Crystallographic characterization of interconnects by orientation mapping in the SEM (original) (raw)

Local crystallography and stress voiding in Al–Si–Cu versus copper interconnects

Journal of Applied Physics, 1999

Analysis of grain-boundary structure in Al–Cu interconnects

John Sanchez

Journal of Applied Physics, 1997

Measurement of strain in Al–Cu interconnect lines with x-ray microdiffraction

Zhong-hou Cai

Journal of Applied Physics, 1999

Local textures and grain boundaries in voided copper interconnects

Journal of Electronic Materials, 1997

Localized Measurement of Strains in Damascene Copper Interconnects by Convergent-Beam Electron Diffraction

MRS Proceedings, 2000

Grain orientation mapping of passivated aluminum interconnect wires with X-ray micro-diffraction

Alastair MacDowell

1998

Local crystallographic texture and voiding in passivated copper interconnects

Applied Physics Letters, 1996

Effects of Local Crystallography on Stress-Induced Voiding in Passivated Copper Interconnects

1997

X-ray microdiffraction study of Cu interconnects

Zhong-hou Cai

Applied Physics Letters, 2000

Grain Structure Statistics in As-Patterned and Annealed Interconnects

Harold Frost

MRS Proceedings, 1998

Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction

Applied Physics Letters, 2006

Electromigration-Induced Plastic Deformation in Cu Damascene Interconnect Lines as Revealed by Synchrotron X-Ray Microdiffraction

Arief Budiman

MRS Proceedings, 2006

Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy

Kristof croes

Applied Physics Letters, 2018

Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Linda Vanasupa

Journal of Applied Physics, 1999

Modeling of Grain Structure Evolution and its Impact on the Reliability of Al(Cu) Thin Film Interconnects

Harold Frost

MRS Proceedings, 1997

Strain and Texture in Al-Interconnect Wires Weasured by X-Xay Microbeam Diffraction

MRS Proceedings, 1999

Nanoscale Topography Characterization for Direct Bond Interconnect

Jeremy Theil

IEEE 69th Electronic Components and Technology Conference (ECTC), 2019

Strain and texture in Al-interconnect wires measured by X-ray microbeam diffraction

Materials Research …, 1999

\u3ci\u3eIn situ\u3c/i\u3e STEM Technique for Characterization of Nanoscale Interconnects During Electromigration Testing

Ismail Gobulukoglu

1999

Microstructural characterization of inlaid copper interconnect lines

Martin Gall

Journal of Electronic Materials, 2001

Electrical Methods for Mechanical Characterization of Interconnect Thin Films

Cynthia Volkert

2006

Microtexture and strain in electroplated copper interconnects

2000

Plastic deformation in Al (Cu) interconnects stressed by electromigration and studied by synchrotron polychromatic x-ray microdiffraction

Journal of Applied Physics, 2008

The Influence of Grain Structure on the Reliability of Narrow Al-Based Interconnects

Choong-un Kim

MRS Proceedings, 1995

The effect of different step-size on the visualization of crystallographic defects using SEM/EBSD technique

Yoshikazu Higa

The International Journal of Multiphysics, 2015

Electrical Methods for Mechanical Characterization of Interconnect Thin Films | NIST

Roy Geiss

2005

In Situ Stem Technique for Characterization of Nanoscale Interconnects During Electromigration Testing

Ismail Gobulukoglu

Mrs Proceedings, 1999

Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction

Haruo Akahoshi

Materials transactions, 2007