Amkor Technology, Inc. | LinkedIn (original) (raw)
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Semiconductor Manufacturing
Tempe, Arizona 71,443 followers
Since 1968, Amkor has delivered innovative IC packaging solutions with the service & capacity global customers rely on.
About us
Amkor Technology is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor’s operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor‘s packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Industry
Semiconductor Manufacturing
Company size
10,001+ employees
Headquarters
Tempe, Arizona
Type
Public Company
Founded
1968
Specialties
Semiconductors, IC Test, Wafer Bumping, MEMS & Sensors, Wafer Level Packaging, 3D Packaging, TSV, Flip Chip, Package-on-Package, SiP, Chip-on-Chip, Wafer Test, IC Design, Leadframe, Laminate, WLFO, Semiconductor, CSP, BGA, Power Discretes, dsmbga, advanced packaging, wlcsp, automotive, iot, ai, computing, and memory
Locations
- Primary
2045 East Innovation Circle
Tempe, Arizona 85284, US
Get directions - Shibakoen Front Tower 14F 2-6-3, Shibakoen
Minato City, tokyo 105-0011, JP
Get directions - Valley Point Office Tower
491B River Valley Road #15-02/04
Singapore, 248373, SG
Get directions - Zhangjiang Hi-Tech Park Bldg. E, Chamtime Square 2889 Jinke Road
Rm# 504
Pudong, Shanghai 201203, CN
Get directions - 25 Metro Dr
Suite 700
San Jose, California 95110, US
Get directions - 16795 Von Karman Ave
Suite 260
Irvine, California 92606, US
Get directions - 5465 Morehouse Dr
Suite 210
San Diego, California 92121, US
Get directions - 8140 N Mopac Expy
Suite 150
Austin, Texas 78759, US
Get directions - 105 Central Street
Suite 2300
Stoneham, Massachusetts 02180, US
Get directions - Werner-Eckert Straße
Munich, Bavaria 81829, DE
Get directions - 3F-1, No.1, Tai Yuen 2nd Street
Zhubei City, Hsinchu County 302, TW
Get directions - 150, Songdomirae-ro
Incheon , 21991, KR
Get directions - Avenida Primeiro de Maio, 801
Vila do Conde, 4485-629, PT
Get directions - 15km, Jalan Klang-Banting 42507 Telok Panglima Garang
Kuala Langat, Selangor, MY
Get directions - 39 Guangfu North Road
Hsinchu Industrial Park
Hukou Township, Taiwan 303, TW
Get directions - 333 Longyuan 1st Road
Longtan District, Taoyuan City 325, TW
Get directions - 11 Guangfu Road
Hsinchu Industrial Park
Hukou Township, Hsinchu County 303, TW
Get directions - 1F, No. 1, Kao-Ping Sec
Taoyuan City , Longtan District 325, TW
Get directions - 111, Yinglun Road
Waigaoqiao Free Trade Zone
Pudong, Shanghai 200131, CN
Get directions - 119 North Science Avenue
Laguna Technopark
Binãn, Calabarzon 4024, PH
Get directions - KM 22 East Service Road
Special Economic Zone
Muntinlupa City, Cupang 1771, PH
Get directions - 150, Songdomirae-ro
Yeonsu-gu, Incheon 21991, KR
Get directions - 100, Amkor-ro
Buk-gu, Gwangju 61006, KR
Get directions - 110, Anaji-ro
Gyeyang-gu, Incheon 21107, KR
Get directions
Employees at Amkor Technology, Inc.
Updates
- Amkor Technology, Inc. invites you to join us at NEPCON Japan 2025, from January 22-24 at the Tokyo Big Sight in Tokyo, Japan. We are thrilled to announce that WonChul Do, VP Fellow and Product Development Group Manager, R&D, will present “Achieving Heterogeneous Integration Through Advanced Packaging: From Connected Devices to Data Centers.” This presentation will explore advanced packaging technology, a critical element of system-level innovation in the AI era. Heterogeneous integration through advanced packaging technologies paves the way for high performance, reduced form factors, and energy efficiency in everything from data centers to connected devices. Key packaging technologies, trends, and future prospects will be discussed, along with Amkor’s solutions and global manufacturing strategy.
- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, will issue its financial results for the fourth quarter and full year of 2024 after the close of trading on Monday, February 10, 2025. Amkor management will host a conference call and webcast to review the results on Monday, February 10, 2025, at 5:00 p.m. Eastern Time (ET). To access the live audio webcast and the accompanying slide presentation, visit the Investor Relations section of Amkor’s website, located at ir.amkor.com. An archived webcast replay will be available after the call's completion.
- Amkor Technology, Inc. invites you to the Chiplet Summit 2025, which will take place from January 21 to 23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Vineet Pancholi, Sr Director, Test Technology, will present “Best Practices for Testing 2.5D Chiplet Package Designs.” Vineet will focus on the need for comprehensive test integration throughout development and the continuing significance of system-level testing in manufacturing processes. Learn more about Amkor's IC Test services at https://lnkd.in/eBaAaVs #Amkor #ICTest #SemiconductorIndustry #AdvancedPackaging #SemiconductorManufacturing
- Amkor Technology, Inc. invites you to the Chiplet Summit 2025 from January 21-23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Roger St Amand, CVP of Chiplets/FCBGA BU, will present “Chiplet Packaging Basics.” This presentation will cover the fundamentals of #chiplets and #HeterogeneousIntegration and highlight the high-level process flows of Amkor’s 2.5D, S-SWIFT™, and S-Connect™ package technologies. Learn more about our packaging technologies here https://lnkd.in/gMkqgMF
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71,443 followers
1w Edited
Amkor Technology, Inc. is seeking a highly skilled and motivated Manager, Insurance Risk Management. This role is pivotal in ensuring the company's financial stability and risk management efficiency. The ideal candidate will bring a wealth of experience in risk management and an interest in treasury operations, contributing to the company's strategic goals and operational excellence. For the full job description and to apply, visit https://lnkd.in/gc7qES2C - This week, Amkor Technology, Inc. was honored to welcome Minister of Parliamentary Affairs Pedro Duarte, Prime Minister Luis Montenegro, and Minister of Economy Pedro Reis for their visit to Amkor Portugal. The delegation recognized the significance of Amkor's presence and our contributions to innovation in Portugal. During the visit, we discussed the Portuguese government's support for Amkor's ongoing investments in the country. We deeply value this partnership and commitment to our growth. Visit https://lnkd.in/gz4ndwU to learn more about Amkor Portugal.
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71,443 followers
2w Edited
Amkor Technology, Inc. is hiring for several positions at our US locations. We seek innovative professionals dedicated to customer and company success. For full details and to apply, visit https://lnkd.in/esHiWuYAvailable positions: ▶ Director, Sales ▶ Manager, Customer Service ▶ Manager, Risk, and Treasury Operations ▶ Marketing Communications Analyst ▶ Receptionist ▶ Sr. Manager, Chiplets/FCBGA BU ▶ Sr. Manager, Technical Program ▶ Sr. Staff Engineer, Signal and Power Integrity ▶ Staff Engineer, SAP Security ▶ Vice President, Wafer Services BU#Amkor #Careers #EngineeringJobs #SemiconductorJobs - Amkor Technology, Inc. invites you to the Chiplet Summit 2025, which will take place from January 21 to 23 at the Santa Clara Convention Center in Santa Clara, California. As a proud Bronze sponsor, we are excited to announce that Mike Kelly, our VP of Chiplets/FCBGA Integration, will speak in session E-102, “Best Packaging Methods for Your Application.” This session will feature a distinguished panel of experts in semiconductor packaging, including: ▶ Akshay Singh, VP of Advanced Packaging Technology Development at Micron Technology▶ Craig Bishop, CTO of Deca Technologies▶ Chintan Buch, Senior Member of Technical Staff Packaging at AMD ▶ Kenneth Larsen, Director of Product Management at Synopsys IncRosalia Beica, Field CTO at Rapidus Design Technologies will moderate the discussion. Learn more about the Chiplet Summit here https://chipletsummit.com/ #Amkor #SemiconductorIndustry #Semiconductor #AdvancedPackaging
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Stock
AMKR
January 24, 2025
NASDAQ
20 minutes delay
Open
26.04
Low
25.89
High
26.38
Data from Refinitiv