The effect of radiation on ion-implanted silicon detectors (original) (raw)

1986, Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Investigations on changes of characteristics of ion-implanted silicon-junction detectors when exposed to various doses of radiation ( < 105 and > 106 rad) were performed. It was found that the increase of leakage current depends not only on the dose but also on the gradient of irradiation.

New Operation Scenarios for Severely Irradiated Silicon Detectors

Proceedings of VERTEX 2009 (18th workshop) — PoS(VERTEX 2009)

Recent charge collection measurements after severe hadron irradiation have proved that n-side readout segmented planar silicon detectors can successfully operate up to the doses anticipated for the innermost layers of the upgraded experiments in the future super LHC (sLHC) at CERN. The charge collected by the irradiated sensors is sufficient to guarantee a signal over noise (S/N) ratio above 10 even for the pixel layers located at the smallest radial distance from the beam line (less than 4 cm away). The signal depends on the applied bias and voltages as high as 1000V could be required to satisfy the minimum signal height for the most exposed detectors. The radiation at the doses of the pixel layers in the sLHC also cause an important increase of the reverse current The high bias voltages and reverse currents cause significant power dissipation and adequate cooling needs to be applied to limit the current well below the thermal-runaway level.

Current-Voltage Characteristics of Aluminium and Zinc Implanted Silicon for Radiation Detection Applications

2019

Crystalline p-silicon was implanted with Aluminium and Zinc at the fluence of 1.0 10 17 ions cm -2 . A change in silicon conductivity due to the implantation was investigated by the use of current-voltage (I-V ) technique at room temperature. The qualitative analysis of the I-V characteristics showed that the implantation reduces the measured current of the material indicating that the conductivity of the material has decreased after ion implantation. The I-V trends of the metal-implanted silicon show ohmic I-V behaviour. A change in parameters such as saturation current, ideality factor, and Schottky barrier height due the implantation was also investigated in this study. The results, in general, show that in silicon, Aluminium and Zinc are responsible for conversion of silicon from lifetime to relaxation material. A material exhibiting relaxation behaviour has been found promising to be radiation-hard. This conversion of material to relaxation behaviour indicates that both metals ...

Proton irradiation of silicon detectors with different resistivities

composcmts et systémes, Arcachon, 18-22 septembre 1995.) OCR Output (Presented at: RADECS 95, 3éme Colloque Européen, Radiations et leurs effets sur les resistivity and impurity concentrations. inversion point and the long-term annealing of the depletion voltage are sensitive to the initial damage constant is shown to be independent of the starting material, while the conduction-type processes up to the equivalent of over 10 years at room temperature. The leakage-current made for up to 100 days at room temperature and then using heating techniques to accelerate has been studied both as a function of fluence and of time after irradiation. Measurements were protons up to a fluence of 1014 cm-?. The change in leakage current and full depletion voltage various initial resistivities and impurity concentrations have been irradiated with high-energy material to maximize the performance and lifetime. Ion-implanted silicon detectors with received threatens the lifetime of these detectors and it is vital to choose the silicon starting precision silicon detectors for tracking purposes. The hadronic component of the radiation Future high-energy physics experiments at CERN's Large Hadron Collider will use high Abstract

Radiation hardness of silicon detectors manufactured on wafers from various sources

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 1997

Impurity concentrations in the initial silicon material are expected to play an important role for the radiation hardness of silicon detectors, during their irradiation and for their evolution with time after irradiation. This work reports on the experimental results obtained with detectors manufactured using various float-zone (FZ) and epitaxial-grown material. Preliminary results comparing the changes in leakage current and full depletion voltage of FZ and epitaxial detectors as a function of fluence and of time after 10'4cm-2 proton irradiation are given. The measurement of charge collection efficiency for epitaxial detectors is also presented.

Low-temperature technique of thin silicon ion implanted epitaxial detectors

The European Physical Journal A, 2015

A new technique of large-area thin ion implanted silicon detectors has been developed within the R&D performed by the FAZIA Collaboration. The essence of the technique is the application of a lowtemperature baking process instead of high-temperature annealing. This thermal treatment is performed after B + ion implantation and Al evaporation of detector contacts, made by using a single adjusted Al mask. Extremely thin silicon pads can be therefore obtained. The thickness distribution along the X and Y directions was measured for a prototype chip by the energy loss of α-particles from 241 Am (E α = 5.5 MeV). Preliminary tests on the first thin detector (area ≈ 20 × 20 mm 2) were performed at the INFN-LNS cyclotron in Catania (Italy) using products emitted in the heavy-ion reaction 84 Kr(E = 35 A MeV)+ 112 Sn. The ΔE −E ion identification plot was obtained using a telescope consisting of our thin ΔE detector (21 μm thick) followed by a typical FAZIA 510 μm E detector of the same active area. The charge distribution of measured ions is presented together with a quantitative evaluation of the quality of the Z resolution. The threshold is lower than 2 A MeV depending on the ion charge.

A novel method for the determination of the radiation damage effects in silicon detectors

Nuclear Physics B-proceedings Supplements, 1993

The result of a study about the effects of radiation damage on silicon detectors, carried out using the LBIC (light beam induced current) technique are thoroughly reported. As this technique is capable to detect any change in the minority carriers diffusion length associated to radiation damage, it was possible to show that the main degradation effect, associated to fast neutron irradiation up to a fluence of 101Sn/cm 2, is a reduction of the lifetime of the minority carriers, which reduces the collection efficiency.

Characterization of thick epitaxial silicon detectors from different producers after proton irradiation

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2007

Epitaxial (EPI) silicon has recently been investigated for the development of radiation tolerant detectors for future high-luminosity HEP experiments. A study of 150 mm thick EPI silicon diodes irradiated with 24 GeV=c protons up to a fluence of 3 Â 10 15 p=cm 2 has been performed by means of Charge Collection Efficiency (CCE) measurements, investigations with the Transient Current Technique (TCT) and standard CV =IV characterizations. The aim of the work was to investigate the impact of radiation damage as well as the influence of the wafer processing on the material performance by comparing diodes from different manufacturers. The changes of CCE, full depletion voltage and leakage current as a function of fluence are reported. While the generation of leakage current due to irradiation is similar in all investigated series of detectors, a difference in the effective doping concentration can be observed after irradiation. In the CCE measurements an anomalous drop in performance was found even for diodes exposed to very low fluences ð5 Â 10 13 p=cm 2 Þ in all measured series. This result was confirmed for one series of diodes in TCT measurements with an infrared laser. TCT measurements with a red laser showed no type inversion up to fluences of 3 Â 10 15 p=cm 2 for n-type devices whereas p-type diodes undergo type inversion from p-to n-type for fluences higher than % 2 Â 10 14 p=cm 2 .

100 MeV Si7+ Ion Irradiation Induced Modifications in Electrical Characteristics of Si Photo Detector: An In-Situ Reliability Study

Journal of Materials Science Research, 2014

The influence of 100 MeV Silicon (Si) ion irradiation on electrical characteristics of Si photo detectors has been analyzed using in-situ current-voltage characterization (I-V) in dark condition. The irradiation was performed over a wide range of fluences from 1×10 11 ions/cm 2 to 1×10 13 ions/cm 2. Key electrical parameters such as ideality factor (n), series resistance (R s) and reverse bias leakage current (I R) for each irradiation fluence have been extracted from the I-V characteristics. The ideality factor of the unirradiated detector is found to be 1.48 and it gradually increased up to the fluence of 5×10 11 ions/cm 2 , then it saturates around 3.4-3.5 for higher fluences. The I-V characteristics showed significant increase in forward bias and drastic increase in reverse leakage current. The value of I R is 7.23 nA for unirradiated detector and it increases about four orders of magnitude up to 5×10 11 ions/cm 2. Further there is no observable change in the value of I R. However the value of R s increases initially and slightly decrease at higher fluences. The observed results are interpreted in terms of energy loss mechanisms of swift heavy ion as it passes through the different layers of the detector. The radiation induced defects in the bulk region and activation of multiple current transport mechanisms have attributed to the observed deviations in the electrical behaviour of the device. SRIM (Stopping power and Range of Ion in Matter) and TRIM (Transport and Range of Ion in Matter) simulation results of damage induced in the device have been reported in the present study. Linear energy transfer (LET), non ionizing energy loss (NIEL) damage contributions, total ionization dose (TID) and displacement damage dose (D d) has been correlated with the observed degradation. Quantitative estimation of radiation hardness of the Si photo detector is done by comparing with the equivalent damage created by the proton at similar penetration depth in the present device structure.

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