original ) (raw )Thermal analysis of microelectric packages and printed circuit boards using an analytic solution to the heat conduction equation
Gordon Ellison
Advances in Engineering Software, 1995
View PDFchevron_right
Investigation of effects of heat sinks on thermal performance of microelectronic package
Raj Bhatti , Emeka Amalu
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011), 2011
View PDFchevron_right
Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization
Eric Monier-vinard
Solid-State Electronics, 2015
View PDFchevron_right
CHARACTERISATION OF CONDUCTIVE HEAT TRANSFER IN ELECTRONIC DEVICE-PACKAGES SOLID SYSTEMS
Paolo Emilio Bagnoli
View PDFchevron_right
Transient thermal analysis for electronic packages
kedar shukla
Journal of spacecrafts and rockets, vol.7, pp. 107-111, 1983
View PDFchevron_right
Analytical Solutions Of Steady-state Heat Conduction In Multi-layer Stack Packaging
Saeed Ghalambor
2014
View PDFchevron_right
Calculation limits of the homogeneous effective thermal conductivity approach in modeling of printed circuit board
Cheikh Sidaty Dia
20th International Workshop on Thermal Investigations of ICs and Systems, 2014
View PDFchevron_right
Analytical Model of Temperature Distribution Over an Electronic Circuit Board
Valeri Vlassov
2003
View PDFchevron_right
Evaluation of analytical models for thermal analysis and design of electronic packages
A. Shooshtari
Microelectronics Journal, 2003
View PDFchevron_right
Thermal Math Modeling and Analysis of an Electronic Assembly
kedar shukla
View PDFchevron_right
Effects of thermal interface materials (solders) on thermal performance of a microelectronic package
Raj Bhatti
View PDFchevron_right
Thermal characterisation of embedded heat spreading layers in rectangular heat-generating electronic modules.
Josua P Meyer
View PDFchevron_right
Analytical solution for heat conduction problem in composite slab and its implementation in constructal solution for cooling of electronics
Lütfullah Kuddusi
Energy Conversion and Management, 2007
View PDFchevron_right
Analytical thermal modelling of multilayered active embedded chips into high density electronic board
Cheikh Sidaty Dia
Thermal Science, 2013
View PDFchevron_right
Modeling of the thermal effects of heat generating devices in close proximity on vertically oriented printed circuit boards for thermal management applications
Amy Fleischer
International Journal of Thermal Sciences, 2007
View PDFchevron_right
Practical analytical modeling of 3D multi-layer Printed Wired Board with buried volumetric heating sources
Eric Monier-vinard
International Journal of Thermal Sciences, 2018
View PDFchevron_right
Solutions for Certain Thermal Problems of Microelectronics Introduction
György Bognár
2009
View PDFchevron_right
Thermal modeling of multi-shape heating sources on n-layer electronic board
Eric Monier-vinard
Thermal Science, 2016
View PDFchevron_right
COMPUTATIONAL HEAT TRANSFER ANALYSIS OF ELECTRONIC EQUIPMENT
IAEME Publication
IAEME, 2019
View PDFchevron_right
THERMAL ANALYSIS OF A HEAT SINK FOR ELECTRONICS COOLING
IAEME Publication
View PDFchevron_right
Extensions of the closed form method for substrate thermal analyzers to include thermal resistances from source-to-substrate and source-to-ambient
Gordon Ellison
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
View PDFchevron_right
Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
Andras Poppe
Journal of Electronic Packaging, 2011
View PDFchevron_right
Thermal interface material performance in microelectronics packaging applications
Malcolm Early
Microelectronics Journal, 1997
View PDFchevron_right
Effect of heat source orientation on the thermal behavior of N-layer electronic board
Eric Monier-vinard
International Journal of Thermal Sciences, 2016
View PDFchevron_right
Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader
Cheikh Sidaty Dia
Thermal Science, 2014
View PDFchevron_right
A modeling methodology for thermal analysis of the PCB structure
Paolo Emilio Bagnoli
Microelectronics Journal
View PDFchevron_right
Thermal simulation of heterogeneous structural components in microelectronic devices
Dmytro Fedasyuk
View PDFchevron_right
The effect of thermal constriction on heat management in a microelectronic application
Michael Okereke
Microelectronics Journal, 2014
View PDFchevron_right
Numerical Analysis And Simulation Of Conjugate Heat Transfer Study Of Electronic Circuit Board
Ravikiran patil
2015
View PDFchevron_right
Thermal management of electronics: An experimental analysis of triangular, rectangular and circular pin-fin heat sinks for various PCMs
FAISAL HASSAN
International Journal of Heat and Mass Transfer, 2018
View PDFchevron_right
Temperature variation on the heated base of a solid substrate cooled with different types of heat sinks.
Josua P Meyer
View PDFchevron_right
Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic Packaging
Waqar Khan
IEEE Transactions on Components and Packaging Technologies, 2008
View PDFchevron_right