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Uda Hashim
Gold Bulletin, 2013
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A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization
Jimy Gomes
2015
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Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
Gan Chong Leong
PLoS ONE, 2013
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Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Gan Chong Leong
Journal of Electronic Packaging, 2013
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Degradation of the Au 4 Al compound in gold ballbonds during isothermal aging in air at 175 °C
Christopher Breach
Journal of Materials Science, 2000
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Future and technical considerations of gold wirebonding in semiconductor packaging - A technical review
Uda Hashim
2014
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Palladium coated copper wire wedge integrity to withstand extended high temperature storage stress test
MAK HOE
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 2016
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Microstructural Indicators for Prognostication of Copper–Aluminum Wire Bond Reliability Under High-Temperature Storage and Temperature Humidity
Luu Nguyen
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016
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Evolution of Bonding Wires used in Semiconductor Packaging: Perspective over 25 years
Gan Chong Leong
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RELIABILITY OF THERMOSONIC BONDED PALLADIUM WIRES IN HIGH TEMPERATURE ENVIRONMENTS UP TO 350 C
Dimitrios E VENTZAS
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Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects
Jong-Ning Aoh
Journal of Electronic Materials, 2006
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Prognostication of Copper Aluminum Wirebond Reliability Under High Temperature Storage and Temperature Humidity
Pradeep Lall
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An analysis of intermetallics formation of gold and copper ball bonding on thermal aging
Srikanth Narasimalu, Charles Vath
Materials Research Bulletin, 2003
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Study of Ag-alloy wire in thermosonic wire bonding
oranna yauw
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
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Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
Christopher Breach
Crystals, 2013
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Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
Uda Hashim
2013
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Palladium-Coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding
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ECS Transactions, 2013
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High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization
Frode Strisland
Microelectronics Reliability, 2008
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Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
Gan Chong Leong
PLOS ONE, 2014
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Bond strength evaluation of heat treated Cu-Al wire bonding
Joseph Anand
Journal of Mechanical Engineering and Sciences, 2018
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Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage
Charles Vath
Microelectronics Reliability, 2011
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Influence of Intermetallic Phases on Reliability in Thermosonic Au-Al Wire Bonding
Matthias Petzold
2006 1st Electronic Systemintegration Technology Conference, 2006
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The Challenges of Fine Pitch Wire Bonding in Semiconductor Packaging
Nowshad Amin
eng.ukm.my
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Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging
Uda Hashim, Gan Chong Leong
Journal of Electronic Materials
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High-temperature degradation of wire bonds in plastic encapsulated microcircuits
Ashok Sharma
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Effects of Wire Type and Mold Compound on Wearout Reliability of Semiconductor Flash Fineline BGA Package
Gan Chong Leong
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Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material
Kim S Siow
metals and materials international, 2020
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Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years
Gan Chong Leong
2014
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Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
John Persic
Materials Transactions, 2008
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Effect of Temperature on Deformation Characteristics of Gold Ball Bond in Au-Al Thermosonic Wire Bonding
Gurbinder Singh
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Effects of Bond Temperature Augmentation for Improved Reliability after Thermal Aging at 500H and 1000H of High-Temperature Storage and Temperature Cycle and on the Formation of Kirkendall Voids
Glenn Carlo Miranda
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EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING
Mohamad Firdaus Rosle
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