PIV measurement of cooling flow in a thin electronics casing (original) (raw)
2004, Kashika Jōhō Gakkaishi
Cooling air flow in a thin electronics casing was measured using PIV. Temperature rise in the casing was also measured. The effect of the arrangement of the inlet opening on cooling performance was examined. Measured vector maps shows that the change of flow direction is relatively small. As a result, cooling performance is maximized when the distance between the opening and the heat source is small.
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