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To provide a photocurable/thermosetting resin composition suitable for an interlaminar insulation resin of a printed wiring board, a solder resist developable by an aqueous alkali solution, or the like, having high flame retardancy passing a UL combustion test, and excellent bleeding out resistance, resilience, folding resistance, adhesion, flexibility, heat resistance at the use of lead-free solder, moisture resistance and insulating properties.例文帳に追加

ＵＬ燃焼試験に合格する高難燃性、耐ブリードアウト性、柔軟性、耐折性、密着性、可撓性、鉛フリーはんだ使用時の耐熱性、耐湿性、絶縁性に優れ、プリント配線板の層間絶縁樹脂やアルカリ水溶液で現像可能なソルダーレジスト等に好適な光硬化性・熱硬化性樹脂組成物を提供する。 - 特許庁

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