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2006, Journal of Applied Physics
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Materials Science and Engineering: B, 2006
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Eric J Cotts
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Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations
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Journal of Electronic Materials, 2003
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Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps
Hyunsuk Chun
Journal of Electronic Materials, 2004
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53rd Electronic Components and Technology Conference, 2003. Proceedings., 2003
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Further insight into interfacial interactions in nickel/liquid Sn–Ag solder system at 230–350 °C
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budiman salam
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Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate
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