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Thesis Chapters by Asfand Ali

Research paper thumbnail of Analysis of Electroplating Plant on Different Materials

This paper describes a copper electroplating enabling technology for filling microvias .Driven by... more This paper describes a copper electroplating enabling technology for filling microvias .Driven by the need for faster, smaller and higher performance communication and electronic devices; build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages.

Papers by Asfand Ali

Research paper thumbnail of The ATLAS experiment at the CERN large hadron collider

Journal of Instrumentation, 2008

and placement strategy 9.4 Infrastructure and detector services 9.4.1 Civil engineering 9.4.2 Ele... more and placement strategy 9.4 Infrastructure and detector services 9.4.1 Civil engineering 9.4.2 Electrical power distribution 9.4.3 Airconditioning and cooling systems 9.4.4 Gas distribution 9.4.5 Cryogenic systems 9.4.6 Racks and cables 9.4.7 Drag-chains and mobile services 9.4.8 Grounding and electromagnetic compatibility 9.5 Support and access structures 9.5.1 Feet and rail system 9.5.2 Trucks 9.5.3 Surrounding structures (HS and HO) 9.5.4 Muon barrel access structures 9.5.5 Big wheels 9.6 Detector installation 9.6.1 Phase 1: infrastructure in the main cavern, feet and rails 9.6.2 Phase 2: barrel calorimetry and barrel toroid 9.6.3 Phase 3: end-cap calorimeters and muon barrel chambers 9.6.4 Phase 4: muon big wheels, inner detector and completion of muon barrel 9.6.5 Phase 5: end-cap toroid magnets and muon small wheels 9.6.6 Phase 6: beam-pipe and forward shielding 9.7 Access and detector opening 9.7.1 Access scenarios 9.7.2 Movement system 9.8 Beam-pipe 9.9 Safety in ATLAS 9.9.1 Organisation of safety 9.9.2 Access control 9.9.3 Safety systems 9.9.4 Detector safety system 9.9.5 Safety during operation 9.10 Interface to the LHC machine

Research paper thumbnail of Analysis of Electroplating Plant on Different Materials

This paper describes a copper electroplating enabling technology for filling microvias .Driven by... more This paper describes a copper electroplating enabling technology for filling microvias .Driven by the need for faster, smaller and higher performance communication and electronic devices; build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages.

Research paper thumbnail of The ATLAS experiment at the CERN large hadron collider

Journal of Instrumentation, 2008

and placement strategy 9.4 Infrastructure and detector services 9.4.1 Civil engineering 9.4.2 Ele... more and placement strategy 9.4 Infrastructure and detector services 9.4.1 Civil engineering 9.4.2 Electrical power distribution 9.4.3 Airconditioning and cooling systems 9.4.4 Gas distribution 9.4.5 Cryogenic systems 9.4.6 Racks and cables 9.4.7 Drag-chains and mobile services 9.4.8 Grounding and electromagnetic compatibility 9.5 Support and access structures 9.5.1 Feet and rail system 9.5.2 Trucks 9.5.3 Surrounding structures (HS and HO) 9.5.4 Muon barrel access structures 9.5.5 Big wheels 9.6 Detector installation 9.6.1 Phase 1: infrastructure in the main cavern, feet and rails 9.6.2 Phase 2: barrel calorimetry and barrel toroid 9.6.3 Phase 3: end-cap calorimeters and muon barrel chambers 9.6.4 Phase 4: muon big wheels, inner detector and completion of muon barrel 9.6.5 Phase 5: end-cap toroid magnets and muon small wheels 9.6.6 Phase 6: beam-pipe and forward shielding 9.7 Access and detector opening 9.7.1 Access scenarios 9.7.2 Movement system 9.8 Beam-pipe 9.9 Safety in ATLAS 9.9.1 Organisation of safety 9.9.2 Access control 9.9.3 Safety systems 9.9.4 Detector safety system 9.9.5 Safety during operation 9.10 Interface to the LHC machine