High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP) (original) (raw)

MCM integration technologies for 60-80 GHz applications

vii Zusammenfassung ix 157 6.4.1. Quasi-static analysis 158 6.4.2. Modelling of high-frequency dispersion 160 6.4.3. Accuracy results 162 6.5. Multi-layer dielectric configurations 166 6.5.1. Quasi-static analysis 167 6.5.2. Modelling of high-frequency dispersion 171 6.5.3. Dielectric loss tangent 172 6.5.4. Accuracy results 173 6.6. Extraction results 180 6.7. Summary 187 7. Conclusions 189 A. Reciprocity relations in waveguide junctions 193 B. Higher-order effects in wafer probing environment 197 C. High-frequency dispersion of microstrip lines 201 D. Conformai mapping for multi-layer microstrip lines 205 Glossary 209 Bibliography 213 Curriculum Vitae 235 vi Abstract This research addresses the development of a set of MCM (Multi-Chip Mo¬

Design of 60- and 77-GHz Narrow-Bandpass Filters in CMOS Technology

IEEE Transactions on Circuits and Systems II: Express Briefs, 2000

This paper investigates the design and implementation of millimeter-wave narrow-bandpass filters in a standard 0.18-m CMOS technology. Filters with a measured 10% 3-dB bandwidth at 60 and 77 GHz are realized in a thin-film microstrip structure by using the lowest metallization layer as a ground plane. The impact of dissipation losses of the filters is also examined. It is found that the metallization losses in the coupled-line filter as well as the ground plane are the main reasons for the insertion loss.

Microwave and Millimeter-Wave Integrated Circuit Systems in Packaging

2009

In this work, EM simulation tools were exploited to investigate the package and interconnect structures for millimeter-wave and high-speed communication systems. Precise prediction on properties of passive structures as well as active devices is achieved by using accurate EM simulation techniques developed in this work. Complex 3D EM designs and modelling can be successfully accomplished by using EM simulations. As the foundation of the work, the general recommendations for EM simulations are firstly summarized according to two practical examples: design of a split ring resonator and investigation on multimode propagation in CPW structures. For the case of EM modelling of on-wafer measured passive components for millimeter-wave applications, a novel ground-ring excitation scheme with simple ground-signal-ground (G-S-G) probe models is proposed. The parasitic elements caused by the excitation structure are de-embedded by an extended "L-2L" calibration method. The excitation...

Silicon integrated antenna developments up to 80 GHz for millimeter wave wireless links

2005 European Microwave Conference, 2005

Today, SiGe HBT cut-off frequencies are higher than 230 GHz [1] and this increase allows new millimeter wave (MMW) applications on silicon such as 60 GHz WLAN and 77 GHz automotive radar. One of the success keys is then the passive integration. This study focuses on a 52 GHz silicon integrated antenna and related feeding transmission line (TL) topics. Double slot antenna integrated in a standard BiCMOS process and 40 GHz coplanar patch antenna (2.3dB gain @ 40 GHz) with a coplanar waveguide (CPW) feed line are depicted and characterized. Integrated TL achieved on standard STMicroelectronics (ST) BiCMOS, CMOS and silicon on insulator (SOI) technologies are described, performances are given (<0.7 dB/mm losses @ 80 GHz for SOI CPW). A full modeling has been developed up to 80 GHz with new approach for CPW on silicon technology due to passivation layer.

Design and Comparison of Various Passive Components of a 5GHz Wireless LAN Applications

2004

Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low power and high quality integrated transceiver solutions. The integration of RF front end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF( self resonance frequency). RF receiver module is implemented using benzocyclobutene (BCB) as interlayer material.

High performance RF-microwave multilayer integrated components for wireless applications

Proceedings of the 4th Wseas International Conference on Electronics Hardware Wireless and Optical Communications, 2005

Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5GHz require low power and high quality integrated transceiver solutions. The integration of RF front-end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module for 5GHz wireless LAN applications is implemented using benzocyclobutene (BCB) as interlayer material.

A 60GHz radio chipset fully-integrated in a low-cost packaging technology

Electronic …, 2006

We present a cost-effective plastic packaging technology for a fully-integrated 60GHz radio, used for communication in the 60GHz ISM band. The chipset supports 1-3 Gbps directional links using a ASK or PSK modulation, or it can be used in 500Mbps-1Gbps omni-directional links using an OFDM modulation. The antenna is integrated inside of the package and does not require any high-frequency external connection. The fabrication process of a direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. Both packages are robust against variations of the electrical properties of standard plastic mold materials.

Optimized pad design for millimeter-wave applications with a 65nm cmos rf technology

Millimeter-wave pads based on a 65nm CMOS technology from STMicroelectronics have been designed and measured. A pad was optimized to minimize losses caused by a ground shield and by the conductive substrate. Modelling techniques and special cares to design a millimeter pad with a minimum of effects are highlighted. The goal is to integrate this pad in active devices such as a power amplifier (PA) or a low noise amplifier (LNA). The frequency response shows that the intrinsic capacitance of an optimum pad does not exceed 17fF at 60GHz. The aimed application is the unlicensed band around 60GHz suitable for Wireless Personal Area Network application (WPAN).

Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology

2005

In this paper, we demonstrate the development of advanced 3-D low-temperature cofired ceramic (LTCC) system-on-package (SOP) passive components for compact, low cost millimeter-wave wireless front-end modules. Numerous miniaturized easy-to-design passive circuits that can be used as critical building blocks for millimetre-wave SOP modules have been hereby realized with high performance and high integration potential. One miniaturized slotted patch resonator has been designed by the optimal use of vertical coupling mechanism and transverse cuts and has been utilized to realize compact duplexers (39.8 GHz/59 GHz) and 3 and 5 poles band pass filters by the novel 3D (vertical and parallel) deployment of single-mode patch resonators. Measured results agree very well with the simulated data. Also, one multiplexing filter, called directional channelseparation filter, that can be used in mixer applications shows insertion loss of <3dB over the bandpass frequency band and a rejection ~ 25dB at around 38.5GHz over the band rejection section. LTCC fabrication limitations have been overcome by using vertical coupling mechanisms to satisfy millimetre-wave design requirements. Last, a double fed cross-shaped microstrip antenna has been designed for the purpose of doubling the data throughput by means of a dual-polarized wireless channel, covering the band between 59-64 GHz. This antenna can be easily integrated into a wireless millimeterwave link system. Index Terms -patch resonator, duplexer, low-temperature co-fired ceramic (LTCC), system-on-package (SOP), directional filter, multiplexing, 3D/vertical integration, microstrip antenna, dual polarization, millimeter-wave (mmW)