Jen-Yi Chen - Academia.edu (original) (raw)

Papers by Jen-Yi Chen

Research paper thumbnail of A vibrating micro-resonator design for gyroscope applications using TIA

... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu... more ... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu-Wen Hsu 1 ... Taiwan 3 Department of Electronic Engineering, Kun-Shan University, Taiwan Mailing Address: Rm.509, R2 Building, No.31, Gongye 2nd Rd., Annan District, Tainan 709 ...

Research paper thumbnail of Issues in path toward integrated acoustic sensor system on chip

Abstract—Size and power minimization requirements from portable consumer applications are driving... more Abstract—Size and power minimization requirements from portable consumer applications are driving integration of MEMS sensors with integrated circuits. For performance maximization, designers require MEMS device models MEMS that can be co-simulation with interface circuits for ...

Research paper thumbnail of A new integration of device-scale micropackaging with bi-directional tunable capacitors

The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE

Research paper thumbnail of Issues in path toward low cost three-axis accelerometer for low-g application

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009

Abstract The paper presents issues for an optimized three-axis accelerometer implementation. A Ve... more Abstract The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical ...

Research paper thumbnail of A New Nano-Probe Using Micro Assembly Transfer

2006 International Microsystems, Package, Assembly Conference Taiwan, 2006

This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to b... more This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to be easily assembly on a tuning fork sensor. By taking advantages of surface micromachined tip fabrication, the subsequent assembly-transfer procedures are able to minimize the mass load effect of a tuning fork based atomic force microscopy (AFM). Furthermore, the micro assembly transfer of nano-probes can

Research paper thumbnail of SOG micromechanical resonator utilizing single crystal Si and CMOS ASIC

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010

In this paper, a micromechanical resonator utilizing single crystal Si and CMOS ASIC is presented... more In this paper, a micromechanical resonator utilizing single crystal Si and CMOS ASIC is presented. First, the critical parameters are optimized by theoretical calculation and fine tuned by finite-element-analysis (FEM). Then, SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the resonator as well as a glass wafer is used as the substrate to support the device, metal interconnections and signal I/O. The structure size of the designed resonator is 0.46 mm × 0.34 mm with 3 um minimum gap. Finally, a modified pierce oscillator ASIC and a temperature compensative methodology is developed to accomplish fully integrated reference oscillator design.

Research paper thumbnail of A vibrating micro-resonator design for gyroscope applications using TIA

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010

... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu... more ... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu-Wen Hsu 1 ... Taiwan 3 Department of Electronic Engineering, Kun-Shan University, Taiwan Mailing Address: Rm.509, R2 Building, No.31, Gongye 2nd Rd., Annan District, Tainan 709 ...

Research paper thumbnail of Design of High Performance Condenser Microphone Using Interlaced Slot diaphragm Technology

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008

Abstract In summary, this study successfully demonstrates the design and implementation of high p... more Abstract In summary, this study successfully demonstrates the design and implementation of high performance CMOS condenser microphones. Microphone with a flat frequency response between 100 Hz~ 20 KHz have been fabricated in a reproducible way. The ...

Research paper thumbnail of CMOS compatible directional microphone

2007 International Microsystems, Packaging, Assembly and Circuits Technology, 2007

Abstract The goal of hearing aids is to selectively attenuate acoustic signal based on the direct... more Abstract The goal of hearing aids is to selectively attenuate acoustic signal based on the directional of sound arrival. Directional microphone or microphone arrays are used to achieve this goal. The longer distance of microphone pairs is a problem of the application on hearing aids. In this paper, a single directional microphone structure is proposed to solve this problem and can be used in other application. This directional microphone is constructed by the post CMOS MEMS process. The mechanism of this structure is ...

Research paper thumbnail of Issues in path toward integrated acoustic sensor system on chip

2008 IEEE Sensors, 2008

Abstract—Size and power minimization requirements from portable consumer applications are driving... more Abstract—Size and power minimization requirements from portable consumer applications are driving integration of MEMS sensors with integrated circuits. For performance maximization, designers require MEMS device models MEMS that can be co-simulation with interface circuits for ...

Research paper thumbnail of A new transferred ultra-thin silicon micropackaging

Journal of Micromechanics and Microengineering, 2002

Research paper thumbnail of New capacitive low-gtriaxial accelerometer with low cross-axis sensitivity

Journal of Micromechanics and Microengineering, 2010

... new in-plane and out-of-plane accelerometer design exhibits high cross-axis sensitivity immun... more ... new in-plane and out-of-plane accelerometer design exhibits high cross-axis sensitivity immunity, high sensitivity and high linearity suggesting that the triaxial accelerometer has the potential for use in future ... A balanced ac modulation voltage, Vm, is imposed across the bridge. ...

Research paper thumbnail of Modeling and simulation of a condenser microphone

Sensors and Actuators A: Physical, 2008

A nodal analysis model of a condenser microphone has been implemented in an IC design environment... more A nodal analysis model of a condenser microphone has been implemented in an IC design environment. The fundamental characteristics, including sensitivity, frequency response and output referred noise are obtained by co-simulation with the microphone and the readout ...

Research paper thumbnail of A vibrating micro-resonator design for gyroscope applications using TIA

... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu... more ... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu-Wen Hsu 1 ... Taiwan 3 Department of Electronic Engineering, Kun-Shan University, Taiwan Mailing Address: Rm.509, R2 Building, No.31, Gongye 2nd Rd., Annan District, Tainan 709 ...

Research paper thumbnail of Issues in path toward integrated acoustic sensor system on chip

Abstract—Size and power minimization requirements from portable consumer applications are driving... more Abstract—Size and power minimization requirements from portable consumer applications are driving integration of MEMS sensors with integrated circuits. For performance maximization, designers require MEMS device models MEMS that can be co-simulation with interface circuits for ...

Research paper thumbnail of A new integration of device-scale micropackaging with bi-directional tunable capacitors

The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE

Research paper thumbnail of Issues in path toward low cost three-axis accelerometer for low-g application

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009

Abstract The paper presents issues for an optimized three-axis accelerometer implementation. A Ve... more Abstract The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical ...

Research paper thumbnail of A New Nano-Probe Using Micro Assembly Transfer

2006 International Microsystems, Package, Assembly Conference Taiwan, 2006

This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to b... more This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to be easily assembly on a tuning fork sensor. By taking advantages of surface micromachined tip fabrication, the subsequent assembly-transfer procedures are able to minimize the mass load effect of a tuning fork based atomic force microscopy (AFM). Furthermore, the micro assembly transfer of nano-probes can

Research paper thumbnail of SOG micromechanical resonator utilizing single crystal Si and CMOS ASIC

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010

In this paper, a micromechanical resonator utilizing single crystal Si and CMOS ASIC is presented... more In this paper, a micromechanical resonator utilizing single crystal Si and CMOS ASIC is presented. First, the critical parameters are optimized by theoretical calculation and fine tuned by finite-element-analysis (FEM). Then, SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the resonator as well as a glass wafer is used as the substrate to support the device, metal interconnections and signal I/O. The structure size of the designed resonator is 0.46 mm × 0.34 mm with 3 um minimum gap. Finally, a modified pierce oscillator ASIC and a temperature compensative methodology is developed to accomplish fully integrated reference oscillator design.

Research paper thumbnail of A vibrating micro-resonator design for gyroscope applications using TIA

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010

... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu... more ... Sheng-Ren Chiu 1, 2 , Jen-Yi Chen 1 , Li-Tao Teng 1 , Chung-Yang Sue 1 , Shih-Ting Lin 1 , Yu-Wen Hsu 1 ... Taiwan 3 Department of Electronic Engineering, Kun-Shan University, Taiwan Mailing Address: Rm.509, R2 Building, No.31, Gongye 2nd Rd., Annan District, Tainan 709 ...

Research paper thumbnail of Design of High Performance Condenser Microphone Using Interlaced Slot diaphragm Technology

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008

Abstract In summary, this study successfully demonstrates the design and implementation of high p... more Abstract In summary, this study successfully demonstrates the design and implementation of high performance CMOS condenser microphones. Microphone with a flat frequency response between 100 Hz~ 20 KHz have been fabricated in a reproducible way. The ...

Research paper thumbnail of CMOS compatible directional microphone

2007 International Microsystems, Packaging, Assembly and Circuits Technology, 2007

Abstract The goal of hearing aids is to selectively attenuate acoustic signal based on the direct... more Abstract The goal of hearing aids is to selectively attenuate acoustic signal based on the directional of sound arrival. Directional microphone or microphone arrays are used to achieve this goal. The longer distance of microphone pairs is a problem of the application on hearing aids. In this paper, a single directional microphone structure is proposed to solve this problem and can be used in other application. This directional microphone is constructed by the post CMOS MEMS process. The mechanism of this structure is ...

Research paper thumbnail of Issues in path toward integrated acoustic sensor system on chip

2008 IEEE Sensors, 2008

Abstract—Size and power minimization requirements from portable consumer applications are driving... more Abstract—Size and power minimization requirements from portable consumer applications are driving integration of MEMS sensors with integrated circuits. For performance maximization, designers require MEMS device models MEMS that can be co-simulation with interface circuits for ...

Research paper thumbnail of A new transferred ultra-thin silicon micropackaging

Journal of Micromechanics and Microengineering, 2002

Research paper thumbnail of New capacitive low-gtriaxial accelerometer with low cross-axis sensitivity

Journal of Micromechanics and Microengineering, 2010

... new in-plane and out-of-plane accelerometer design exhibits high cross-axis sensitivity immun... more ... new in-plane and out-of-plane accelerometer design exhibits high cross-axis sensitivity immunity, high sensitivity and high linearity suggesting that the triaxial accelerometer has the potential for use in future ... A balanced ac modulation voltage, Vm, is imposed across the bridge. ...

Research paper thumbnail of Modeling and simulation of a condenser microphone

Sensors and Actuators A: Physical, 2008

A nodal analysis model of a condenser microphone has been implemented in an IC design environment... more A nodal analysis model of a condenser microphone has been implemented in an IC design environment. The fundamental characteristics, including sensitivity, frequency response and output referred noise are obtained by co-simulation with the microphone and the readout ...