Anumut Siricharoenpanich - Academia.edu (original) (raw)

Papers by Anumut Siricharoenpanich

In this study, the thermal performance of a compact heat sink thermoelectric cooling mod... more In this study, the thermal performance of a compact heat sink thermoelectric cooling module with water, nanofluid, and ferrofluid as the coolants is investigated experimentally. The TiO2 nanofluid and Fe3O4 ferrofluid were tested at concentrations of 0.005% and
0.015%, respectively. The dummy battery pack was filled with water under a constant temperature and represented as a heat load. The results reveal that the Fe3O4 ferrofluid showed a maximum heat transfer rate 11.17% and 12.57% higher, respectively than that of the TiO2 nanofluid and water. The TiO2 nanofluid and Fe3O4 ferrofluid with a 0.015% concentration enhanced the Peltier effect by lowering the contribution of the Fourier effect of the thermoelectric cooler (TEC), decreasing the temperature difference of the TEC cooling module by 4.6% and 9.6%, respectively, which decreases the thermal resistance of the heat sink by 7% and 14%, respectively. More importantly, the use of nanofluids and ferrofluids with a 0.015% concentration as coolants increased the pressure drop significantly, by 0.5 kPa and 2.7 kPa, respectively, compared with water.

Due to the limited space and power available in computers or electronics devices, heat pipes are ... more Due to the limited space and power available in computers or electronics devices, heat pipes are ideally suited for cooling the high power chips. The thermal management system of computer with CPU cooling with short heat pipe cooling system has been investigated. Effects of the relevant parameters; inclination angle of heat pipe, with and without porous media, working fluid types and operating conditions of computer on the variation of CPU temperature are considered. In the experiments, R11, R134a and ethanol are selected as working fluids inside the heat pipe with constant 50% fill ratio. The variations of CPU temperature obtained from the heat pipe cooling system are compared with those from the conventional cooling system. It can be seen that the inclination angles of the heat pipe and physical properties of working fluids have significant effect on the cooling capacity which results in the CPU temperature variations. The heat pipe with porous media gives the CPU temperature lower than without porous media. The obtained results are expected to lead to guidelines that will allow the design of the thermal management system with optimized heat pipe cooling system for CPU cooling system with maximum cooling capacity.

The aim of this research is to improve thermal performance of air conditioning system by cooling ... more The aim of this research is to improve thermal performance of air conditioning system by cooling water loop. In experiment, the cooling water loop with the concentric helically coiled tube heat exchanger is installed between the compressor unit and condenser unit for cooling refrigerant before entering the condenser unit. Effects of water mass flow rate and atmospheric temperature on the COP are considered. The obtained results are compared with those from the conventional air conditioning system without cooling water loop. It can be seen that the COP tends to increase with increasing water mass flow rate and tend to decrease as atmospheric temperature increases. The highest COP is 31.02% as compared with the conventional reference system, respectively. In addition, not only COP of air conditioning system are increased but also the hot water storage is obtained which used for various applications. The results obtained this study are expected to lead to guidelines that will allow the improved thermal performance of air conditioning system and hot water storage system which reduce energy consumption.

The thermal dissipation resistance has encountered a problem in the thermal analysis of the elect... more The thermal dissipation resistance has encountered a problem in the thermal analysis of the electronic components. Due to the limitation of the coolant heat removal capacity, the nanofluid and flow feature of the coolant flowing through the thermal cooling system have proposed. The mixture of Ag and Fe 3 O 4 nanoparticles and flow direction guide vane of coolant for cooling electronic devices have been investigated. The effects of coolant flow rate, coolant type, and heat sink configuration on the thermal dissipation efficiency are considered. Ag and Fe 3 O 4 nano-particles suspending in the base fluid test and compared with the de-ionized water. The obtained results found that the proposed water blocks have a significant effect on the flow feature of coolant flowing through the thermal cooling system, which results in 11.94% increase in thermal dissipation efficiency. Besides, the thermal dissipation efficiency from Ag/Fe 3 O 4 nanofluid mixture as the coolant is higher than Ag nanofluids and higher than that de-ionized water as the coolant, respectively.

In this study, the thermal performance of a compact heat sink thermoelectric cooling mod... more In this study, the thermal performance of a compact heat sink thermoelectric cooling module with water, nanofluid, and ferrofluid as the coolants is investigated experimentally. The TiO2 nanofluid and Fe3O4 ferrofluid were tested at concentrations of 0.005% and
0.015%, respectively. The dummy battery pack was filled with water under a constant temperature and represented as a heat load. The results reveal that the Fe3O4 ferrofluid showed a maximum heat transfer rate 11.17% and 12.57% higher, respectively than that of the TiO2 nanofluid and water. The TiO2 nanofluid and Fe3O4 ferrofluid with a 0.015% concentration enhanced the Peltier effect by lowering the contribution of the Fourier effect of the thermoelectric cooler (TEC), decreasing the temperature difference of the TEC cooling module by 4.6% and 9.6%, respectively, which decreases the thermal resistance of the heat sink by 7% and 14%, respectively. More importantly, the use of nanofluids and ferrofluids with a 0.015% concentration as coolants increased the pressure drop significantly, by 0.5 kPa and 2.7 kPa, respectively, compared with water.

Due to the limited space and power available in computers or electronics devices, heat pipes are ... more Due to the limited space and power available in computers or electronics devices, heat pipes are ideally suited for cooling the high power chips. The thermal management system of computer with CPU cooling with short heat pipe cooling system has been investigated. Effects of the relevant parameters; inclination angle of heat pipe, with and without porous media, working fluid types and operating conditions of computer on the variation of CPU temperature are considered. In the experiments, R11, R134a and ethanol are selected as working fluids inside the heat pipe with constant 50% fill ratio. The variations of CPU temperature obtained from the heat pipe cooling system are compared with those from the conventional cooling system. It can be seen that the inclination angles of the heat pipe and physical properties of working fluids have significant effect on the cooling capacity which results in the CPU temperature variations. The heat pipe with porous media gives the CPU temperature lower than without porous media. The obtained results are expected to lead to guidelines that will allow the design of the thermal management system with optimized heat pipe cooling system for CPU cooling system with maximum cooling capacity.

The aim of this research is to improve thermal performance of air conditioning system by cooling ... more The aim of this research is to improve thermal performance of air conditioning system by cooling water loop. In experiment, the cooling water loop with the concentric helically coiled tube heat exchanger is installed between the compressor unit and condenser unit for cooling refrigerant before entering the condenser unit. Effects of water mass flow rate and atmospheric temperature on the COP are considered. The obtained results are compared with those from the conventional air conditioning system without cooling water loop. It can be seen that the COP tends to increase with increasing water mass flow rate and tend to decrease as atmospheric temperature increases. The highest COP is 31.02% as compared with the conventional reference system, respectively. In addition, not only COP of air conditioning system are increased but also the hot water storage is obtained which used for various applications. The results obtained this study are expected to lead to guidelines that will allow the improved thermal performance of air conditioning system and hot water storage system which reduce energy consumption.

The thermal dissipation resistance has encountered a problem in the thermal analysis of the elect... more The thermal dissipation resistance has encountered a problem in the thermal analysis of the electronic components. Due to the limitation of the coolant heat removal capacity, the nanofluid and flow feature of the coolant flowing through the thermal cooling system have proposed. The mixture of Ag and Fe 3 O 4 nanoparticles and flow direction guide vane of coolant for cooling electronic devices have been investigated. The effects of coolant flow rate, coolant type, and heat sink configuration on the thermal dissipation efficiency are considered. Ag and Fe 3 O 4 nano-particles suspending in the base fluid test and compared with the de-ionized water. The obtained results found that the proposed water blocks have a significant effect on the flow feature of coolant flowing through the thermal cooling system, which results in 11.94% increase in thermal dissipation efficiency. Besides, the thermal dissipation efficiency from Ag/Fe 3 O 4 nanofluid mixture as the coolant is higher than Ag nanofluids and higher than that de-ionized water as the coolant, respectively.