The project is sponsored by Tekes (the Finnish Funding Agency for Technology and Innovation), as the part of the Tekes Digital product process program and industrial partners. Great thanks to Janne "the XP coach" Ojala. He has guided me to understand extreme programming and software development. He taught directly, rolled up his sleeves and taught by doing, suggested changes in how a practice is implemented, offered ideas to solve a thorny technical problem, and served as an intermediary between the team and other management. Thanks also to Jari Juhanko, Petri Makkonen, Kaur Jaakma, Antti Valkonen and Andrea Buda. Special thanks to Tero, Mikko, Mika, Timo and Kirsi. I am grateful to Pekka, who gave me an opportunity to work at Aalto University (formerly the Helsinki University of Technology). I also thank Hanna and Tero for checking the spelling. Thanks also to CSC from software support and offering CAE programs for this thesis. The master thesis is dedicated to my mom Mervi and to my departed dad Pekka. "Programming CAE program to recognize model geometry is like teaching a blind one to paint the Mona Lisa"