Performance Comparison of Mini-Rectangular Fin Heat Sinks Using Different Coolants: Supercritical CO2, Water and Al2O3/H2O Nanofluid (original) (raw)
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Heat transfer of nanofluids in the mini-rectangular fin heat sinks
International Communications in Heat and Mass Transfer, 2013
In the present study, the heat transfer characteristics of nanofluids cooling in the mini-rectangular fin heat sink are studied. The heat sinks with three different channel heights are fabricated from the aluminum by the wire electrical discharge machine with the length, width and base thickness of 110, 60, and 2 mm, respectively. The nanofluids are the mixture of de-ionized water and nanoscale TiO 2 particles. The results obtained from the nanofluids cooling in mini-rectangular fin heat sink are compared with those from the de-ionized water cooling method. Effects of the inlet temperature of nanofluids, nanofluid Reynolds number, and heat flux on the heat transfer characteristics of mini-rectangular fin heat sink are considered. It is found that average heat transfer rates for nanofluids as coolant are higher than those for the de-ionized water as coolant. The results of this study are of technological importance for the efficient design of cooling systems of electronic devices to enhance cooling performance.
International Communications in Heat and Mass Transfer, 2013
For improvement in information technology (IT), removing heat from electrical devices is an important factor, and current activities try to investigate (numerically, experimentally) new methods of thermal load managing. Mini-channel liquid cooling is one of the candidates for this purpose. Nanofluid as an innovative heat-transfer fluid was used in mini-channel heat sink. Modeling analyzed in this study is a mini-channel heat sink with 20 × 20 mm bottom. For this purpose, five nanoparticle volume fractions namely 0.8, 1.6, 2.4, 3.2 and 4% in five inlet velocities for both types of nanoparticle containing TiO 2 and SiC were used. Furthermore, effect of a nanoparticle volume fraction on the convective heat transfer coefficient was investigated in different Reynolds numbers. Modeling results were compared with reference analytical calculations. In addition according to the modeling results, correlated equations were obtained for Nusselt number and friction factor, and its accuracies were acceptable.
Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing
For effective thermal management of high heat generating microprocessors, five different heat sinks with fin spacings of 0.2 mm, 0.5 mm, 1.0 mm, and 1.5 mm along with a flat plate heat sink were investigated. Microprocessor heat was simulated by a heated copper block with water as a coolant. At a heater power of 325 W, the lowest heat sink base temperature of 40.5 C was achieved by using a heat sink of 0.2 mm fin spacing which was about 9% lower than the best reported base temperature of 44 C using a nanofluid with commercial heat sink in the open literature. The base temperature and thermal resistance of the heat sinks were found to drop by decreasing the fin spacing and by increasing volumetric flow rate of water circulating through the heat sink. For a flat plate heat sink, the maximum thermal resistance was 0.216 K/W that was reduced to as little as 0.03 K/W by using a heat sink of 0.2 mm fin spacing. The overall heat transfer coefficient was found to be 1297 W/m2 K and 2156 W/m2 K for the case of a flat plat and 0.2 mm fin spacing heat sinks, respectively, the latter showed about two-folds enhancement compared to the former.
Experimental Evaluation of Nanofluid for Improved Cooling Efficiency in an AL Mini Channel Heat Sink
International Journal for Research in Applied Science & Engineering Technology (IJRASET), 2022
Efficient heat transfer has become major need these days. In this thesis, both experimental and CFD investigations have to be carried out to evaluate the cooling performance of a mini-channel consisting of fins on upper surface of flat plate. Nano fluids contain a small fraction of solid nano particles in base fluids flowing through groves in bottom plate attached with heater at base. Nano fluids cools small channel heat sinks, have been anticipated to be an excellent heat dissipation method for the next generation electronic devices. Computational Fluid Dynamics (CFD) simulations is to be carried out to study the heat sinks heat transfer mechanism. The sectional geometry of channels affects the flow and heat transfer characteristics of mini channel heat sinks. The heat transfer principle states that maximum heat transfer is achieved in mini channels with minimum pressure drop across it. In this research work the experimental and numerical investigation for the improved heat transfer characteristics of mini channel heat sink using Al2O3/water nano with (1 and 2 % volume fraction) fluid is to be done. The fluid flow characteristics are also analysed for the serpentine shaped mini channel. Heating element of 130 W capacities is to be used to heat up the heating element of base plate.
International Journal of Advance Research, Ideas and Innovations in Technology, 2019
Due to the reduction in the size of the electronic components, heat dissipation has become a major problem. In many cases, air cooling has failed to provide the required demands. The invention of nanofluid has promised to increase the efficiency of the liquid cooling system. The addition of solid nanoparticles to the liquid actually increases the thermal conductivity of the liquid because of the higher thermal conductivity of the solid particles. In this work, the thermal performance of a minichannel heat sink was analyzed using CFD for cooling of processor chipset using nanofluids instead of pure water. The effect of different mass flow rates and various volume concentrations of nanoparticles on the overall thermal performance are also analyzed. The Alumina and graphene water nanofluids are used as coolants with volume concentrations of 0.1, 0.15 and 0.2%. The cooling fluid is made to flow through an Aluminium mini channel with height 5mm and width 1mm respectively. The maximum allowable temperature that has to be maintained at the chip is below 50oC. By using the liquid cooling system with a heat sink, this temperature is reduced as low as 41.22oC. There is also an enhancement of the convective heat transfer coefficient in using graphene nanofluids when compared to alumina nanofluids. The thermal resistance of the heat sink with nanofluids is lesser than pure water.
Applied Thermal Engineering, 2021
The hydraulic and thermal performance of microchannel heat sink configurations for high performance electronic cooling applications is investigated by numerical modelling. Conjugate heat transfer simulations are obtained through the silicon walls and the fluid domain of a square base prism heat sink traversed by 50 parallel rectangular cooling ducts, under a 150 W/cm 2 constant heat flux input through the base. Al2O3 nanofluid coolant with a nanoparticle volume fraction ranging from 0 to 3% is supplied at 298 K, over the Reynolds number range 100 to 350, modelled as a single-phase homogeneous medium. Rectangular, twisted, and zigzag fins are inserted into the plain rectangular duct to enhance the heat transfer rate. The zigzag fin and 3% Al2O3 nanofluid provide the best thermal performance, with a 6.44 K lower average heated wall contact temperature, 60% higher Nusselt number, and 15% higher second law efficiency than without fins and plain water cooling. Twist in the microchannel fin unexpectedly reduced the microchannel pressure drop by 2% to 15% compared to a straight fin, possibly due to the more evenly distributed axial mass flux across the microchannel.
Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling
Energies, 2021
Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base...
Optimization of nanofluid-cooled microchannel heat sink
Thermal Science, 2013
The optimization of a nanofluid-cooled rectangular microchannel heat sink is reported. Two nanofluids with volume fraction of 1 %, 3 %, 5 %, 7 % and 9 % are employed to enhance the overall performance of the system. An optimization scheme is applied consisting of a systematic thermal resistance model as an analysis method and the elitist non-dominated sorting genetic algorithm (NSGA-II). The optimized results showed that the increase in the particles volume fraction results in a decrease in the total thermal resistance and an increase in the pumping power. For volume fractions of 1 %, 3 %, 5 %, 7 % and 9 %, the thermal resistances were 0.072, 0.07151, 0.07075, 0.07024 and 0.070 [ o K W -1 ] for the SiC-H 2 O while, they were 0.0705, 0.0697, 0.0694, 0.0692 and 0.069 [ o K W -1 ] for the TiO 2 -H 2 O. The associated pumping power were 0.633, 0.638, 0.704, 0.757 and 0.807 [W] for the SiC-H 2 O while they were 0. 645, 0.675, 0.724, 0.755 and 0.798 [W] for the TiO 2 -H 2 O. In addition, for the same operating conditions, the nanofluid-cooled system outperformed the water-cooled system in terms of the total thermal resistance (0.069 and 0.11 for nanofluid-cooled and water-cooled systems, respectively). Based on the results observed in this study, nanofluids should be considered as the future coolant for electronic devices cooling systems.
Investigation of flow and heat transfer characteristics in micro pin fin heat sink with nanofluid
I studied the effect of using nanofluid in micro pin fin heat sink. Two nanofluids have been studied (diamond-water and Al 2 O 3-water). Three fins shapes (square, triangular and circular) and unfinned heat sink. Results show that nanofluid increase the thermal performance and pressure drop. The circular fins give higher heat transfer rate compared with other fins. a b s t r a c t In this paper a micro pin fin heat sink is numerically investigated with three fins geometries (square, triangular and circular) in addition to the unfinned microchannel heat sink. Nanofluid is used as a cooling fluid, since the flow and heat transfer have been studied with two types of nanofluids (Diamond-water and Al 2 O3-water) in addition to the pure water. The volumetric concentration of selected nanofluids has been chosen in range (1e4)%. The comparison of hydrodynamic and thermal characteristics of different fin geometries and cooling fluids has been made under the same value of Reynolds number and constant wall temperature thermal boundary condition, the range of Re used is (100e900) to ensure that, the flow remains in the laminar regime. The results obtained indicated that, using of nanofluid instead of pure fluid as a coolant leads to enhanced heat transfer performance by increasing the amount of heat dissipated but it also leads to increased pressure drop for all fins shapes and nanofluids studied.
Study the micro pin fin and micro channel heat sinks with different types of cooling fluids
1st scientific conference in Alyen University, ISCAU2019., 2019
The micro pin fin heat sink (MPFHS) with three shapes (triangular, square and circular) of fins in addition to the microchannel heat sink(MCHS) are numerically investigated, with three types of pure fluids) Water, Oil, Ethylene Glycol), three types of Nanofluids (Al 2 O 3-water, Cu-water, TiO 2-water) and three types of microencapsulated phase change material suspensions (MEPCMS) (RT44-water, paraffin wax water, n-acted-water) .Constant heat flux(100 /) is applied on the base of the heat sink. The volumetric concentrations of Nanofluids and (MEPCMS) are (1%, 3%, and 5%) and (100 to 900) is the range of Reynolds number used in this paper. The results obtained show that using different types of Nanofluids and MEPCM suspensions lead to enhance the cooling performance of (MCHS) and (MPFCHS). The cooling performance in the (MCHS) is less than that for MPFHS. The heat transfer for all concentrations for MEPCMS is higher than that for Nanofluids. Additionally, the pressure drop for MEPCMS and Nanofluids increased for all concentrations. While the pressure drop for all concentrations in the (MCHS) is lower compared with that of (MPFHS).