Adhesion between PMMA mask layer and silicon wafer in KOH aqueous solution (original) (raw)

Materials and Device Characterization in Micromachining, 1998

Abstract

The adhesion of PMMA layers on silicon wafer has been studied in order to protect the front side of the silicon wafer while etching the backside in KOH aqueous solution. Pre and post-bake treatment have been performed, different primers have been used to optimise the superficial and interfacial tension of both mask layer and substrate. An adherent layer has been obtained and its behaviour has been explained based on the polar and nonpolar interactions across the interface. Keywords: PMMA, silicon, KOH, work of adhesion, surface energy, interfacial tension, superficial tension, contact angle.

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