Crosstalk and transient analyses of high-speed interconnects and packages (original) (raw)

Crosstalk analysis of interconnection lines and packages in high-speed integrated circuits

IEEE Transactions on Circuits and Systems

Abstmct-This paper presents a novel approach for the analysis of crosstalk, propagation delay, and pulse distortion of interconnects in high-speed integrated circuits, packages, and circuit hoards. First, based on the frequency-domain modal analysis, a set d formulas have been derived to describe the voltage and current transfer functions of coupled interconnects with arbitrary linear termination impedances. Next the transfer function is expanded to its Taylor series form. The inverse Fourier transform is then applied to the significant terms in the series. As a result, we have obtained analytiil expressioos of the timedomain waveforms for lossless multiconductor interconnection lines. I t has been found that the weak-coupling assumption, frequently assumed in previous works, is only marginally valid. In a typical interconnection con-ration, the secondary coupling of the disturbed line on the original signal line is substantial and must be taken into account for accurate prediction of the waveforms. Simulation results are given to illustrate the influence of the layout parameters of the interconnects and the rise or fall times of the source signal. In addition, it i s s h that ground conductors need to be placed on both sides of each of the signal lines to reduce crosstalk effectively. However, the presence of the ground conductors not only increases the layout complexity, but also, more importantly, results in more severe wavetam distortion for the signal on the active line.

Crosstalk analysis of high-speed interconnects and packages

IEEE Proceedings of the Custom Integrated Circuits Conference

This study develops closed-form formulas for determining the voltage and current transfer functions and waveforms of N coupled interconnects with arbitrary linear termination impedances. Besides providing valuable insight into coupling phenomenon, the formulas facilitate accurate computation of noise and waveform distortion due to crosstalk.. Sarkar," Multiconductor transmission lines in multilayered dielectric media", IEEE Trans. Microwave Theory Tech.,

Crosstalk analysis for high-speed pulse propagation in lossy electrical interconnections

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993

The effects of interconnection loss (both dc loss and skin effect loss) on crosstalk noise for a coupled lossy interconnection system, with various termination conditions, coupled lengths, spacings, and interconnection structures (microstrip lines versus strip lines) are investigated. Fourier transform techniques and numerical methods are applied to solve the coupled transmission line equations for the strong coupling case (mutual coupling between the active line and the quiet line). The interconnection is either terminated by its approximated matched load impedance, R,, or by the equivalent loading capacitance of the receiver, C L. General design guidelines for controlling the crosstalk noise and reflection noise in lossy interconnections are discussed.

Parameterized models for crosstalk analysis in high-speed interconnects

2009 IEEE International Symposium on Electromagnetic Compatibility, 2009

We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs), that is suitable to interconnect modeling. It is based on a recently introduced spectral approach for the analysis of lossy and dispersive MTLs extended by utilizing the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. They can handle design parameters, such as substrate or geometrical layout features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to carry out design space exploration, design optimization and crosstalk analysis efficiently. A numerical example validates the proposed approach in both frequency and time domain and is focused on the crosstalk analysis.

Spectral Models for the Estimation of Delay and Crosstalk in High-Speed Interconnects

IEEE Transactions on Electromagnetic Compatibility, 2000

In this paper, a closed-form rational model is presented for the computation of the finite ramp response of multiconductor transmission lines, which allows the numerical estimation of delay and crosstalk of coupled dispersive and lossy interconnects. The proposed method is based on the closed-form dyadic Green's function of the 1-D wave-propagation problem and allows to incorporate inductive as well as dispersive effects in a straightforward way. The proposed solution is obtained by combining the state-space models of the interconnect and terminations with no restriction as to the number of poles and nature of interconnect or terminations. The methodology is tested by comparison of the results with those obtained by using the Spice solver, the standard transmission-line theory and the inverse Fourier transform as well as lumped network models.

An interconnect model for arbitrary terminations based on scattering parameters

Analog Integrated Circuits and Signal Processing, 1994

An interconnect model, using the equivalent circuits derived from either the recursive or the nonrecursire evaluations of the convolution integral, is presented to show how arbitrary terminations can be efficiently handled in the high-frequency simulation environment. To achieve robustness in the recursive case, the impulse response is partitioned and Prony's method is applied to extract the exponentials. With the experimental data provided by scattering parameters, the model can be formulated for nonuniform lines, MCM connectors, etc. The equivalent circuit comprises of physically realizable elements available in general-purpose circuit simulators such as SPICE, and simulation performance for several case studies shows the applicability of this model to high-frequency circuit simulation and design.

Delay and crosstalk simulation of high-speed VLSI interconnects with nonlinear terminations

… -Aided Design of Integrated Circuits and …, 1993

A method for analysis of VLSI interconnects that contain both lossy coupled transmission lines and nonlinear components is presented. An equivalent time-domain macromodel is derived for the linear subnetworks that contain lossy coupled transmission lines.The macromodel takes the form of a set of ordinary differential equations. The method takes full advantages of the asymptotic waveform evaluation (AWE) technique, which offers two to three orders of magnitude speedup relative to other methods with comparable accuracy. In addition, it does not require explicit evaluation of the dominant poles of the network. The proposed technique can be easily implemented within the framework of an existing conventional circuit simulator such as SPICE.

Time-domain modeling of high-speed interconnects by modified method of characteristics

IEEE Transactions on Microwave Theory and Techniques, 2000

In this paper, a new model of lossy transmission lines is presented for the time-domain simulation of high-speed interconnects. This model is based on the modified method of characteristics (MMC). The characteristic functions are first approximated by applying lower order Taylor series in the frequency domain, and then a set of simple recursive formulas are obtained in the time domain. The formulas, which involve tracking performance between two ends of a transmission line, are similar to those derived by the method of characteristics for lossless and undistorted lossy transmission lines. The algorithm, based on the proposed MMC model, can efficiently evaluate transient responses of high-speed interconnects. It only uses the quantities at two ends of the lines, requiring less computation time and less memory space than required by other methods. Examples indicate that the new method is having high accuracy and is very efficient for the time-domain simulation of interconnects in high-speed integrated circuits.

Transient analysis of microstrip - like interconnects with ground plane aperture

2007 IEEE Applied Electromagnetics Conference (AEMC), 2007

Guarded ground tracks are extensively used in high density routing for mitigation of crosstalk. However, these ground tracks can influence the electrical properties of the interconnect line also. We present a novel analytical model for extraction of line parameters of high-speed interconnect lines guarded by ground tracks. Based on the proposed model, transient response of such interconnect structures is presented. It is seen ground tracks can significantly affect the time-domain response of the interconnect lines. The computed interconnect circuit parameters are compared with finite-difference time-domain simulations. The proposed model can be practically used for time-domain analysis of microstrip lines also. The results obtained would be useful in design of high-speed interconnections for MCM, RF and MIC related applications.