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Papers by Jan Vanfleteren

Abstract Various approaches will make wearable medical systems comfortable for the user: circuit ... more Abstract Various approaches will make wearable medical systems comfortable for the user: circuit miniaturization is important, but this approach is ideally combined with flexible and/or stretchable integration, in order to obtain conformable, randomly deformable circuitry. ...

The authors would like to thank the European Commission for the financial support of the Project ... more The authors would like to thank the European Commission for the financial support of the Project STELLA, contract No. IST-028026 and the Flemish Community for the financial support of the Project BIOFLEX, contract No. SBO-040101. Special thanks to Philips Apptech for the ...

Proceedings of SPIE, Apr 21, 2006

... Dominique Brosteaux [801001964309] - Ghent University Dominique.Brosteaux@UGent. be; M Gonzal... more ... Dominique Brosteaux [801001964309] - Ghent University Dominique.Brosteaux@UGent. be; M Gonzalez; T Loeher; D Manessis; R Heinrich; B Schmied; A Ostmann; Jan Vanfleteren [801000674512] - Ghent University Jan.Vanfleteren@UGent.be. ...

2012 4th Electronic System-Integration Technology Conference, 2012

Advanced Materials Technologies, 2017

A stretchable platform with spherical‐shaped electronics based on thermoplastic polyurethane (TPU... more A stretchable platform with spherical‐shaped electronics based on thermoplastic polyurethane (TPU) is introduced for soft smart contact lenses. The low glass transition temperature of TPU, its relatively low hardness, and its proven biocompatibility (i.e., protection of exterior body wounds) fulfill the essential requirements for eye wearable devices. These requirements include optical transparency, conformal fitting, and flexibility comparable with soft contact lenses (e.g., hydrogel‐based). Moreover, the viscoelastic nature of TPU allows planar structures to be thermoformed into spherical caps with a well‐defined curvature (i.e., eye's curvature at the cornea: 9 mm). Numerical modeling and experimental validation enable fine‐tuning of the thermoforming parameters and the optimization of strain‐release patterns. Such tight control is proven necessary to achieve oxygen permeable, thin, nondevelopable, and wrinkle‐free contact lenses with integrated electronics (silicon die, radi...

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016

SID Symposium Digest of Technical Papers, 2016

MRS Proceedings, 2015

ABSTRACTA technology is presented for the production of soft and rigid circuits with an arbitrary... more ABSTRACTA technology is presented for the production of soft and rigid circuits with an arbitrary 2.5D fixed shape. The base of this technology is our proprietary technology for elastic circuits with a random shape, in which the elastic thermoset (mostly PDMS) polymer is now replaced by soft or rigid thermoplastic variants. An additional thermoforming step is required to transform the circuit from its initial flat to its final fixed 2.5D shape, but for rigid fixed shape circuits only one-time stretchability of the extensible interconnects is required, relieving the reliability requirements.

The paper reviews the different CdSe TFT technologies of the RUGent Laboratory of Electronics. Al... more The paper reviews the different CdSe TFT technologies of the RUGent Laboratory of Electronics. All the technologies used sandwiched and doped semiconductors, self-aligned gate with respect to source-drain, standard vacuum and lithography equipment; this makes them rather simple and relatively cheap technologies. TFTs for a variety of applications are fabricated.

A model for the poly-CdSe TFT is proposed, based on recent understandings of the behaviour of pol... more A model for the poly-CdSe TFT is proposed, based on recent understandings of the behaviour of polycrystalline semiconductors. The importance of adsorbed oxygen in CdSe films and the role of donor metals is highlighted. The model also explains the formation of metal ohmic contacts on CdSe by low temperature annealing.

The process optimization of PCVD silicon oxynitride (SiON) dielectric layers is described. The of... more The process optimization of PCVD silicon oxynitride (SiON) dielectric layers is described. The often large mechanical stress in such films is a drawback for large area applications. By using Taguchi's methodology for the process optimization, a 4 mum thick, pinhole-free SiON layer could be deposited, with practically no mechanical stress.