Lead‐free solder process implementation for PCB assembly (original) (raw)

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

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2007

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Lead-free soldering processes in the electronic industry: industrial implementation at SMES

Rogerio Colaco

2007

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Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

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1996 Proceedings 46th Electronic Components and Technology Conference

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Development and characterization of lead-free Solders

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Paul Vianco

2000

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QUALITY AND RELIABILITY TESTING OF CIRCUIT BOARDS ASSEMBLED WITH LEAD FREE COMPONENTS, FINISHES, SOLDERING MATERIALS AND PROCESSES IN SIMULATED PRODUCTION CONDITIONS

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Neum , B & H , 04-07 June 2009 QUALITY REQUIREMENTS IN LEAD-FREE SOLDERS IMPLEMENTATION IN ELECTRONICS

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2009

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Reliability of solder joints assembled with lead-free solder

Andrzej Mania

2002

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Lead‐free Solder Pastes Evaluation at Motorola Transmission Products Division

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Soldering & Surface Mount Technology, 1995

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Lead-Free Soldering

Ning-Cheng Lee

Springer eBooks, 2016

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Solderability of lead-free surface finished PCB

Frantisek Steiner

2007 30th International Spring Seminar on Electronics Technology (ISSE), 2007

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Printed circuit boards for lead‐free soldering: materials and failure mechanisms

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Lead Free Soldering on Contact Pads

Nikola Stefanov

2005

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Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Tae-Kyu Lee, Hong-Tao Ma

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013

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J. Vrestal

Journal of Mining and Metallurgy, Section B: Metallurgy, 2007

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A novel lead-free solder replacement

Ning-Cheng Lee

1994

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Novel Testing Instrument for Lead-Free Solder Characterization

Davide Di Maio

IEEE Transactions on Instrumentation and Measurement, 2011

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Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study

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Investigation of Wettability of Lead Free-Solder on Bare Copper and Organic Solder Preservatives Surface Finishes

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International Journal of Materials Science and Applications, 2015

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Reliability of lead (Pb) free SAC solder interconnects with different PWB surface finishes under mechanical loading

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Performance of lead-free solder joints under dynamic mechanical loading

Dongkai Shangguan

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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ADVANCES IN LEAD-FREE SOLDERS

IAEME Publication

IAEME, 2019

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Results of comparative reliability tests on lead-free solder alloys

Günter Grossmann

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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Impact of board and component metallizations on microstructure and reliability of lead-free solder joints

Polina Snugovsky

Microelectronics Reliability, 2007

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Structural Assessment of Lead Free Solder Joint of Miniaturized Electronics Assembly

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International Journal of Integrated Engineering

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Characterisation of lead-free solder pastes for low cost flip-chip bumping

Ndy Ekere

2002

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Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

Michael Pecht

IEEE Transactions on Electronics Packaging Manufacturing, 2000

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Introductory Chapter: Overview of Pb-Free Solders and Effect of Multilayered Thin Film of Sn on the Lead-Free Solder Joint Interface

Monalisa Char

Lead Free Solders, 2019

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Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

C.Y. Khor

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Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled at Various Tin–Lead Soldering Process Conditions

Jennifer Nguyen

IEEE Transactions on Electronics Packaging Manufacturing, 2000

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Influence of intermetallic compounds growth on properties of lead-free solder joints

Frantisek Steiner

2012 35th International Spring Seminar on Electronics Technology, 2012

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Aspects of the structural evolution of lead-free solder joints

Lubov Zavalij

JOM, 2002

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Understanding the process window for printing lead-free solder pastes

Rajkumar a/l Durairaj

IEEE Transactions on Electronics Packaging Manufacturing, 2001

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Lead-Free Wave Soldering

Quyên Lương Chu

Lead-Free Solder Process Development, 2011

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