Direct Cathodic Deposition of Copper on Steel Wires from Pyrophosphate Baths (original) (raw)
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Effect of temperature on the electrodeposition of disperse copper deposits
Journal of the Serbian Chemical Society, 2007
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plateau of the limiting diffusion current density and higher was examined by the determination of the average current efficiency of hydrogen evolution and by scanning electron microscopic (SEM) analysis of the morphology of the formed copper deposits. Increasing the temperature of the solution led to a shift of both the beginning and the end of the plateau of the limiting diffusion current density towards lower electrodeposition overpotentials. Also, higher temperatures led to the formation of morphological forms of copper deposits characteristic for electrodeposition of copper at some higher overpotentials. The unexpected trend in the development of copper structures electrodeposited at an overpotential of 800 mV is discussed in terms of the effect of temperature on the viscosity and surface tension of the electroplating solution.
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Applied Surface Science, 2020
Currently, the use of smart surfaces in the industries is well developed due to enhanced durability and qualification of fabricated layers as well as the increased values of products. Herein, the hydrophobic copper and cuprite surfaces were fabricated via the electrodeposition at various bath temperatures ranging from 15 to 90 °C by galvanostatic and cyclic voltammetry approaches. The layers were grown in the Cu2O (111) and Cu (002) directions in the galvanostatic and cyclic voltammetry methods, respectively which are in agreement with the SEM images of surface crystals. In fact, in the galvanostatic samples, triangles and octahedral pyramids were formed in the size of 100 to 600 nm while the 1 to 6 µm crystals with flat facets were formed using the cyclic voltammetry. In general, the size and swelling of the crystals are increased by raising the bath temperature. Actually, the higher hydrophobicity was observed in the prepared sample at 75 °C using cyclic voltammetry where the water droplet adhered to the surface (parahydrophobic) with a large contact angle (θW = 147º). This sample was also converted to superhydrophobic with a small sliding angle (θSA < 3º) after one year rest in a sealed glass box.
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Antipathogenic copper coatings: electrodeposition process and microstructure analysis
Archives of Civil and Mechanical Engineering
Copper coatings are an important group of decorative-protective materials characterised by high corrosion resistance, excellent thermal and electrical conductivity, which lately gained more significance due to their antimicrobial activity. The main aim of the presented research was to electrodeposit homogenous copper coatings from the non-cyanide electrolyte solution in galvanostatic conditions on steel (1.4024) and nickel (Ni201) substrates, commercially used for surgical instruments. The effect of substrate finishes used in the production line, by shot peening with glass balls, corundum treatment and brushing on the coatings surface formation, was investigated. The substrates’ and coatings’ microstructural properties were analyzed by scanning and transmission electron microscopy, atomic force microscopy, and X-ray diffraction analysis. The current efficiency of the copper reduction on nickel and steel substrates was found to be above 95%. The copper layers adhere to both substrate...
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