T. Tekin - Academia.edu (original) (raw)
Papers by T. Tekin
ABSTRACT In today's Peta-flop High-Performance Computing (HPC) machines the size and powe... more ABSTRACT In today's Peta-flop High-Performance Computing (HPC) machines the size and power consumption appear to be daunting issues, signifying that new technological and architectural considerations will be required in order to be able to move towards Exascale-computing powers. Whereas silicon photonics emerges as a powerful technology for low-loss and high bandwidth optical connectivity in integrated circuit environments, servers and network switches are already consolidating into high-density blade enclosures in order to reduce space and cooling requirements. These determine new tasks for switching infrastructures of miniature data networks: the next generation of routing circuitry has to provide high throughput capabilities while keeping in line with the requirements of small foot-print, low power consumption and low latency. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel photonic interconnection technologies. The objective of the recently proposed high bandwidth Photonics Interconnection Layer for Converged Microsystems using System-in-Package Technology, namely PICSiP, is to develop a CMOS compatible underlying technology to enable next generation optical computing architectures. In this work, we present a silicon photonics based integrated system-in-package platform (PICSiP) for Tb/s router application. As routing platform employ three different technologies: silicon photonics, plasmonics and electronics. Compatibility between various components has to be ensured to allow for their seamless interfacing and interoperability. The 4x4 router architecture exploits a SOI platform employing 340x400nm2 waveguide structures and hosting four 7:1 SOI multiplexing circuits, four photodiodes, an electronic IC control circuit and the 4x4 dielectric-loaded surface plasmon-polariton (DLSPP)-based switching matrix.
![Research paper thumbnail of 160 Gbit/s error-free all-optical demultiplexing using monolithically integrated bandgap shifted Mach-Zehnder interferometer [4829-295]](https://attachments.academia-assets.com/41247713/thumbnails/1.jpg)
](Error-free all-optical demultiplexing is demonstrated with a monolithically integrated switch for... more Error-free all-optical demultiplexing is demonstrated with a monolithically integrated switch for 160 Gbit/s data stream. The switch comprises 'band gap shifted' semiconductor optical amplifiers, monolithically integrated within a symmetric Mach-Zehnder interferometer.
Fiber pigtailing and packaging of nanowaveguide circuits are key technologies to realize nanophot... more Fiber pigtailing and packaging of nanowaveguide circuits are key technologies to realize nanophotonic applications. Technical problems start with a large mode mismatch of nanowires and standard single-mode fibers, which requires innovative coupling structures for low coupling loss and for large alignment tolerances. Looking further ahead, solutions are needed that allow for wafer level optical device testing and also for reduced packaging costs. These are essential ingredients for making nanophotonics a truly competitive and large scale technology. In the following we shall present work that focuses exactly on such issues, covering a general evaluation of coupling techniques, silicon grating couplers, fiber array packaging of silicon nanophotonic circuits, and roads to reduced costs and generic nanophotonic packaging.
2005 IEEE LEOS Annual Meeting Conference Proceedings, 2005
We report electrical and optical injection locking of an InP colliding pulse mode locked laser em... more We report electrical and optical injection locking of an InP colliding pulse mode locked laser emitting synchronized, nearly transform-limited output pulses at 10.3 GHz, fabricated by active-passive integration and a single step regrowth process.
International Symposium on Microelectronics, 2013
Optical Components and Materials VI, 2009
In this work a compact green laser light source is presented based on a single-pass second harmon... more In this work a compact green laser light source is presented based on a single-pass second harmonic generation (SHG) in non-linear material. The green light source consists of a distributed feedback (DFB) laser with a monolithically integrated power amplifier (PA) and a periodically poled lithium niobate (PPLN) crystal with a ridge waveguide. To achieve the smallest size and to reduce the number of parts to be assembled, a direct coupling approach is implemented without using any lens. The waveguide of the laser is bent and the facet of the crystal is tilted and AR-coated in order to reduce undesired reflections and to increase the stability of operation. By varying the injection current of the amplifier the infrared output power of the laser changes proportionally. The wavelength remains stable during current variation and in that way the green optical output power can also be modulated. No additional external modulator is required for the generation of distinct green light levels. At a wavelength of 530 nm, a green optical output power of more than 35 mW is achieved for injection currents of 93 mA and 400 mA through the DFB section and amplifier section respectively.
2009 6th IEEE International Conference on Group IV Photonics, 2009
Coupling loss of 7.5dB are measured at λ=1.55µm. A spectrum broader than 70nm is observed.
Conference on Lasers and Electro-Optics 2012, 2012
ABSTRACT This tutorial reviews the physics of surface plasmon circuitry in order to bring to the ... more ABSTRACT This tutorial reviews the physics of surface plasmon circuitry in order to bring to the fore recently demonstrated applications of surface plasmon in optoelectronics such as on-board optical interconnects or routing in datacom networks.
39th European Conference and Exhibition on Optical Communication (ECOC 2013), 2000
ABSTRACT High-speed electronic integrated circuits are essential to the development of new fiber-... more ABSTRACT High-speed electronic integrated circuits are essential to the development of new fiber-optic communication systems. Close integration and co-design of photonic and electronic devices are becoming more and more a necessity to realize the best performance trade-offs. This paper presents our most recent results and a brief introduction to our research in recently started EU projects.
High-Power Diode Laser Technology and Applications VII, 2009
ABSTRACT Laser diodes and diode laser bars are key components in high power semiconductor lasers ... more ABSTRACT Laser diodes and diode laser bars are key components in high power semiconductor lasers and solid state laser systems. During manufacture, the assembly of the fast axis collimation (FAC) lens is a crucial step. The goal of our activities is to design an automated assembly system for high volume production. In this paper the results of an intermediate milestone will be reported: a demonstration system was designed, realized and tested to prove the feasibility of all of the system components and process features. The demonstration system consists of a high precision handling system, metrology for process feedback, a powerful digital image processing system and tooling for glue dispensing, UV curing and laser operation. The system components as well as their interaction with each other were tested in an experimental system in order to glean design knowledge for the fully automated assembly system. The adjustment of the FAC lens is performed by a series of predefined steps monitored by two cameras concurrently imaging the far field and the near field intensity distributions. Feedback from these cameras processed by a powerful and efficient image processing algorithm control a five axis precision motion system to optimize the fast axis collimation of the laser beam. Automated cementing of the FAC to the diode bar completes the process. The presentation will show the system concept, the algorithm of the adjustment as well as experimental results. A critical discussion of the results will close the talk.
Silicon Photonics IX, 2014
ABSTRACT Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for... more ABSTRACT Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier - Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.
2008 34th European Conference on Optical Communication, 2008
Commercial multi-fibre array coupled to vertical grating coupler on a SOI (Silicon on insulator) ... more Commercial multi-fibre array coupled to vertical grating coupler on a SOI (Silicon on insulator) chip, which is suitable for cost effective, compact interconnect for smart photonics packaging (ePIXpack).
8th IEEE International Conference on Group IV Photonics, 2011
ABSTRACT A package solution for silicon photonic integrated circuits with multiple input/output g... more ABSTRACT A package solution for silicon photonic integrated circuits with multiple input/output grating-based optical interfaces is proposed and experimentally demonstrated. The approach is based on using a subassembly sub-mount carrier to maintain standard-compatible lateral orientation for the fibers in the package.
Integrated Optics: Devices, Materials, and Technologies XIV, 2010
Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Ne... more Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.
2010 23rd Annual Meeting of the Ieee Photonics Society, 2010
We present recent work that is carried out within the FP7 project PLATON on novel Tb/s switch fab... more We present recent work that is carried out within the FP7 project PLATON on novel Tb/s switch fabric architectures and technologies for optical interconnect applications, employing heterointegration of plasmonics, silicon photonics and electronics.
Proceedings of SPIE - The International Society for Optical Engineering, 2011
Surface plasmons polaritons are electromagnetic waves propagating along the surface of a conducto... more Surface plasmons polaritons are electromagnetic waves propagating along the surface of a conductor. Surface plasmons photonics is a promising candidate to satisfy the constraints of miniaturization of optical interconnects. This contribution reviews an experimental parametric study of dielectric loaded surface plasmon waveguides ring resonators and add-drop filters within the perspective of the recently suggested hybrid technology merging plasmonic and silicon photonics on a single board (European FP7 project PLATON "Merging Plasmonic and Silicon Photonics Technology towards Tb/s routing in optical interconnects"). Conclusions relevant for dielectric loaded surface plasmon switches to be integrated in silicon photonic circuitry will be drawn. They rely on the opportunity offered by plasmonic circuitry to carry optical signals and electric currents through the same thin metal circuitry. The heating of the dielectric loading by the electric current enables to design low foot-print thermo-optical switches driving the optical signal flow.
Photonic Materials, Devices, and Applications III, 2009
Technological frontiers between semiconductor technology, packaging, and system design are disapp... more Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through
ABSTRACT In today's Peta-flop High-Performance Computing (HPC) machines the size and powe... more ABSTRACT In today's Peta-flop High-Performance Computing (HPC) machines the size and power consumption appear to be daunting issues, signifying that new technological and architectural considerations will be required in order to be able to move towards Exascale-computing powers. Whereas silicon photonics emerges as a powerful technology for low-loss and high bandwidth optical connectivity in integrated circuit environments, servers and network switches are already consolidating into high-density blade enclosures in order to reduce space and cooling requirements. These determine new tasks for switching infrastructures of miniature data networks: the next generation of routing circuitry has to provide high throughput capabilities while keeping in line with the requirements of small foot-print, low power consumption and low latency. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel photonic interconnection technologies. The objective of the recently proposed high bandwidth Photonics Interconnection Layer for Converged Microsystems using System-in-Package Technology, namely PICSiP, is to develop a CMOS compatible underlying technology to enable next generation optical computing architectures. In this work, we present a silicon photonics based integrated system-in-package platform (PICSiP) for Tb/s router application. As routing platform employ three different technologies: silicon photonics, plasmonics and electronics. Compatibility between various components has to be ensured to allow for their seamless interfacing and interoperability. The 4x4 router architecture exploits a SOI platform employing 340x400nm2 waveguide structures and hosting four 7:1 SOI multiplexing circuits, four photodiodes, an electronic IC control circuit and the 4x4 dielectric-loaded surface plasmon-polariton (DLSPP)-based switching matrix.
Error-free all-optical demultiplexing is demonstrated with a monolithically integrated switch for... more Error-free all-optical demultiplexing is demonstrated with a monolithically integrated switch for 160 Gbit/s data stream. The switch comprises 'band gap shifted' semiconductor optical amplifiers, monolithically integrated within a symmetric Mach-Zehnder interferometer.
Fiber pigtailing and packaging of nanowaveguide circuits are key technologies to realize nanophot... more Fiber pigtailing and packaging of nanowaveguide circuits are key technologies to realize nanophotonic applications. Technical problems start with a large mode mismatch of nanowires and standard single-mode fibers, which requires innovative coupling structures for low coupling loss and for large alignment tolerances. Looking further ahead, solutions are needed that allow for wafer level optical device testing and also for reduced packaging costs. These are essential ingredients for making nanophotonics a truly competitive and large scale technology. In the following we shall present work that focuses exactly on such issues, covering a general evaluation of coupling techniques, silicon grating couplers, fiber array packaging of silicon nanophotonic circuits, and roads to reduced costs and generic nanophotonic packaging.
2005 IEEE LEOS Annual Meeting Conference Proceedings, 2005
We report electrical and optical injection locking of an InP colliding pulse mode locked laser em... more We report electrical and optical injection locking of an InP colliding pulse mode locked laser emitting synchronized, nearly transform-limited output pulses at 10.3 GHz, fabricated by active-passive integration and a single step regrowth process.
International Symposium on Microelectronics, 2013
Optical Components and Materials VI, 2009
In this work a compact green laser light source is presented based on a single-pass second harmon... more In this work a compact green laser light source is presented based on a single-pass second harmonic generation (SHG) in non-linear material. The green light source consists of a distributed feedback (DFB) laser with a monolithically integrated power amplifier (PA) and a periodically poled lithium niobate (PPLN) crystal with a ridge waveguide. To achieve the smallest size and to reduce the number of parts to be assembled, a direct coupling approach is implemented without using any lens. The waveguide of the laser is bent and the facet of the crystal is tilted and AR-coated in order to reduce undesired reflections and to increase the stability of operation. By varying the injection current of the amplifier the infrared output power of the laser changes proportionally. The wavelength remains stable during current variation and in that way the green optical output power can also be modulated. No additional external modulator is required for the generation of distinct green light levels. At a wavelength of 530 nm, a green optical output power of more than 35 mW is achieved for injection currents of 93 mA and 400 mA through the DFB section and amplifier section respectively.
2009 6th IEEE International Conference on Group IV Photonics, 2009
Coupling loss of 7.5dB are measured at λ=1.55µm. A spectrum broader than 70nm is observed.
Conference on Lasers and Electro-Optics 2012, 2012
ABSTRACT This tutorial reviews the physics of surface plasmon circuitry in order to bring to the ... more ABSTRACT This tutorial reviews the physics of surface plasmon circuitry in order to bring to the fore recently demonstrated applications of surface plasmon in optoelectronics such as on-board optical interconnects or routing in datacom networks.
39th European Conference and Exhibition on Optical Communication (ECOC 2013), 2000
ABSTRACT High-speed electronic integrated circuits are essential to the development of new fiber-... more ABSTRACT High-speed electronic integrated circuits are essential to the development of new fiber-optic communication systems. Close integration and co-design of photonic and electronic devices are becoming more and more a necessity to realize the best performance trade-offs. This paper presents our most recent results and a brief introduction to our research in recently started EU projects.
High-Power Diode Laser Technology and Applications VII, 2009
ABSTRACT Laser diodes and diode laser bars are key components in high power semiconductor lasers ... more ABSTRACT Laser diodes and diode laser bars are key components in high power semiconductor lasers and solid state laser systems. During manufacture, the assembly of the fast axis collimation (FAC) lens is a crucial step. The goal of our activities is to design an automated assembly system for high volume production. In this paper the results of an intermediate milestone will be reported: a demonstration system was designed, realized and tested to prove the feasibility of all of the system components and process features. The demonstration system consists of a high precision handling system, metrology for process feedback, a powerful digital image processing system and tooling for glue dispensing, UV curing and laser operation. The system components as well as their interaction with each other were tested in an experimental system in order to glean design knowledge for the fully automated assembly system. The adjustment of the FAC lens is performed by a series of predefined steps monitored by two cameras concurrently imaging the far field and the near field intensity distributions. Feedback from these cameras processed by a powerful and efficient image processing algorithm control a five axis precision motion system to optimize the fast axis collimation of the laser beam. Automated cementing of the FAC to the diode bar completes the process. The presentation will show the system concept, the algorithm of the adjustment as well as experimental results. A critical discussion of the results will close the talk.
Silicon Photonics IX, 2014
ABSTRACT Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for... more ABSTRACT Hybrid integration on Silicon-on-Insulator (SOI) has emerged as a practical solution for compact and high-performance Photonic Integrated Circuits (PICs). It aims at combining the cost-effectiveness and CMOS-compatibility benefits of the low-loss SOI waveguide platform with the versatile active optical functions that can be realized by III-V photonic materials. The utilization of SOI, as an integration board, with μm-scale dimensions allows for an excellent optical mode matching between silicon rib waveguides and active chips, allowing for minimal-loss coupling of the pre-fabricated IIIV components. While dual-facet coupling as well as III-V multi-element array bonding should be employed to enable enhanced active on-chip functions, so far only single side SOA bonding has been reported. In the present communication, we present a novel integration scheme that flip-chip bonds a 6-SOA array on 4-μm thick SOI technology by coupling both lateral SOA facets to the waveguides, and report on the experimental results of wavelength conversion operation of a dual-element Semiconductor Optical Amplifier - Mach Zehnder Interferometer (SOA-MZI) circuit. Thermocompression bonding was applied to integrate the pre-fabricated SOAs on SOI, with vertical and horizontal alignment performed successfully at both SOA facets. The demonstrated device has a footprint of 8.2mm x 0.3mm and experimental evaluation revealed a 12Gb/s wavelength conversion operation capability with only 0.8dB power penalty for the first SOA-MZI-on-SOI circuit and a 10Gb/s wavelength conversion operation capability with 2 dB power penalty for the second SOA-MZI circuit. Our experiments show how dual facet integration can significantly increase the level of optical functionalities achievable by flip-chip hybrid technology and pave the way for more advanced and more densely PICs.
2008 34th European Conference on Optical Communication, 2008
Commercial multi-fibre array coupled to vertical grating coupler on a SOI (Silicon on insulator) ... more Commercial multi-fibre array coupled to vertical grating coupler on a SOI (Silicon on insulator) chip, which is suitable for cost effective, compact interconnect for smart photonics packaging (ePIXpack).
8th IEEE International Conference on Group IV Photonics, 2011
ABSTRACT A package solution for silicon photonic integrated circuits with multiple input/output g... more ABSTRACT A package solution for silicon photonic integrated circuits with multiple input/output grating-based optical interfaces is proposed and experimentally demonstrated. The approach is based on using a subassembly sub-mount carrier to maintain standard-compatible lateral orientation for the fibers in the package.
Integrated Optics: Devices, Materials, and Technologies XIV, 2010
Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Ne... more Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.
2010 23rd Annual Meeting of the Ieee Photonics Society, 2010
We present recent work that is carried out within the FP7 project PLATON on novel Tb/s switch fab... more We present recent work that is carried out within the FP7 project PLATON on novel Tb/s switch fabric architectures and technologies for optical interconnect applications, employing heterointegration of plasmonics, silicon photonics and electronics.
Proceedings of SPIE - The International Society for Optical Engineering, 2011
Surface plasmons polaritons are electromagnetic waves propagating along the surface of a conducto... more Surface plasmons polaritons are electromagnetic waves propagating along the surface of a conductor. Surface plasmons photonics is a promising candidate to satisfy the constraints of miniaturization of optical interconnects. This contribution reviews an experimental parametric study of dielectric loaded surface plasmon waveguides ring resonators and add-drop filters within the perspective of the recently suggested hybrid technology merging plasmonic and silicon photonics on a single board (European FP7 project PLATON "Merging Plasmonic and Silicon Photonics Technology towards Tb/s routing in optical interconnects"). Conclusions relevant for dielectric loaded surface plasmon switches to be integrated in silicon photonic circuitry will be drawn. They rely on the opportunity offered by plasmonic circuitry to carry optical signals and electric currents through the same thin metal circuitry. The heating of the dielectric loading by the electric current enables to design low foot-print thermo-optical switches driving the optical signal flow.
Photonic Materials, Devices, and Applications III, 2009
Technological frontiers between semiconductor technology, packaging, and system design are disapp... more Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through