Wafer fabrication (original) (raw)
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures. These steps are often repeated many hundreds of times, depending on the complexity of the desired circuit and its connections.
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| dbo:abstract | Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures. The main process begins with electrical engineers designing the circuit and defining its functions, and specifying the signals, inputs/outputs and voltages needed. These electrical circuit specifications are entered into electrical circuit design software, such as SPICE, and then imported into circuit layout programs, which are similar to ones used for computer aided design. This is necessary for the layers to be defined for photomask production. The resolution of the circuits increases rapidly with each step in design, as the scale of the circuits at the start of the design process is already being measured in fractions of micrometers. Each step thus increases circuit density for a given area. The silicon wafers start out blank and pure. The circuits are built in layers in clean rooms. First, photoresist patterns are photo-masked in micrometer detail onto the wafers' surface. The wafers are then exposed to short-wave ultraviolet light and the unexposed areas are thus etched away and cleaned. Hot chemical vapors are deposited on to the desired zones and baked in high heat, which permeate the vapors into the desired zones. In some cases, ions, such as O2+ or O+, are implanted in precise patterns and at a specific depth by using RF-driven ion sources. These steps are often repeated many hundreds of times, depending on the complexity of the desired circuit and its connections. New processes to accomplish each of these steps with better resolution and in improved ways emerge every year, with the result of constantly changing technology in the wafer fabrication industry. New technologies result in denser packing of minuscule surface features such as transistors and micro-electro-mechanical systems (MEMS). This increased density continues the trend often cited as Moore's Law. A fab is a common term for where these processes are accomplished. Often the fab is owned by the company that sells the chips, such as Intel, Texas Instruments, or Freescale. A foundry is a fab at which semiconductor chips or wafers are fabricated to order for third party companies that sell the chip, such as fabs owned by Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), GlobalFoundries and Semiconductor Manufacturing International Corporation (SMIC). In 2013 the cost of building the next generation wafer fab was over $10 billion. (en) |
| dbo:thumbnail | wiki-commons:Special:FilePath/CMOS_fabrication_process.svg?width=300 |
| dbo:wikiPageID | 1423383 (xsd:integer) |
| dbo:wikiPageLength | 5860 (xsd:nonNegativeInteger) |
| dbo:wikiPageRevisionID | 1105037559 (xsd:integer) |
| dbo:wikiPageWikiLink | dbr:Electrical_network dbr:United_Microelectronics_Corporation dbr:Voltage dbr:Electrical_engineer dbr:KLA-Tencor dbr:Computer dbr:SPICE dbr:Chemical_vapor_deposition dbr:Clean_room dbr:GlobalFoundries dbr:Applied_Materials dbr:Tokyo_Electron dbr:Transistors dbr:Wafer_(electronics) dbr:ASML_Holding dbr:Dainippon_Screen dbr:Chemical dbr:List_of_MEMS_foundries dbr:Semiconductor_device_fabrication dbr:Semiconductor_fabrication_plant dbr:Photoresist dbr:RCA_clean dbr:Radio_frequency dbr:Heat dbr:Texas_Instruments dbc:Semiconductor_device_fabrication dbr:LED dbr:Lam_Research dbr:Taiwan_Semiconductor_Manufacturing_Company dbr:Moore's_Law dbr:Intel dbr:Microprocessor dbr:Optical_computer dbr:Semiconductor_Manufacturing_International_Corporation dbr:Market_share dbr:Photomask dbr:Semiconductor dbr:Ultraviolet dbr:Vapor dbr:Photonics dbr:Electric_circuit dbr:Freescale dbr:Computer_aided_design |
| dbp:align | right (en) |
| dbp:footer | Simplified illustration of the process of fabrication of a CMOS inverter on p-type substrate in semiconductor microfabrication. Each etch step is detailed in the following image. Note: Gate, source and drain contacts are not normally in the same plane in real devices, and the diagram is not to scale. (en) |
| dbp:image | CMOS_fabrication_process.svg (en) Photolithography_etching_process.svg (en) |
| dbp:width | 140 (xsd:integer) 200 (xsd:integer) |
| dbp:wikiPageUsesTemplate | dbt:Multiple_image dbt:Refimprove dbt:Reflist |
| dcterms:subject | dbc:Semiconductor_device_fabrication |
| gold:hypernym | dbr:Procedure |
| rdf:type | dbo:AnatomicalStructure |
| rdfs:comment | Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures. These steps are often repeated many hundreds of times, depending on the complexity of the desired circuit and its connections. (en) |
| rdfs:label | Wafer fabrication (en) |
| owl:sameAs | freebase:Wafer fabrication wikidata:Wafer fabrication https://global.dbpedia.org/id/4xuc7 |
| prov:wasDerivedFrom | wikipedia-en:Wafer_fabrication?oldid=1105037559&ns=0 |
| foaf:depiction | wiki-commons:Special:FilePath/CMOS_fabrication_process.svg wiki-commons:Special:FilePath/Photolithography_etching_process.svg |
| foaf:isPrimaryTopicOf | wikipedia-en:Wafer_fabrication |
| is dbo:wikiPageRedirects of | dbr:Wafer_Fabrication |
| is dbo:wikiPageWikiLink of | dbr:Water_supply_and_sanitation_in_Singapore dbr:History_of_the_Republic_of_Singapore dbr:SUNY_Poly_College_of_Nanoscale_Science_and_Engineering dbr:Mosel_Vitelic_Inc dbr:NEWater dbr:Linear_Technology dbr:Chittenden_County,_Vermont dbr:Singapore dbr:Dematerialization_(economics) dbr:Wafer_(electronics) dbr:Future_developments_in_Singapore dbr:ASM_International dbr:3D_XPoint dbr:DPR_Construction dbr:Economy_of_Singapore dbr:Four-Phase_Systems dbr:Banyan_switch dbr:History_of_Singapore dbr:Chartered_Semiconductor_Manufacturing dbr:Lam_Research dbr:Port_of_Singapore dbr:Semiconductor_Manufacturing_International_Corporation dbr:WFE dbr:National_Policy_on_Electronics_(India) dbr:Ultra-high-purity_steam_for_oxidation_and_annealing dbr:Semiconductor_industry_in_China dbr:Water_export dbr:Wafer_Fabrication |
| is rdfs:seeAlso of | dbr:Semiconductor_device_fabrication |
| is foaf:primaryTopic of | wikipedia-en:Wafer_fabrication |
