An analysis of intermetallics formation of gold and copper ball bonding on thermal aging
Srikanth Narasimalu, Charles Vath
Materials Research Bulletin, 2003
View PDFchevron_right
Extended reliability of gold and copper ball bonds in microelectronic packaging
Uda Hashim
Gold Bulletin, 2013
View PDFchevron_right
Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging
Uda Hashim
2013
View PDFchevron_right
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
Christopher Breach
Crystals, 2013
View PDFchevron_right
Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Gan Chong Leong
Journal of Electronic Packaging, 2013
View PDFchevron_right
Future and technical considerations of gold wirebonding in semiconductor packaging - A technical review
Uda Hashim
2014
View PDFchevron_right
EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING
Mohamad Firdaus Rosle
View PDFchevron_right
Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
Gan Chong Leong
PLoS ONE, 2013
View PDFchevron_right
Evolution of Bonding Wires used in Semiconductor Packaging: Perspective over 25 years
Gan Chong Leong
View PDFchevron_right
Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging
Gan Chong Leong
Journal of Nanomaterials, 2012
View PDFchevron_right
Degradation of the Au 4 Al compound in gold ballbonds during isothermal aging in air at 175 °C
Christopher Breach
Journal of Materials Science, 2000
View PDFchevron_right
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
Kyung-Wook Paik
Journal of Electronic Materials, 2006
View PDFchevron_right
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
Kyung-Wook Paik
IEEE Transactions on Components and Packaging Technologies, 2003
View PDFchevron_right
Thermosonic bonding of gold wire onto silver bonding layer on the bond pads of chips with copper interconnects
Jong-Ning Aoh
Journal of Electronic Materials, 2006
View PDFchevron_right
Effect of wire size on the formation of intermetallics and Kirkendall voids on thermal aging of thermosonic wire bonds
Srikanth Narasimalu, Charles Vath
Materials Letters, 2004
View PDFchevron_right
Development of a thermosonic wire-bonding process for gold wire bonding to copper pads using argon shielding
Jong-Ning Aoh
Journal of Electronic Materials, 2004
View PDFchevron_right
High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package
Alexandru Prisacaru
Polymer Degradation and Stability, 2021
View PDFchevron_right
The Challenges of Fine Pitch Wire Bonding in Semiconductor Packaging
Nowshad Amin
eng.ukm.my
View PDFchevron_right
Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage
Charles Vath
Microelectronics Reliability, 2011
View PDFchevron_right
Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization
Jimy Gomes
International Symposium on Microelectronics, 2015
View PDFchevron_right
Corrosion study at Cu–Al interface in microelectronics packaging
Mohd. Ambar Yarmo
Applied Surface Science, 2002
View PDFchevron_right
Intermetallic growth kinetics of 2N gold wire ball bonds on aluminium bond pads annealed at 175 °C
Christopher Breach
Gold Bulletin, 2016
View PDFchevron_right
Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
Gan Chong Leong
PLOS ONE, 2014
View PDFchevron_right
Growth of intermetallic compounds in thermosonic copper wire bonding on aluminum metallization
Vadim Silberschmidt
Journal of Electronic Materials, 2010
View PDFchevron_right
Study of the intermetallic growth in copper-clad aluminum wires after thermal aging
B. Domengès
Intermetallics, 2014
View PDFchevron_right
Interactions between solder and metallization during long-term aging of advanced microelectronic packages
C R Kao
Journal of Electronic Materials, 2001
View PDFchevron_right
Fine pitch copper wire bonding in high volume production
Andy Tseng
Microelectronics Reliability, 2011
View PDFchevron_right
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
Jahong Chang
View PDFchevron_right
Process windows for low-temperature Au wire bonding
Ken Cheung
Journal of Electronic Materials, 2004
View PDFchevron_right