Comparison of key performance metrics in two- and three-dimensional integrated circuits (original) (raw)

Advanced Workshop on Frontiers in Electronics WOFE'97

Michael Shur

1997

View PDFchevron_right

Timing error tolerance in nanometer ICs

Y. Tsiatouhas

View PDFchevron_right

Figures of merit to characterize the importance of on-chip inductance

Eby Friedman

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1999

View PDFchevron_right

Improved physical models for advanced silicon device processing

Lourdes Pelaz

Materials Science in Semiconductor Processing, 2017

View PDFchevron_right

Guest Editorial: Advanced Techniques for Efficient Electronic System Design

Pramod Kumar Meher

Circuits, Systems, and Signal Processing, 2013

View PDFchevron_right

First Look at Across-chip Performance Variation Using Non-Contact, Performance-Based Metrology

nader pakdaman

The 17th Annual SEMI/IEEE ASMC 2006 Conference, 2006

View PDFchevron_right

Moore's law lives on [CMOS transistors]

Yang-Kyu Choi

IEEE Circuits and Devices Magazine, 2003

View PDFchevron_right

Scaling planar silicon devices

Rajiv Joshi

IEEE Circuits and Devices Magazine, 2004

View PDFchevron_right

On the Complexity of Wafer-to-Wafer Integration

R. Giroudeau

Lecture Notes in Computer Science, 2015

View PDFchevron_right

Grid generation for three-dimensional non-rectangular semiconductor devices

nancy hitschfeld

1993

View PDFchevron_right

Guest Editorial Special Section on the 2018 SEMI Advanced Semiconductor Manufacturing Conference

Deepak Pawar

IEEE Transactions on Semiconductor Manufacturing, 2019

View PDFchevron_right

Parallelism through Digital Circuit Design

John O'Donnell

2007

View PDFchevron_right

Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits

Eby Friedman

IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2015

View PDFchevron_right

Further examination of Moore's law with data envelopment analysis

Shawna Grosskopf

Technological Forecasting and Social Change, 2002

View PDFchevron_right

Future Trends in Microelectronics

S. Luryi

2010

View PDFchevron_right

The role of long and short paths in circuit performance optimization

David Du

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 1994

View PDFchevron_right

Integrated digital design for manufacture for reduced life cycle cost

Richard Curran

International Journal of Production Economics, 2007

View PDFchevron_right

A Novel Methodology for Thermal Analysis & 3-Dimensional Memory Integration

Annmol Cherian

View PDFchevron_right

Impact of technology scaling on CMOS logic styles

Wafaa Allam

IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing, 2002

View PDFchevron_right

System-on-chip beyond the nanometer wall

Philippe Magarshack

Proceedings of the 40th conference on Design automation - DAC '03, 2003

View PDFchevron_right

Development of a next generation ubiquitous processor chip

Tomoaki Sato

2011 International Symposium on Intelligent Signal Processing and Communications Systems (ISPACS), 2011

View PDFchevron_right

VLSI: Integrated Systems on Silicon

Alberto Sangiovanni Vincentelli

1997

View PDFchevron_right

Advanced Interconnects: Materials, Processing, and Reliability

Larry Zhao

ECS Journal of Solid State Science and Technology, 2014

View PDFchevron_right

Annex III - Technology-specific cost and performance parameters

Roberto Schaeffer

2013

View PDFchevron_right

Three-dimensional simulation of semiconductor devices: state of the art and prospects

G. Baccarani

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 1993

View PDFchevron_right