Thermal optimization of a single inlet T-junction (original) (raw)
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Computer-Aided Thermal Design Optimisation
The aim of this paper is to demonstrate by means of relevant examples the usefulness of Excel as a tool for introducing computer-aided design optimisation to engineering students.The performance of thermal systems is strongly influenced by the cost of energy which constitutes a major part of their running cost.Thermal design, which must take into consideration operating costs as well as initial costs, offers good examples of design optimisation. Moreover, design optimisation of thermal systems can easilybe performed by using Excel. The examples considered in the paper deal with insulated conduits carrying hot or cold air with respect to initial and energy costs. Unlike analytical optimisation that can only be used for simple situations with a single design parameter, Excel can deal with thermal designs that involve multiple design factors and elaborate analytical models. I. INTRODUCTION Thermal-fluid systems,or simply thermal systems,are mechanical-engineering systems that are used for the transfer and utilisation of thermal energy in industrial, residential, and many other applications. Thermal design refers to the design of these systems that is based on the principles of thermal sciences (thermodynamics, fluid mechanics, and heat transfer). The design of thermal system is strongly influenced by the cost of energy as well as environmental regulations that vary with location and time. Therefore, the acceptability of a thermal system does not depend only on its initial cost, but also on its running cost. Thermal design can be used to illustrate the concept of design optimisation more effectively than conventional types of mechanical-engineering design [1]. Like conventional design, thermal design is an iterative process that requires the use of computers and computer software. In order to deal with design assignments, standard textbooks in the field of thermal engineering now use relevant computer software[2,3]. By eliminating the tedium of property tables and charts, computer software helps the students to improve their designs by performing sensitivity and optimisation analyses that lead to more efficient systems with less energy consumption and lower impact on the environment. Unfortunately, such applications are usually protected by proprietary rights and, therefore, they are inaccessible for many engineering students particularly in developing countries. Microsoft Excel,which comes as part of the widely-distrbuted Microsoft Office software, is is a general-purpose spreadsheet application that is usually taught to junior engineering students within an introductory course in computer application. Although Excel is an extremely versatile application,itismostly used only for data analysis and presentation. However, Excelis equipped it with the necessary tools that allow students to perform design optimisation analyses. Moreover, the computational capabilities of Excel as a modelling platform for engineering analyses can be extended significantly by taking advantage of Visual Basic for Applications (VBA), which is a well-equipped programming language that also comes as part of Microsoft Office. VBA can be used for developing additional user-defined functions as required by thermal analyses [4]. With the wide availability of personal computers nowadays, Excel can be a useful modelling platform for mechanical engineering students and practicing engineers alike. Ithas already been used as an effective educational tool for introducing the basic concepts of thermal sciences[5-8]. The present paper focuses on using Excel for design optimisation of thermal systems. By means of relevant examples, the paper demonstrates the adequacy of Excel, together with its Solver add-in,as a modelling platform for thermal design optimisation. The paper also highlights the advantages of computer-aided optimisation compared to analytical optimisation of thermal systems design.
Thermal design and optimization
Energy, 1996
A comprehensive and rigorous introduction to thermal system designfrom a contemporary perspective Thermal Design and Optimization offers readers a lucid introductionto the latest methodologies for the design of thermal systems andemphasizes engineering economics, system simulation, andoptimization methods. The methods of exergy analysis, entropygeneration minimization, and thermoeconomics are incorporated in anevolutionary manner.
Journal of Thermal Science and Engineering Applications, 2019
Genetic algorithms (GAs) are considered to be one of the main types of evolutionary algorithms (EAs) and are being increasingly used in various engineering design applications. To a large extent, plate-fin heatsinks are used in the thermal management of compact electronic equipment and data centers. The shape optimization of the heatsinks is not rigorously investigated during the design process of high power electronics. Any improvements in the effectiveness of the heatsinks impact the energy consumed by large-scale information communication technology (ICT) facilities including data centers and telecommunication systems and promote a more sustainable use of raw materials. This paper investigates the optimization of plate-fin heatsinks by modifying the fin layout in a forced crossflow using a multi-objective genetic algorithm (MOGA) combined with computational fluid dynamics (CFD) simulations. The main objective is to improve the heat dissipation rate by modifying geometric paramete...
International Journal of Engineering Research and Technology (IJERT), 2021
https://www.ijert.org/design-and-simulation-of-heat-sink-for-different-components-geometry-with-various-heat-capacities https://www.ijert.org/research/design-and-simulation-of-heat-sink-for-different-components-geometry-with-various-heat-capacities-IJERTV10IS060362.pdf This Electronic device cooling system is capable of satisfying required capacity electronic device. This paper details the results of a study to develop a geometry based optimization tool for heat sink design. Variation in the design aspects of the heat sink components, the cooling of electronic devices is possible. Geometry of heat sink, effect heat convention capability, size and weight of the component. Electronic warfare devices, obviously uses electronic chips. These components generate Power as they function. This power generation goes hand in hand with the generation of heat. Heat generated can be quite harmful to this electronic equipment & may also decrease the efficiency. The problem is even greater when the electronic set up is placed in a hot environment. This high temperatures, decreases the life span of the component, might even cause permanent damage to the equipment. Hence, it becomes necessary to manage the thermal issues by designing suitable heat sinks, such that the power is efficiently dissipated. This project involves designing a heat sink, for an electronic chip of area (80mm * 60mm) that is placed in the environment in which the temperatures reaches up to 55 degree Celsius. Steps were taken to solve the problem using design formulas with respect to the given specifications & the ambient temperature.
Parameter Design of Heat Sink: Multiple Trade-Offs
1994
This paper is to develop a mathematical model, to optimize and to evaluate a heat sink on chip in Electronic Printed Board Assembly. The model emphasizes Thermo-Mechanical Behavior considering cost, heat and geometrical aspects. An optimization model has been developed that characterizes a heat sink at the parameter design stage. The model, which is a multi objective multi constraint nature, is formulated as a Compromise DSP format. A group of scenarios in one or two priority levels of the goals has been investigated.
International Journal of Heat and Mass Transfer, 2009
A multi-objective thermal design optimization and comparative study of electronics cooling technologies is presented. The cooling technologies considered are: continuous parallel micro-channel heat sinks, inline and staggered circular pin-fin heat sinks, offset strip fin heat sinks, and single and multiple submerged impinging jet(s). Using water and HFE-7000 as coolants, Matlab's multi-objective genetic algorithm functions were utilized to determine the optimal thermal design of each technology based on the total thermal resistance and pumping power consumption under constant pressure drop and heat source base area of 100 mm 2 . Plots of the Pareto front indicate a trade-off between the total thermal resistance and pumping power consumption. In general, the offset strip fin heat sink outperforms the other cooling technologies.
Design and Optimization of Thermal Syste
International Standard Book This book contains information obtained from authentic and highly regarded sources. Reprinted material is quoted with permission, and sources are indicated. A wide variety of references are listed. Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use.
International Journal of Engineering Research and Technology (IJERT), 2016
https://www.ijert.org/thermal-design-and-analysis-of-heat-sink-optimization-and-its-comparison-with-commercially-available-heat-sink https://www.ijert.org/research/thermal-design-and-analysis-of-heat-sink-optimization-and-its-comparison-with-commercially-available-heat-sink-IJERTV4IS120321.pdf Modern portable electronic devices are becoming more compact in space, The exponential increase in thermal load in air cooling devices require the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. "fan-on-top" and "fan-on-side" are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD). The primary goal of this work is to do the thermal analysis and comparison of fan orientation on cooling efficiency and to find the optimum parameters for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode (i.e. Fan-failed condition). The CFD simulations are performed for optimization of heat sink parameters with objective function of maximization of heat transfer coefficient.
2015
It is observed that components of modern portable electronic devices with increasing heat loads with decrease in the space available for heat dissipation. The increasing heat load of the device needs to be removed for maintaining the efficient performance of the device. The exponential increase in thermal load in air cooling devices requires the thermal management system (i.e. heat sink) to be optimized to attain the highest performance in the given space. Adding fins to the heat sink increases surface area but it increases the pressure drop. This reduces the volumetric airflow and the heat transfer coefficient. In order to have a better system the number of fins in a given area can be optimized to obtain the effective performance keeping the working temperature less than the critical temperature in the device. In this work, experimentation is performed for high heat flux condition. The heat sink mounted on the hot component for cooling the component under forced convection. The two different orientation of fan i.e. "fan-on-top" and "fan-on-side" are tested for different air mass flow rate and cooling rate is validated with numerical results for the same amount of heat flux. The numerical simulation are performed using computational fluid dynamics (CFD).The primary goal of this work is to find the optimization point for a natural air-cooled heat sink at which the system will continue its operation in natural convection mode, when the fan fails to operate. The CFD simulations will be performed for optimization of heat sink parameters with objective function of maximization of heat transfer coefficient. The optimum combination of parameters and results will be verified and compared with commercially available heat sink.
Multiobjective Optimization of Thermal Control Strategies for Multifunctional Structures
Journal of Aerospace Engineering, 2014
A thermomechanical electronic multifunctional structure prototype has been modeled and optimized. The model focuses on the description of thermal and electrical phenomena, but leaves aside structural issues. It couples a three-dimensional thermal network with representations of different possible thermal control laws, namely on/off control, proportional logic, proportional-integral-derivative strategy, and the usage of positive temperature coefficient heaters. The parametric model was first validated and correlated through a comparison with simple physical solutions, and then with the actual results of a thermal vacuum test. Multiobjective optimization (based on genetic algorithms) has been used to define the best heater layout options, to identify the best control strategy in terms both of panel isothermia and energy consumption, and to fine-tune the parameters of the selected control strategy. The research reported in this paper has led to the definition of an optimal thermal control solution. An examination of the optimization results has shown that the simultaneous adjustment of the geometrical layout as well as the control strategy and its parameters can lead to energy savings of about 52%.