Modeling of solder joint failure due to PCB bending during drop impact (original) (raw)

Modeling of solder joint failure due to PCB bending during drop impact

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

Abstract

Abstract Reliability of IC packages during drop impact is critical for portable electronic products. These packages are susceptible to solder joint failure when induced by mechanical shock and printed circuit board (PCB) bending during impact. Normally, portable products ...

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