IJERT-Thermal Design and Analysis of Heat Sink Optimization and its Comparison with Commercially Available Heat Sink (original) (raw)
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2015
Modern portable electronic devices are becoming more compact in space, The exponential increase in thermal load in air cooling devices require the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. “fan-on-top” and “fan-on-side” are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD). The primary goal of this work is to do the thermal analysis and comparison of fan orientation on cooling efficiency and to find the optimum parameters for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode (i.e. Fan-failed conditi...
2015
It is observed that components of modern portable electronic devices with increasing heat loads with decrease in the space available for heat dissipation. The increasing heat load of the device needs to be removed for maintaining the efficient performance of the device. The exponential increase in thermal load in air cooling devices requires the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. Adding fins to the heat sink increases surface area but it increases the pressure drop. This reduces the volumetric airflow and the heat transfer coefficient. In order to have a better system the number of fins in a given area can be optimized to obtain the effective performance keeping the working temperature less than the critical temperature in the device. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. "fan-on-top" and "fan-on-side" are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD).The primary goal of this work is to find the optimization point for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode, when the fan fails to operate. The CFD simulations will be performed for optimization of heat sink parameters with objective function of maximization of heat transfer coefficient. The optimum combination of parameters and results will be verified and compared with commercially available heat sink.
CFD Study of Using Different Heat Sinks for Electronic Equipments Cooling
Journal of Engineering Research, 2019
Cooling of Electronic equipment’s is an attractive research area in engineering applications. Continued minimization of electronic system has resulted in dramatic increase in the amount of heat generated per unit volume, The aim of this study is to use computational Fluid Dynamics in order to draw a CFD model for forced cooling conjugate heat transfer analyses in heat generating electronic systems and compare between a collection of actual commercial heat sinks different from in geometry ,material , and number of fins .A complete computer chassis model with heat sinks and fans inside was created and parametric analyses were performed to compare the effects of different turbulence models, mesh resolutions, and radiative heat transfer. The CFD software was used, ANSYS Icepack 18.0 for preprocessing and fluent for solution and post processing. The road map was applied to five different heat sinks and another three heat sink as a validation modeled into the full chassis. Numerical resul...
NUMERICAL INVESTIGATION ON HEAT SINK BY COMPUTATIONAL FLUID DYNAMICS (CFD)
The forced-air cooling technique, one of the effective methods for thermal management of electronic equipment cooling, is commonly used in a conventional-size heat sink. Conventional or mini sized heat sinks are commonly used in many industrial applications as cooling devices, because of their easy serviceability, high reliability, simplicity in the mechanism of heat transfer and ease of testing. In this paper heat sink is designed and investigated for different velocity variation at the inlet to select appropriate fan to cool the heat sink and also effect of ambient conditions on the heat sink are studied. Finally the results are compared with the Computational Fluid Dynamics software FLUENT.
CFD Analysis of Flow and Heat Transfer in a Novel Heat Sink for Electronic Devices
Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 2010
ABSTRACT Novel flow channel configurations in heat sinks for electronics cooling were proposed in this paper. Computational analyses were carried out to better understand the heat transfer performance, the uniformity of temperature fields of the heat sinking surface, as well as the pressure losses and pumping power in the operation of heat sinks. Comparison of the overall performance regarding to temperature uniformity on the heat sink surface and pumping power consumption was made for heat sinks having novel flow channel configurations and having traditional flow channel configurations. It has been found that the novel flow channel configuration dramatically reduces the pressure loss in the flow field. Giving the same pumping power consumption of an electronics cooling process, the temperature difference on surface of the heat sink which has novel flow channel configuration can be much lower than that of the heat sinks which have traditional flow channel configurations.
CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
Journal of Electronic Packaging, 2010
Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires enhancement. Chimneylike flows developed within the cabinets of electronic devices can provide better mass flow and heat transfer rates and can lead to greater cooling efficiency. Constraints in the design of natural convection cooling systems include efficiency of packing, aesthetics, and concerns of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation on natural convection cooling within such design constraints. Insights thus derived are found useful for designing an ene...
International Journal of Engineering Research and Technology (IJERT), 2021
https://www.ijert.org/design-and-simulation-of-heat-sink-for-different-components-geometry-with-various-heat-capacities https://www.ijert.org/research/design-and-simulation-of-heat-sink-for-different-components-geometry-with-various-heat-capacities-IJERTV10IS060362.pdf This Electronic device cooling system is capable of satisfying required capacity electronic device. This paper details the results of a study to develop a geometry based optimization tool for heat sink design. Variation in the design aspects of the heat sink components, the cooling of electronic devices is possible. Geometry of heat sink, effect heat convention capability, size and weight of the component. Electronic warfare devices, obviously uses electronic chips. These components generate Power as they function. This power generation goes hand in hand with the generation of heat. Heat generated can be quite harmful to this electronic equipment & may also decrease the efficiency. The problem is even greater when the electronic set up is placed in a hot environment. This high temperatures, decreases the life span of the component, might even cause permanent damage to the equipment. Hence, it becomes necessary to manage the thermal issues by designing suitable heat sinks, such that the power is efficiently dissipated. This project involves designing a heat sink, for an electronic chip of area (80mm * 60mm) that is placed in the environment in which the temperatures reaches up to 55 degree Celsius. Steps were taken to solve the problem using design formulas with respect to the given specifications & the ambient temperature.
This paper deals with the comparative study of heat sink having fins with shield of various profiles namely Trapezoidal with curved and plane inclination and slope shield as heat sinks are the commonly used devices for enhancing heat transfer in electronic components. For the purpose of study heat sink is modeled by using the optimal geometric parameter such as fin height, fin thickness, base height, fin pitch as 48 mm, 1.6 mm, 8mm, 4mm and after that simulation is done at heat load of 75W and with a air velocity of 4.7171m/s and air inlet temperature is taken as 295 K. The simulation is carried out with a commercial package provided by fluent incorporation. The result obtained taking into consideration only the thermal performance. As per the current era of the technological development everything is needed to be compact; whether it is a normal computer or laptop or the rack server we need everything that can be placed in a small space, so here the space constraint plays an major role as you cannot install a large heat sink for your device as it increases the size and the cost. So in this paper the pitch of fin is kept 4mm and heat load of 75w.
A heat sink is an important passive heat exchanger in the thermal management of electronic devices or systems. The study aims to analyze the influence of the inlet velocity and heat flux on the thermal characteristics (i.e., static temperature and heat transfer coefficient) of three heat sink designs. Computational fluid dynamics (CFD) analysis is carried out for the electronic cooling process. Three heat sink designs, namely, circular pin fin, plate fin, and rectangular fin are considered in this study. The influence of the inlet velocity and heat flux on the temperature distribution and heat transfer coefficient was analyzed. The results revealed that the use of circular pin resulted the highest temperature drop when the inlet velocity increased. The highest heat transfer coefficient was observed on the circular pin fin design during the cooling process. The heat flux demonstrated a linear correlation with the temperature for all heat sink designs. The effectiveness of the heat transfer was attributed by the heat sink design and inlet velocity of the airflow. Thus, the current results indicated the thermal characteristics of the heat sink are crucially influenced by the design and velocity of airflow in the cooling process.
Numerical Cooling Simulation on Laptop Heat Sinks with Variations of Different Airflow Speeds
VANOS Journal of Mechanical Engineering Education, 2017
Cooling on electronic objects, especially laptop is something to note. If the cooling system is not good, there will be overheating on the main chip motherboard and other components so that the laptop will be damaged quickly. This research aims to determine the temperature distribution on the heat sink laptop so that overheat can be overcome. This research was carried out numerically, where the specimen was a heat sink component on a laptop unit simulated using Solid works 2011 software in three dimensions with variations carried out in the form of air velocity values passing through the specimens of 5, 10, and 15 m/s. The results obtained in this study showed that the higher the speed of air flow through the heat sink, the higher the transfer of heat transfer.