david Sbiroli - Profile on Academia.edu (original) (raw)
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Kwame Nkrumah University of Science and Technology, Kumasi Ghana
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Papers by david Sbiroli
High-density assembly and root cause analyses
Implementing high-density assembly in all electronic products requires many considerations. Befor... more Implementing high-density assembly in all electronic products requires many considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities. If this is not fully understood, failure is the most probable outcome. This paper will discuss selection of the correct solder paste based on the end product and the need to conduct proper root cause analyses before making any material or process changes.
IMAPSource Proceedings
System-in-Package (SiP) assembly has become a popular solution for the challenges of continued mi... more System-in-Package (SiP) assembly has become a popular solution for the challenges of continued miniaturization in the semiconductor industry. The continued and expected growth of the semiconductor industry in the coming years is driving more advanced assembly methods within System-in-Package and advanced packaging in general, and more advanced semiconductor assembly materials are required to meet those challenges such as solder paste specifically designed for SiP assembly, with fine solder powder and specifically formulated flux vehicles. Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly. Small stencil aperture designs have necessitated fine-powder solder pastes, with type 5, type 6, and type 7 being common, as well as there being a need for type 8 for future, more advanced designs. Additionally, as more components are being packed into a SiP, solder paste rheology becomes an important characteristic to consider. Printing transfer ...
Sustaining a Robust Fine Feature Printing Process
With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component... more With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift
High-density assembly and root cause analyses
2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016
Sustaining a Robust Fine Feature Printing Process
With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component... more With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift
High-density assembly and root cause analyses
Implementing high-density assembly in all electronic products requires many considerations. Befor... more Implementing high-density assembly in all electronic products requires many considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities. If this is not fully understood, failure is the most probable outcome. This paper will discuss selection of the correct solder paste based on the end product and the need to conduct proper root cause analyses before making any material or process changes.
IMAPSource Proceedings
System-in-Package (SiP) assembly has become a popular solution for the challenges of continued mi... more System-in-Package (SiP) assembly has become a popular solution for the challenges of continued miniaturization in the semiconductor industry. The continued and expected growth of the semiconductor industry in the coming years is driving more advanced assembly methods within System-in-Package and advanced packaging in general, and more advanced semiconductor assembly materials are required to meet those challenges such as solder paste specifically designed for SiP assembly, with fine solder powder and specifically formulated flux vehicles. Fine feature solder paste printing as an assembly method continues to be a challenge for SiP assembly. Small stencil aperture designs have necessitated fine-powder solder pastes, with type 5, type 6, and type 7 being common, as well as there being a need for type 8 for future, more advanced designs. Additionally, as more components are being packed into a SiP, solder paste rheology becomes an important characteristic to consider. Printing transfer ...
Sustaining a Robust Fine Feature Printing Process
With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component... more With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift
High-density assembly and root cause analyses
2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 2016
Sustaining a Robust Fine Feature Printing Process
With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component... more With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift