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Ye Yen
Thin Solid Films, 2005
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Tantalum carbide and nitride diffusion barriers for Cu metallisation
Tomi Laurila
Microelectronic Engineering, 2002
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Study of nanocrystalline Ta(N,O) diffusion barriers for use in Cu metallization
Christian Wenzel
Microelectronic Engineering, 1997
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The Effect of Substrate on Structural and Electrical Properties of Cu3N Thin Film by DC Reactive Magnetron Sputtering
vahdat rafee
Physical Chemistry Research, 2017
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Effect of sputtering power on structural, morphological, chemical, optical and electrical properties of Ti:Cu 3 N nano-crystalline thin films
ali Rahmati
The European Physical Journal Applied Physics, 2012
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Microstructure Analysis of TaN/Cu Nanocomposite Coatings Deposited by Pulsed DC Magnetron Sputtering
Elangovan Thangavel, D. Mangalaraj
Advanced Materials Research, 2010
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Growth of (Ti,Zr)N Films on Si by DC Reactive Sputtering of TiZr in N[sub 2]/Ar Gas Mixtures
Chih-huang Lai
Journal of The Electrochemical Society, 2004
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Atomic Layer Deposition of Molybdenum Nitride Thin Films for Cu Metallizations
Kai Arstila, J. Keinonen
Journal of The Electrochemical Society, 2005
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Reactive DC magnetron sputter deposited copper nitride nano-crystalline thin films: growth and characterization
Ahmad Rahmati
Vacuum
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Reactive magnetron sputter deposition of (Ti,Cu)N nano-crystalline thin films: modeling of particle and energy flux toward the substrate
ali Rahmati
Physica Scripta, 2012
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Structure and Morphology of the Cu Films Grown by DC Magnetron Sputtering
A. Gelali
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Effectiveness of reactive sputter-deposited Ta–N films as diffusion barriers for Ag metallization
Daniel Adams
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004
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X-ray structure characterization of barriers for Cu metallization
Ehrenfried Zschech
Microelectronics Reliability, 2000
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Cu-N Films grown by reactive MSIP: Constitution, structure and morphology
Rainer Cremer
Mikrochimica Acta, 1997
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TiN Diffusion Barrier Grown by Atomic Layer Deposition Method for Cu Metallization
Hyeongtag Jeon
Japanese Journal of Applied Physics, 2001
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Characterization of Atomic Layer Deposited WN[sub x]C[sub y] Thin Film as a Diffusion Barrier for Copper Metallization
Suvi Haukka
Journal of The Electrochemical Society, 2004
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Study of Ta–Si–N thin films for use as barrier layer in copper metallizations
Dietrich Fischer
Microelectronic Engineering, 2000
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Strain Effects by Surface Oxidation of Cu3N Thin Films Deposited by DC Magnetron Sputtering
Christiane Helm
Coatings
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Metallic Cu and In films deposited by d.c. magnetron sputtering
Julius Mwabora
2001
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Microstructural comparisons of ultrathin Cu films deposited by ion-beam and dc-magnetron sputtering
Jonathan D Daniels
Journal of Applied Physics, 2005
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Addition of silver in copper nitride films deposited by reactive magnetron sputtering
D. Horwat
Scripta Materialia, 2008
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Preparation and characterization of copper nitride films at various nitrogen contents by reactive radio-frequency magnetron sputtering
Yu Ming Tang
Materials Letters, 2006
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Structural and functional characterization of W-Si-N sputtered thin films for copper metallizations
Alberto Quaranta
MRS Proceedings, 2004
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Effect of TaN intermediate layer on the back contact reaction of sputter-deposited Cu poor Cu2ZnSnS4 and Mo
HENRY MEDINA
Applied Surface Science, 2018
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Fabrication and crystallization behaviors of sputtered Ni–Cu–P films on tool steel
YUNG-I CHEN
Surface and Coatings Technology, 2001
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Analysis of Ti–Si–N diffusion barrier films obtained by r.f. magnetron sputtering
A. Granier, Stephane Guilet
Microelectronic Engineering, 2000
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Standard and self-sustained magnetron sputtering deposited Cu films investigated by means of AFM and XRD
Paweł Wiatrowski
Microelectronics Reliability, 2011
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In Situ Ramp Anneal X-ray Diffraction Study of Atomic Layer Deposited Ultrathin TaN and Ta1-xAlxNyFilms for Cu Diffusion Barrier Applications
Gert Leusink
ECS Journal of Solid State Science and Technology, 2016
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Improving phase stability, hardness, and oxidation resistance of reactively magnetron sputtered (Al,Cr,Nb,Ta,Ti)N thin films by Si-alloying
Helmut Rudigier
Surface and Coatings Technology, 2021
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Diffusion evaluation of Cu in NiTi Bi-layer thin film interface
maryam mohri
Journal of Alloys and Compounds, 2014
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Influence of interfacial copper during the dealloying and nitridation of Cu-Ti films
Daniel Adams
Materials Chemistry and Physics, 1996
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The influence of nitrogen plasma on characteristics of Cu thin film deposited on Si substrate by DC magnetron sputtering technique
Kiomars Yasserian
2002
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Multilayer diffusion barrier for copper metallization using a thin interlayer metal (M=Ru, Cr, and Zr) between two TiN films
Hyun-Mi Kim
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2003
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Nitride films deposited from an equimolar Al–Cr–Mo–Si–Ti alloy target by reactive direct current magnetron sputtering
Jien-wei Yeh
Thin Solid Films, 2008
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Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization
Ming-Hung Tsai
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