Emeka Amalu - Academia.edu (original) (raw)

Papers by Emeka Amalu

Advanced Materials Research, 2011

The development of advanced thermal management materials for Electronic Control Unit (ECU) is the... more The development of advanced thermal management materials for Electronic Control Unit (ECU) is the key to achieving high reliability and thus safety critical operations in areas of ECU applications such as automotives and power systems. Thermal management issues associated with the operation of ECU at elevated temperature have accounted for some of the recent reliability concerns which have culminated in current systems failures in some automobiles. As the functions of ECU in systems have increased in recent times, the number of components per unit area on its board has also risen. High board density boosts internal heat generated per unit time in ECU ambient. The generated heat induces stress and strain at the chip interconnects due to variation in the Coefficient of Thermal Expansion (CTE) and thermal conductivity of different bonded materials in the assembly. Thermal degradation could become critical and impacts device’s efficiency. The life expectancy of electronic components red...

… (EMPC), 2011 18th …, 2011

... [12] KC Otiaba, NN Ekere, RS Bhatti, S. Mallik, MO Alam, EH Amalu, "Thermal Interface Ma... more ... [12] KC Otiaba, NN Ekere, RS Bhatti, S. Mallik, MO Alam, EH Amalu, "Thermal Interface Materials for Automotive Electronic Control Unit: Trends,Technology and R&D Challenges", In press, Microelectronics Reliability. ... 1658-1666,2006. [34] Shadab Shaikh, Khalid Lafdi, Edward ...

Microelectronics Reliability, 2011

The under-hood automotive ambient is harsh and its impact on electronics used in electronic contr... more The under-hood automotive ambient is harsh and its impact on electronics used in electronic control unit (ECU) assembly is a concern. The introduction of Euro 6 standard (Latest European Union Legislation) leading to increase in power density of power electronics in ECU has even amplified the device thermal challenge. Heat generated within the unit coupled with ambient temperature makes the

Microelectronic Engineering, 2011

The reliability of solder joints in electronic products are greatly enhanced by good stencil prin... more The reliability of solder joints in electronic products are greatly enhanced by good stencil printing and quality reflow soldering. The stencil printing process is widely used in Surface Mount Technology (SMT) to deposit solder paste on the substrate and is a critical step in SMT assembly as it has been widely claimed that up to 50% of the defects found

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (S... more The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high‐density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip‐chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad‐to‐pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead‐free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24−1 Ramp‐Soak‐Spike reflow profile, with all main effects and two‐way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer‐pitch interconnect.The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high‐density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip‐chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad‐to‐pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, an...

... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing ... more ... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing Engineering Research Group, University of ... [14]. Laxmidhar Biswal, Arvind Krishna, Doug Sprunger, Effect of Solder Voids on Thermal Performance of a High Power Electronic Module. ...

3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011), 2011

Solder joint is a method widely used to attach electronic chip on substrate. It is a generally kn... more Solder joint is a method widely used to attach electronic chip on substrate. It is a generally knowledge that solder joint contains inter-metallic compound (IMC) at interconnects of solder bump and copper pads. The magnitude of IMC layer thickness impacts reliability of chip level packages. Extensive experimental investigations are conducted, however complementary numerical studies are needed to fully characterise the effects of IMC on high temperature reliability of flip chip (FC) assembly. In this work, thermo-mechanical response of FC lead-free solder joints to accelerated temperature cycle (ATC) is investigated using finite element analysis (FEA) code. The ANAND's model is employed to study the inelastic, nonlinear, rate dependent and visco-plastic behaviour of two models of FC48D6.3C457DC mounted on printed circuit boards (PCBs). While one model consists of conventional joints without IMC, the other is realistic with IMC embedded. In the result analysis based on damage indicators such as induced strain, stress, plastic work and hysteresis, it is found that negative impact of IMC on static structural integrity of solder joint operating at high temperature ambient is nontrivial.

Advanced Materials Research, 2011

The solder joints of surface mount components (SMCs) experience thermal degradation culminating i... more The solder joints of surface mount components (SMCs) experience thermal degradation culminating in creep and plastic shear strain deformation when subjected to cyclic temperature load over time. Degradation at the joints is due to thermal stress induced by the incompatible, differential and nonlinear expansion mismatch of the different bonded materials in the assembly. The stress magnitude influences the strain behaviour. Plastic strain response of solder joint is critical at the materials interface at the lower part of the joint due to the occurrence of wider variation in the coefficient of thermal expansion of the bonded materials and this may lead to static structural failure. The life expectancy of electronic components reduces exponentially as the operating temperature increases thus making reliability a key concern for electronic systems operating at high temperatures and in harsh environments. This paper reports on the numerical investigation of thermo-mechanical response of ...

Journal of Manufacturing Systems, 2016

Robotics and Computer-Integrated Manufacturing, 2016

Global Journal of Pure and Applied Sciences, 2016

Renewable and Sustainable Energy Reviews, 2016

2015 38th International Spring Seminar on Electronics Technology (ISSE), 2015

Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised ... more Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised surface mount components in consumer electronics which operates in high-temperature ambient is studied. This work investigates the effect of CSH on ball grid array (BGA) solder joints which operates in high homologous temperature in mission critical systems and seeks to utilise the findings of this investigation to minimise the accumulated strain energy density in the joints. The study focuses to underpin the relationship between CSH and shear strength of the joints while it determines the effect of long high-temperature operations on integrity of the soldered joints. It identifies the failure site and mode in the joints and examines failed surfaces to provide information on the morphology of the material microstructure. The results demonstrate that increase in CSH decreases the shear strength of the solder joints and at prolonged operations in high-temperature of about 150 degrees centigrade, solder joint shear strength decreases due to significant formation and growth of brittle intermetallic compound at the interface between substrate pad and solder bulk. EDS analysis shows that this region is characterized by high Tin/Cu content and demonstrates failure mode of crack initiation, propagation and pad lifting.

Finite Elements in Analysis and Design, 2015

Applied Energy, 2015

Current interconnection technologies of crystalline Si solar cells are evaluated. Technology indu... more Current interconnection technologies of crystalline Si solar cells are evaluated. Technology inducing least stress while supporting PV manufacturing trend is optimal. Laser soldering is identified as most efficient PV cell interconnection technology. Laser soldering is poised for use to extend MTTF of modules operating in tropics.

2009 2nd International Conference on Adaptive Science & Technology (ICAST), 2009

The development of new high temperature electronics (HTE)/systems is the key to achieving high re... more The development of new high temperature electronics (HTE)/systems is the key to achieving high reliability safety critical operations in aerospace, automotive and well-logging applications. Reliability issues associated with the operation of HTE devices have been shown to account for some of the recent aircraft crashes as well as failures of the electronic control Unit in modern vehicles. The reliability of electronic systems is partly dependent on its operating ambient conditions; and reliability generally decreases in harsh operating conditions. The life expectancy of components and systems is known to reduce exponentially as the operating temperature increases; adversely impacting long-term system reliability. As under-bonnet, aerospace and well-logging applications require the direct exposure of sensors to very harsh conditions -these applications demand new HTE systems which can operate reliably in harsh conditions whilst preserving their properties/functions over long operating periods. The packaging and interconnection of the new HTE systems requires better understanding of the complex interactions between HTE system parameters and specific environmental conditions. The paper presents an overview of HTE research, reviews the trends in materials, component packaging and interconnect technology. The paper also outlines the key challenges in HTE research and the outstanding R&D issues.

... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing ... more ... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing Engineering Research Group, University of ... [14]. Laxmidhar Biswal, Arvind Krishna, Doug Sprunger, Effect of Solder Voids on Thermal Performance of a High Power Electronic Module. ...

Materials & Design, 2011

Although stencil printing is widely used in surface mount technology, it is believed to be the ma... more Although stencil printing is widely used in surface mount technology, it is believed to be the main source of majority of defects in the final assembly. Such defects, which could lead to major reliability issues, can be controlled and/or minimised through proper understanding and control of the flow and deformation behaviour of solder pastes. This study concerns the characterisation of three different Pb-free solder pastes used for ultra-fine pitch assembly applications. We also investigate the paste transfer efficiency through linearly varying stencil apertures sizes, and correlate the paste rheological properties with their transfer efficiency -to provide further understanding of the effects and interactions of stencil printing process variables on the paste transfer efficiency. Three rheological tests, namely: the viscosity, thixotropic and oscillatory amplitude sweep were employed in the characterisation. The paste samples were printed on Cu substrates using stencil printing (with varying aperture cavity dimensions in the range 0.79 mm 3 -1.62 mm 3 ). A three-level design on two factors experiment, 3 2 , was used to determine significant level of parameters in terms of main effect and interactions. Our results show that the paste type and volume of stencil aperture interact during printing and that pastes with unique rheological properties produced distinctive transfer pattern. The results also show that the printing process variables and their interactions were significant on transfer efficiency of pastes. These results will be of interest to R&D staff involved in formulation of new Pb-free pastes and the design of stencils for ultra-fine pitch assembly applications.

Advanced Materials Research, 2011

ABSTRACT The solder joints of surface mount components (SMCs) experience thermal degradation culm... more ABSTRACT The solder joints of surface mount components (SMCs) experience thermal degradation culminating in creep and plastic shear strain deformation when subjected to cyclic temperature load over time. Degradation at the joints is due to thermal stress induced by the incompatible, differential and nonlinear expansion mismatch of the different bonded materials in the assembly. The stress magnitude influences the strain behaviour. Plastic strain response of solder joint is critical at the materials interface at the lower part of the joint due to the occurrence of wider variation in the coefficient of thermal expansion of the bonded materials and this may lead to static structural failure. The life expectancy of electronic components reduces exponentially as the operating temperature increases thus making reliability a key concern for electronic systems operating at high temperatures and in harsh environments. This paper reports on the numerical investigation of thermo-mechanical response of a critical BGA joint especially the character of plastic deformation of SnPb solder used in forming the joint as well as the joint’s high temperature reliability. The analysis uses a 3-D models to predict the effect of the transient thermal load on the static structural integrity of a single BGA joint. In this study, the base diameter of solder ball (interface between the PCB, copper pad and the solder) experienced higher damage than the top diameter interconnects. The paper provides a simplified methodology to study the reliability of BGA solder joint at high temperatures excursion.

Advanced Materials Research, 2011

The development of advanced thermal management materials for Electronic Control Unit (ECU) is the... more The development of advanced thermal management materials for Electronic Control Unit (ECU) is the key to achieving high reliability and thus safety critical operations in areas of ECU applications such as automotives and power systems. Thermal management issues associated with the operation of ECU at elevated temperature have accounted for some of the recent reliability concerns which have culminated in current systems failures in some automobiles. As the functions of ECU in systems have increased in recent times, the number of components per unit area on its board has also risen. High board density boosts internal heat generated per unit time in ECU ambient. The generated heat induces stress and strain at the chip interconnects due to variation in the Coefficient of Thermal Expansion (CTE) and thermal conductivity of different bonded materials in the assembly. Thermal degradation could become critical and impacts device’s efficiency. The life expectancy of electronic components red...

… (EMPC), 2011 18th …, 2011

... [12] KC Otiaba, NN Ekere, RS Bhatti, S. Mallik, MO Alam, EH Amalu, "Thermal Interface Ma... more ... [12] KC Otiaba, NN Ekere, RS Bhatti, S. Mallik, MO Alam, EH Amalu, "Thermal Interface Materials for Automotive Electronic Control Unit: Trends,Technology and R&D Challenges", In press, Microelectronics Reliability. ... 1658-1666,2006. [34] Shadab Shaikh, Khalid Lafdi, Edward ...

Microelectronics Reliability, 2011

The under-hood automotive ambient is harsh and its impact on electronics used in electronic contr... more The under-hood automotive ambient is harsh and its impact on electronics used in electronic control unit (ECU) assembly is a concern. The introduction of Euro 6 standard (Latest European Union Legislation) leading to increase in power density of power electronics in ECU has even amplified the device thermal challenge. Heat generated within the unit coupled with ambient temperature makes the

Microelectronic Engineering, 2011

The reliability of solder joints in electronic products are greatly enhanced by good stencil prin... more The reliability of solder joints in electronic products are greatly enhanced by good stencil printing and quality reflow soldering. The stencil printing process is widely used in Surface Mount Technology (SMT) to deposit solder paste on the substrate and is a critical step in SMT assembly as it has been widely claimed that up to 50% of the defects found

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (S... more The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high‐density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip‐chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad‐to‐pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead‐free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24−1 Ramp‐Soak‐Spike reflow profile, with all main effects and two‐way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer‐pitch interconnect.The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high‐density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip‐chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad‐to‐pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, an...

... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing ... more ... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing Engineering Research Group, University of ... [14]. Laxmidhar Biswal, Arvind Krishna, Doug Sprunger, Effect of Solder Voids on Thermal Performance of a High Power Electronic Module. ...

3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011), 2011

Solder joint is a method widely used to attach electronic chip on substrate. It is a generally kn... more Solder joint is a method widely used to attach electronic chip on substrate. It is a generally knowledge that solder joint contains inter-metallic compound (IMC) at interconnects of solder bump and copper pads. The magnitude of IMC layer thickness impacts reliability of chip level packages. Extensive experimental investigations are conducted, however complementary numerical studies are needed to fully characterise the effects of IMC on high temperature reliability of flip chip (FC) assembly. In this work, thermo-mechanical response of FC lead-free solder joints to accelerated temperature cycle (ATC) is investigated using finite element analysis (FEA) code. The ANAND's model is employed to study the inelastic, nonlinear, rate dependent and visco-plastic behaviour of two models of FC48D6.3C457DC mounted on printed circuit boards (PCBs). While one model consists of conventional joints without IMC, the other is realistic with IMC embedded. In the result analysis based on damage indicators such as induced strain, stress, plastic work and hysteresis, it is found that negative impact of IMC on static structural integrity of solder joint operating at high temperature ambient is nontrivial.

Advanced Materials Research, 2011

The solder joints of surface mount components (SMCs) experience thermal degradation culminating i... more The solder joints of surface mount components (SMCs) experience thermal degradation culminating in creep and plastic shear strain deformation when subjected to cyclic temperature load over time. Degradation at the joints is due to thermal stress induced by the incompatible, differential and nonlinear expansion mismatch of the different bonded materials in the assembly. The stress magnitude influences the strain behaviour. Plastic strain response of solder joint is critical at the materials interface at the lower part of the joint due to the occurrence of wider variation in the coefficient of thermal expansion of the bonded materials and this may lead to static structural failure. The life expectancy of electronic components reduces exponentially as the operating temperature increases thus making reliability a key concern for electronic systems operating at high temperatures and in harsh environments. This paper reports on the numerical investigation of thermo-mechanical response of ...

Journal of Manufacturing Systems, 2016

Robotics and Computer-Integrated Manufacturing, 2016

Global Journal of Pure and Applied Sciences, 2016

Renewable and Sustainable Energy Reviews, 2016

2015 38th International Spring Seminar on Electronics Technology (ISSE), 2015

Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised ... more Effect of standoff height (SH) on thermo-mechanical reliability of solder joints in miniaturised surface mount components in consumer electronics which operates in high-temperature ambient is studied. This work investigates the effect of CSH on ball grid array (BGA) solder joints which operates in high homologous temperature in mission critical systems and seeks to utilise the findings of this investigation to minimise the accumulated strain energy density in the joints. The study focuses to underpin the relationship between CSH and shear strength of the joints while it determines the effect of long high-temperature operations on integrity of the soldered joints. It identifies the failure site and mode in the joints and examines failed surfaces to provide information on the morphology of the material microstructure. The results demonstrate that increase in CSH decreases the shear strength of the solder joints and at prolonged operations in high-temperature of about 150 degrees centigrade, solder joint shear strength decreases due to significant formation and growth of brittle intermetallic compound at the interface between substrate pad and solder bulk. EDS analysis shows that this region is characterized by high Tin/Cu content and demonstrates failure mode of crack initiation, propagation and pad lifting.

Finite Elements in Analysis and Design, 2015

Applied Energy, 2015

Current interconnection technologies of crystalline Si solar cells are evaluated. Technology indu... more Current interconnection technologies of crystalline Si solar cells are evaluated. Technology inducing least stress while supporting PV manufacturing trend is optimal. Laser soldering is identified as most efficient PV cell interconnection technology. Laser soldering is poised for use to extend MTTF of modules operating in tropics.

2009 2nd International Conference on Adaptive Science & Technology (ICAST), 2009

The development of new high temperature electronics (HTE)/systems is the key to achieving high re... more The development of new high temperature electronics (HTE)/systems is the key to achieving high reliability safety critical operations in aerospace, automotive and well-logging applications. Reliability issues associated with the operation of HTE devices have been shown to account for some of the recent aircraft crashes as well as failures of the electronic control Unit in modern vehicles. The reliability of electronic systems is partly dependent on its operating ambient conditions; and reliability generally decreases in harsh operating conditions. The life expectancy of components and systems is known to reduce exponentially as the operating temperature increases; adversely impacting long-term system reliability. As under-bonnet, aerospace and well-logging applications require the direct exposure of sensors to very harsh conditions -these applications demand new HTE systems which can operate reliably in harsh conditions whilst preserving their properties/functions over long operating periods. The packaging and interconnection of the new HTE systems requires better understanding of the complex interactions between HTE system parameters and specific environmental conditions. The paper presents an overview of HTE research, reviews the trends in materials, component packaging and interconnect technology. The paper also outlines the key challenges in HTE research and the outstanding R&D issues.

... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing ... more ... KC Otiaba*, RS Bhatti, NN Ekere, S. Mallik, EH Amalu & M. Ekpu Electronics Manufacturing Engineering Research Group, University of ... [14]. Laxmidhar Biswal, Arvind Krishna, Doug Sprunger, Effect of Solder Voids on Thermal Performance of a High Power Electronic Module. ...

Materials & Design, 2011

Although stencil printing is widely used in surface mount technology, it is believed to be the ma... more Although stencil printing is widely used in surface mount technology, it is believed to be the main source of majority of defects in the final assembly. Such defects, which could lead to major reliability issues, can be controlled and/or minimised through proper understanding and control of the flow and deformation behaviour of solder pastes. This study concerns the characterisation of three different Pb-free solder pastes used for ultra-fine pitch assembly applications. We also investigate the paste transfer efficiency through linearly varying stencil apertures sizes, and correlate the paste rheological properties with their transfer efficiency -to provide further understanding of the effects and interactions of stencil printing process variables on the paste transfer efficiency. Three rheological tests, namely: the viscosity, thixotropic and oscillatory amplitude sweep were employed in the characterisation. The paste samples were printed on Cu substrates using stencil printing (with varying aperture cavity dimensions in the range 0.79 mm 3 -1.62 mm 3 ). A three-level design on two factors experiment, 3 2 , was used to determine significant level of parameters in terms of main effect and interactions. Our results show that the paste type and volume of stencil aperture interact during printing and that pastes with unique rheological properties produced distinctive transfer pattern. The results also show that the printing process variables and their interactions were significant on transfer efficiency of pastes. These results will be of interest to R&D staff involved in formulation of new Pb-free pastes and the design of stencils for ultra-fine pitch assembly applications.

Advanced Materials Research, 2011

ABSTRACT The solder joints of surface mount components (SMCs) experience thermal degradation culm... more ABSTRACT The solder joints of surface mount components (SMCs) experience thermal degradation culminating in creep and plastic shear strain deformation when subjected to cyclic temperature load over time. Degradation at the joints is due to thermal stress induced by the incompatible, differential and nonlinear expansion mismatch of the different bonded materials in the assembly. The stress magnitude influences the strain behaviour. Plastic strain response of solder joint is critical at the materials interface at the lower part of the joint due to the occurrence of wider variation in the coefficient of thermal expansion of the bonded materials and this may lead to static structural failure. The life expectancy of electronic components reduces exponentially as the operating temperature increases thus making reliability a key concern for electronic systems operating at high temperatures and in harsh environments. This paper reports on the numerical investigation of thermo-mechanical response of a critical BGA joint especially the character of plastic deformation of SnPb solder used in forming the joint as well as the joint’s high temperature reliability. The analysis uses a 3-D models to predict the effect of the transient thermal load on the static structural integrity of a single BGA joint. In this study, the base diameter of solder ball (interface between the PCB, copper pad and the solder) experienced higher damage than the top diameter interconnects. The paper provides a simplified methodology to study the reliability of BGA solder joint at high temperatures excursion.