Numerical tools to investigate the AMCs cross-contamination between wafers and FOUPs: transient analysis of mass transfer (original) (raw)

Abstract

This work investigates the mass transfer of the Airborne Molecular cross Contamination (AMCs) between the Front Opening Uni ed Pod (FOUP) and wafer (silicon substrates) during the microelectronics devices manufacturing. Such crosscontamination phenomena lead to detrimental impact on production yield in microelectronic industry and a predictive approach using modeling and computational methods is a very strong way to understand and qualify the AMCs cross contamination processes. The FOUP is made of polymeric materials and it is considered as a heterogeneous porous medium, thus the modeled processes are the contamination of two-component in transient ow under isothermal conditions. The present methodology is, rst using the optimization methods with the analytical solution in order to de ne the physical constants of various materials which have been studied experimentally and separately, and the second using the nite element method including these physical constants and relevant interf...

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