Modeling of the Thermal Behavior of a Power Electronic Module (original) (raw)

Abstract

This work presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an Integrated Power Electronics Module (IPEM). This model is based on the expanded Lumped Thermal Capacitance Method (LTCM), in which the number of variables involved in the analysis of heat transfer is reduced only to time. By applying this procedure a simple, non-spatial, but highly non-linear model is obtained. Transient results of the model were validated using FLOTHERM 3.1 TM , a thermal analysis software tool. Two experimental setup , for low-and high-speed thermal response, were developed. Comparisons between thermal model results and experimental data are also presented to demonstrate the need to obtain the electrical performance and to make the electrothermal coupling. The development of this model presents an alternative to reduce the complexity level developed in commercial multidimensional and transient thermal analysis software tools.

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