CFD Analysis of Flow and Heat Transfer in a Novel Heat Sink for Electronic Devices (original) (raw)
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A heat sink is an important passive heat exchanger in the thermal management of electronic devices or systems. The study aims to analyze the influence of the inlet velocity and heat flux on the thermal characteristics (i.e., static temperature and heat transfer coefficient) of three heat sink designs. Computational fluid dynamics (CFD) analysis is carried out for the electronic cooling process. Three heat sink designs, namely, circular pin fin, plate fin, and rectangular fin are considered in this study. The influence of the inlet velocity and heat flux on the temperature distribution and heat transfer coefficient was analyzed. The results revealed that the use of circular pin resulted the highest temperature drop when the inlet velocity increased. The highest heat transfer coefficient was observed on the circular pin fin design during the cooling process. The heat flux demonstrated a linear correlation with the temperature for all heat sink designs. The effectiveness of the heat transfer was attributed by the heat sink design and inlet velocity of the airflow. Thus, the current results indicated the thermal characteristics of the heat sink are crucially influenced by the design and velocity of airflow in the cooling process.
CFD Study of Using Different Heat Sinks for Electronic Equipments Cooling
Journal of Engineering Research, 2019
Cooling of Electronic equipment’s is an attractive research area in engineering applications. Continued minimization of electronic system has resulted in dramatic increase in the amount of heat generated per unit volume, The aim of this study is to use computational Fluid Dynamics in order to draw a CFD model for forced cooling conjugate heat transfer analyses in heat generating electronic systems and compare between a collection of actual commercial heat sinks different from in geometry ,material , and number of fins .A complete computer chassis model with heat sinks and fans inside was created and parametric analyses were performed to compare the effects of different turbulence models, mesh resolutions, and radiative heat transfer. The CFD software was used, ANSYS Icepack 18.0 for preprocessing and fluent for solution and post processing. The road map was applied to five different heat sinks and another three heat sink as a validation modeled into the full chassis. Numerical resul...
Effect of heat sink design on the thermal characteristic in computational fluid dynamics analysis
The thermal management in the electronic device or system using the heat sink is important to ensure the device or system operating under the allowable temperature. The present study aims to investigate the thermal characteristic (i.e., temperature distribution) of the various heat sink designs via computational fluid dynamics (CFD) analysis. The electronic cooling process of the heat sink is carried out via CFD software. The temperature distribution of the various heat sink designs (i.e., plate fin, circular pin fin and rectangular fin) was analyzed and compared. The CFD analysis revealed the plate fin heat sink has lowest temperature distribution on the fin region. High temperature distribution was observed on the pin fin heat sink. The non-uniform temperature distribution was attributed by the direction of inlet airflow, whereas the low temperature was found in the region that close to the inlet airflow. Thus, the research findings indicated the design of heat sink significantly affects the temperature distribution during the electronic cooling process.
NUMERICAL INVESTIGATION ON HEAT SINK BY COMPUTATIONAL FLUID DYNAMICS (CFD)
The forced-air cooling technique, one of the effective methods for thermal management of electronic equipment cooling, is commonly used in a conventional-size heat sink. Conventional or mini sized heat sinks are commonly used in many industrial applications as cooling devices, because of their easy serviceability, high reliability, simplicity in the mechanism of heat transfer and ease of testing. In this paper heat sink is designed and investigated for different velocity variation at the inlet to select appropriate fan to cool the heat sink and also effect of ambient conditions on the heat sink are studied. Finally the results are compared with the Computational Fluid Dynamics software FLUENT.
2015
It is observed that components of modern portable electronic devices with increasing heat loads with decrease in the space available for heat dissipation. The increasing heat load of the device needs to be removed for maintaining the efficient performance of the device. The exponential increase in thermal load in air cooling devices requires the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. Adding fins to the heat sink increases surface area but it increases the pressure drop. This reduces the volumetric airflow and the heat transfer coefficient. In order to have a better system the number of fins in a given area can be optimized to obtain the effective performance keeping the working temperature less than the critical temperature in the device. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. "fan-on-top" and "fan-on-side" are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD).The primary goal of this work is to find the optimization point for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode, when the fan fails to operate. The CFD simulations will be performed for optimization of heat sink parameters with objective function of maximization of heat transfer coefficient. The optimum combination of parameters and results will be verified and compared with commercially available heat sink.
2015
Modern portable electronic devices are becoming more compact in space, The exponential increase in thermal load in air cooling devices require the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. “fan-on-top” and “fan-on-side” are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD). The primary goal of this work is to do the thermal analysis and comparison of fan orientation on cooling efficiency and to find the optimum parameters for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode (i.e. Fan-failed conditi...
Comparative study of heat sink without shield and heat sink with shield using CFD analysis
IOSR Journal of Mechanical and Civil Engineering, 2014
The whole idea of this study is to compare heat sink without shield and heat sink with shield used in electronic cooling system. The study is based on the principle of Computational fluid dynamics (CFD) in which the flow of fluid is taken into consideration for study. For the purpose of study heat sink with optimal geometric parameter such as fin height, fin thickness, base height, fin pitch as 48 mm, 1.6 mm, 8mm, 4mm are modeled and also the shield is provided to this heat sink with trapezoidal shape. The simulation is done on models with the parameters like heat load of 75W and with air velocity of 4.717 m/s and inlet temperature is taken as 295 K etc. The simulation is carried out with a commercial package provided by fluent incorporation. The thermal performances of the heat sinks are only considered in the study. Nowadays technological development is done considering the performance of device; whether it is a normal computer or laptop or the rack server we need everything that can be work at its best, so here the thermal equivalency plays major role as you cannot allows overheating of device. So in this paper the effort are taken to enhance the heat dissipation efficiently.
This paper deals with the comparative study of heat sink having fins with shield of various profiles namely Trapezoidal with curved and plane inclination and slope shield as heat sinks are the commonly used devices for enhancing heat transfer in electronic components. For the purpose of study heat sink is modeled by using the optimal geometric parameter such as fin height, fin thickness, base height, fin pitch as 48 mm, 1.6 mm, 8mm, 4mm and after that simulation is done at heat load of 75W and with a air velocity of 4.7171m/s and air inlet temperature is taken as 295 K. The simulation is carried out with a commercial package provided by fluent incorporation. The result obtained taking into consideration only the thermal performance. As per the current era of the technological development everything is needed to be compact; whether it is a normal computer or laptop or the rack server we need everything that can be placed in a small space, so here the space constraint plays an major role as you cannot install a large heat sink for your device as it increases the size and the cost. So in this paper the pitch of fin is kept 4mm and heat load of 75w.
International Journal of Engineering Research and Technology (IJERT), 2016
https://www.ijert.org/thermal-design-and-analysis-of-heat-sink-optimization-and-its-comparison-with-commercially-available-heat-sink https://www.ijert.org/research/thermal-design-and-analysis-of-heat-sink-optimization-and-its-comparison-with-commercially-available-heat-sink-IJERTV4IS120321.pdf Modern portable electronic devices are becoming more compact in space, The exponential increase in thermal load in air cooling devices require the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. "fan-on-top" and "fan-on-side" are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD). The primary goal of this work is to do the thermal analysis and comparison of fan orientation on cooling efficiency and to find the optimum parameters for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode (i.e. Fan-failed condition). The CFD simulations are performed for optimization of heat sink parameters with objective function of maximization of heat transfer coefficient.
Gümüşhane Üniversitesi Fen Bilimleri Enstitüsü Dergisi, 2021
The most critical problems of electronic components are the high power consumption and lesser life. This paper aims to numerically model the working process of the water-cooled heat sink to obtain the most effective design. In this context, four types of configurations with different passes (Type-A, Type-B, Type-C, TypeD) were designed at different water velocities, which were 0.25 m/s, 0.5 m/s, and 1 m/s with constant air velocity (6 m/s) to simulate fluid flow and the heat transfer. Results were evaluated as temperature and pressure contours, velocity streamlines, and the graphics of pressure difference, outlet temperature, temperature difference, heat transfer rate to air, and power consumption in relation to Reynolds number. Results showed that pressure difference, outlet temperature, power consumption, and heat transfer rate to air increased by increasing Reynolds number in all analyses. In all configurations, the water outlet temperatures were very close to each other, in the range of 63-65 °C for Re=2500, 70-72 °C for Re=5000, and 74-76 °C for Re=10000. Among all configurations, Type-A has the minimum outlet temperature with the value of 63.40 °C for Re=2500, 70.77 °C for Re=5000, and 74.85 °C for Re=10000. Also, Type-A showed better performance than other models in terms of heat transfer rate to air with the value of 1346 W for Re=2500, 1500 W for Re=5000, and 1675 W for Re=10000. The maximum pressure difference was obtained in Type-A geometry with the value of nearly 3500 Pa at a Reynolds number value of 10000. When the results were evaluated in full scope, it was concluded that Type-B was the most suitable model for use in terms of heat transfer, pump power, and inlet-outlet positions.