Finite-Thickness Conductor Models for Full-Wave Analysis of Interconnects With a Fast Integral Equation Method (original) (raw)

Electromagnetic Modeling of Electronic Device by Electrical Circuit Parameters

2016

─ This article proposes an electric model to determine the values of the electric fields of an electronic device. When applying the method, the integrated circuit device will be modeled on the resistance, inductance and capacitance values (R, L, C parameters) provided by the IBIS (Input/Output Buffer Information Specification), also considering the internal activity of the integrated circuit. The electric parameters of the printed circuit board tracks will be extracted by software based on the moments method and fast multipole method. Simulations of the electric model are performed in the time and frequency domain by the Fourier transform, and from the obtained harmonics, the values of the electric fields are calculated with software based on the finite elements method. Measurements were performed in order to validate the simulations. Index Terms ─ Electrical circuit parameters, electromagnetic modeling, electronic device, IBIS model, internal activity.

Models for integrated components coupled with their EM environment

Compel-the International Journal for Computation and Mathematics in Electrical and Electronic Engineering, 2008

Purpose -The main aim of the research is the modelling of the interaction of on-chip components with their electromagnetic environment. Design/methodology/approach -The integrated circuit is decomposed in passive and active components interconnected by means of terminals and connectors which represent intentional and parasitic couplings of capacitive and inductive nature. Reduced order models are extracted independently for each component. For the first time, the concept of magnetic terminals was used to describe interactions in RF integrated circuits. These EM "hooks" are defined in mathematical terms, as proper boundary conditions. Findings -The paper shows that one of the main theoretical problems encountered in the modelling of RF components is the difficulty to define a unique terminal voltage, independent of the integration path (this independence being a condition to allow the connection of the component in an electric circuit, where the voltage does not depend of the path shape). The concept of electromagnetic circuit element that allows the interconnection between IC models is proposed as solution for this drawback. The system is described either with EM field models, or by electric/magnetic circuits. By using new concept of hooks, the EM interaction is described effectively with a reduced number of quantities.

Electromagnetic interconnects and passives modeling: software implementation issues

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2002

This is the second paper in a series on the simulation of on-chip high-frequency effects. A computer-aided approach in three dimensions is advocated, describing high-frequency effects such as current redistribution due to the skin-effect or eddy currents and the occurrence of slow-wave modes. The electromagnetic environment is described by an electric scalar potential and a magnetic vector potential as well as a ghost field. The latter one guarantees a stable numerical implementation. This paper deals with the software implementation, the treatment of interfaces and domain boundaries, scaling considerations, numbering schemes, and solver requirements. Some illustrative examples are shown.

Parametric modeling of integrated circuit interconnections

IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing, 1992

This paper presents a parametric approach to the modeling and characterization of high frequency losses and dispersive propagation on integrated-circuit (IC) interconnections. An autoregressive movingaverage (ARMA) model is based on a lumped equivalent circuit of a lossy microstrip transmission line. Model parameters are estimated from on-wafer time-domain measurements using a weighted least squares OyU) algorithm and an Elmore delay approximation technique. It is shown that the effective microstrip permittivity can be evaluated from the estimated ARMA model parameters. Experimental results are compared with computer simulations of the lumped equivalent circuit and ARMA parametric models.

Strategy for electromagnetic interconnect modeling

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2001

In order to design on-chip interconnect structures in a flexible way, a computer-aided design approach is advocated in three dimensions, describing high-frequency effects such as current redistribution due to the skin effect or eddy currents and the occurrence of slow-wave modes. The electromagnetic environment is described by a scalar electric potential and a magnetic vector potential. These potentials are not uniquely defined and in order to obtain a consistent discretization scheme, a gauge transformation field is introduced. The displacement current is taken into account to describe current redistribution and a small-signal analysis solution scheme is proposed based upon existing techniques for fields in semiconductors.

Electromagnetic modelling and simulation of multiconductor interconnect networks with inhomogeneous cylindrical substrate

IEE Proceedings - Microwaves, Antennas and Propagation, 1997

A new and efficient technique is presented for modelling and simulation of interconnect networks which include multiconductor microstrip transmission lines (MMTL) with inhomogeneous cylindrical substrates. The potential and field distributions in the cross section of the MMTL are calculated by solving a set of series equations using Galerkin's method. The charge distribution on the conductors, maxwellian capacitance matrix per unit length, and the modal characteristic impedances of the MMTL are determined. Results obtained have been compared for various types of microstrip lines with those obtained in the literature; good agreement has been found. 1 Introduction The design and characterisation of electronic packages and chips, multichip modules, and printed circuit boards have received considerable attention in recent years [1, 21. The multiconductor microstrip transmission line (MMTL) components constitute basic building blocks in more complex microwave integrated circuits, communication systems, and high-speed VLSI interconnections. By taking advantage of the cylindrical configuration, applications can be found which include using flexible dielectric material in the design of transition adaptors, baluns, filters, and impedance transformers [3, 41. Solution methods have been reported in the literature for obtaining the parameters

The finite-element method for modeling circuits and interconnects for electronic packaging

IEEE Transactions on Microwave Theory and Techniques, 1997

A full-wave finite-element method (FEM) is formulated and applied in the analysis of practical electronic packaging circuits and interconnects. The method is used to calculate S-parameters of unshielded microwave components such as patch antennas, filters, spiral inductors, bridges, bond wires, and microstrip transitions through a via. Although only representative microwave passive circuits and interconnects are analyzed in this paper, the underlined formulation is applicable to structures of arbitrary geometrical complexities including microstrip and coplanar-waveguide transitions, multiple conducting vias and solder bumps, multiple striplines, and multilayer substrates. The accuracy of the finite-element formulation is extensively verified by calculating the respective S-parameters and comparing them with results obtained using the finite-difference time-domain (FDTD) method. Computational statistics for both methods are also discussed.

Computational electromagnetic methods for interconnects and small structures

Superlattices and Microstructures, 2000

The continual advances in speed and integration scale of electronic circuits have created enormous demands for high-speed, high-density packages which ensure reduced interconnection delays and improved electrical performance. Such structures usually involve a large number of planar transmission lines at various levels within the package, whereas the geometrical orientation of these lines is not necessarily uniform. Also, the existence of multiple dielectric layers, discontinuities, bends, and wire bounds adds considerable complexity to the package. It is therefore essential that full-wave computational electromagnetic (CEM) techniques, such as the finite element method (FEM) and the finite-difference time-domain (FDTD) method, be developed and used to accurately model the electrical performance of these devices and circuits.

Electrical Modeling of Interconnections in Multilayer Packaging Structures

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987

An effort toward modeling the interconnections in selected typical multilayer packaging structures is presented. The modeling is based on a quasi-static approximation to the associated electromagnetic problems. A program for computing capacitance and inductance matrices and the numerical techniques used to improve the program efficiency are described. The results of numerical testing of the program are provided and discussed. The program was also compared with experimental data published in the open literature and the results are shown. The agreement between the model and the experiments is satisfactory.

Proximity templates for modeling of skin and proximity effects on packages and high frequency interconnect

2002

Abstract Modeling the exponentially varying current distributions in conductor interiors associated with high frequency interconnect behavior causes a rapid increase in the computation time and memory required even by recently developed fast electromagnetic analysis programs. In this paper we describe a procedure to generate numerically a set of basis functions which efficiently represent conductor current variation, and thus improving solver efficiency.