Layout-Based Chip Emission Models Using RedHawk (original) (raw)

Chip-Level Design Constraints to Comply With Conducted Electromagnetic Emission Specifications

IEEE Transactions on Electromagnetic Compatibility, 2012

This paper deals with the reduction of the conducted electromagnetic emissions of microcontrollers caused by the core block switching. The relationship between the conducted emission at the printed circuit board level and the sources of switching noise at the chip level is evaluated through the analysis of an equivalent circuit that comprises an electric model of the internal building blocks of a microcontroller, the model of its package, and that of the board. The model of the integrated circuit is derived on the basis of functional specifications and technology parameters so that it can be extracted before chip manufacturing. By using this model, and knowing the electromagnetic emission limits to be met, the upper bound of the power supply current spectra of the core logic blocks is evaluated and the effectiveness of common spectrum shaping techniques, like the clock-skewing method or the spread-spectrum clock modulation, is discussed.

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

Applied Sciences

This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc.), based on the Integrated Circuit Emission Model template (ICEM). As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

Efficient modelling of IC conducted emission for power integrity analysis

Advances in Radio Science

In this paper two methodologies to reduce the complexity of IC conducted emission models for Power Integrity analysis in ICs are presented. The methodologies differ concerning the applicability in simulation tools, complexity and accuracy of the generated models. The first methodology uses a complex model and reduces its order to generate a model with a fewer number of elements. This methodology therefore involves a model order reduction approach. A second minimum complexity, module based modelling approach is introduced for rough estimations, as the order reduced model is still too complex for some applications. The two methodologies are applied to an IC conducted emission model of two digital modules of a 32 Bit microcontroller. The results of the three models are compared and discussed. Fields of application for the introduced modelling approaches are the estimation of the magnitude and time behaviour of the supply current as well as the determination of the number and position of the IC's supply pins.

Accurate modeling of layout parasitic to forecast EMI emitted from a DC-DC converter

This paper illustrates how to account for all parasitic due to the layout of a power converter (inductive and capacitive), in order to forecast Electromagnetic Interferences (EMI). The method is generic, and is validated here in the simple example of a DC-DC converter, realized on different technologies: Insulated Metal Substrate (IMS), Printed Circuit Board (PCB). In addition, several layouts aspects will be investigated. Conclusions are given on the influence of layout and all other components on EMI.

Analysis of chip-level EMI using near-field magnetic scanning

2004

Abstract Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Well designed ICs maintain good control of the currents that they generate. However, poorly designed ICs can drive high-frequency noise currents onto nominally low-frequency input and output pins. These currents can excite unintentional radiating structures on the printed circuit board, resulting in radiated emissions that are difficult or expensive to control.

Advanced modeling techniques for system-level power integrity and EMC analysis

2009

In modern digital ICs, the increasing demand for performance and throughput requires operating frequencies of hundreds of megahertz, and in several cases exceeding the gigahertz range. Following the technology scaling trends, this request will continue to rise, introducing new challenges to ensure the power integrity (PI) of the electronic systems, and increasing the electromagnetic interference (EMI). The enforcement of strict governmental regulations and international standards, mainly (but not only) in the automotive domain, are driving new efforts towards design solutions and modeling techniques to assess and guarantee PI and electromagnetic compatibility (EMC) across the overall system that comprises the chip, package, and printed circuit board (PCB). Hence, PI and EMC/EMI are rapidly becoming a major concern for high-speed circuit, package, and board designers. In this work we investigate the impact of the chip power rail noise on system PI and EMI, and we show that by reducing the power rail noise thus assuring the system PI, it is possible to significantly reduce the electromagnetic (EM) conducted emissions. Furthermore, we present a transistor-level lumped-element simulation model of the system power distribution network (PDN) that allows chip, package, and PCB designers to predict the power integrity and the conducted emissions at critical chip I/O pads. The experimental results obtained on an industrial microcontroller for automotive applications demonstrate the effectiveness of our approach.

ICEM modelling of microcontroller current activity

Microelectronics Journal, 2004

Better prediction of electromagnetic compatibility (EMC) for components is becoming a topical demand, due to technology improvements. It is requested by integrated circuit (IC) manufacturers as well as by equipment integrators. The French UTE standardisation group has proposed an EMC modelling methodology for ICs, called ICEM (Integrated Circuit Electromagnetic Model). This proposal improves and extends the IBIS standard towards conducted emission prediction (and later radiated emission) by providing additional information modelling the power network and the dynamic current activity of an IC, thus allowing the chip manufacturer to justify the package used as well as the number of power supply pins, and the equipment manufacturer to tune power supply and decoupling networks.

Application of system-level EM modeling to high-speed digital IC packages and PCBs

IEEE Transactions on Microwave Theory and Techniques, 1997

A system-level electromagnetic (EM) modeling tool combining a three-dimensional (3-D) full-wave finite-element EMfield analysis tool and a time-domain electric-circuit simulator is developed and applied to various geometries such as multilayer printed circuit boards (PCB's), signal lines embedded in a PCB or package, and split power-distribution network. Since the signal integrity is a primary concern of high-speed digital circuits, the noise distributions on various circuit planes are evaluated from the analysis. These noise distributions, often called noice maps, are utilized to identify the location of the major source of simultaneous switching noise (SSN). This information can eventually be adapted for optimum placement of decoupling capacitors to minimize the noise fluctuations on the various circuit planes on an entire PCB. area of EM design and characterization of microwave/millimeter-wave circuits and components and VLSI and MMIC interconnects using the FEM, and development of numerical techniques for analysis and design of high-speed high-frequency circuits with emphasis on parallel/super computing.

Modeling the Electromagnetic Emission of a Microcontroller Using a Single Model

IEEE Transactions on Electromagnetic Compatibility, 2000

This paper presents a methodology for building an integrated circuit behavioral model that enables the prediction of its electromagnetic (EM) emissions up to several gigahertz. The model, built upon S-parameter characterization and conducted emission measurements, is used to predict the EM emissions of a commercial 16-bit microcontroller. The emission measurements are performed according to several EM compatibility standards, namely, 1 Ω/150 Ω, surface scan, and transverse EM/gigahertz transverse EM (GTEM) method, and their results show an excellent fit with model predictions. Index Terms-Conducted emission, electromagnetic compatibility (EMC), integrated circuit (IC), integrated circuit emission model (ICEM), measurement standards, microcontroller, radiated emission.