Burn-in oven (original) (raw)
Burn-in ovens in electronics device fabrication, are designed for dynamic and static burn-in of integrated circuits and other electronic devices, including laser diodes. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations. Operating temperatures can go over 260 °C (500 °F), and can use both single and multiple temperature settings. Burn-in ovens are considered a type of batch oven. Other types of batch ovens are bench/laboratory, reach-in, walk in/truck in, and clean process.
Property | Value |
---|---|
dbo:abstract | Burn-in ovens in electronics device fabrication, are designed for dynamic and static burn-in of integrated circuits and other electronic devices, including laser diodes. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations. Operating temperatures can go over 260 °C (500 °F), and can use both single and multiple temperature settings. Burn-in oven applications can be used in numerous different applications such as high-dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of microprocessors and other semiconductor devices. Burn-in ovens are considered a type of batch oven. Other types of batch ovens are bench/laboratory, reach-in, walk in/truck in, and clean process. One company builds systems designed for burn-in of low power laser diodes up to 1A and high power laser diodes up to 300A. (en) |
dbo:wikiPageID | 9384886 (xsd:integer) |
dbo:wikiPageLength | 1594 (xsd:nonNegativeInteger) |
dbo:wikiPageRevisionID | 1053235359 (xsd:integer) |
dbo:wikiPageWikiLink | dbr:Electronics dbr:Nitrogen dbr:Biasing dbr:Integrated_circuit dbr:Laboratory_oven dbr:Reach-in_oven dbr:Batch_oven dbc:Industrial_ovens dbr:Clean_process_oven dbr:Laser_diode dbr:Semiconductor_device_fabrication dbc:Environmental_testing dbr:Burn-in dbc:Semiconductor_fabrication_equipment dbr:Semiconductor dbr:Microprocessors |
dbp:wikiPageUsesTemplate | dbt:Convert dbt:Portal_bar dbt:Refimprove dbt:Reflist |
dct:subject | dbc:Industrial_ovens dbc:Environmental_testing dbc:Semiconductor_fabrication_equipment |
rdf:type | yago:Appliance102729837 yago:Artifact100021939 yago:Commodity103076708 yago:ConsumerGoods103093574 yago:Durables103257877 yago:HomeAppliance103528263 yago:KitchenAppliance103620052 yago:Object100002684 yago:Oven103862676 yago:PhysicalEntity100001930 yago:WikicatIndustrialOvens yago:Whole100003553 |
rdfs:comment | Burn-in ovens in electronics device fabrication, are designed for dynamic and static burn-in of integrated circuits and other electronic devices, including laser diodes. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations. Operating temperatures can go over 260 °C (500 °F), and can use both single and multiple temperature settings. Burn-in ovens are considered a type of batch oven. Other types of batch ovens are bench/laboratory, reach-in, walk in/truck in, and clean process. (en) |
rdfs:label | Burn-in oven (en) |
owl:sameAs | freebase:Burn-in oven yago-res:Burn-in oven wikidata:Burn-in oven https://global.dbpedia.org/id/4d7Xj |
prov:wasDerivedFrom | wikipedia-en:Burn-in_oven?oldid=1053235359&ns=0 |
foaf:isPrimaryTopicOf | wikipedia-en:Burn-in_oven |
is dbo:wikiPageRedirects of | dbr:Burn-in_ovens |
is dbo:wikiPageWikiLink of | dbr:Burn-in_ovens dbr:Burn-in |
is foaf:primaryTopic of | wikipedia-en:Burn-in_oven |