Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process
Raymundo Arróyave
Computational Materials Science, 2011
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Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders
Huajie Yang
Materials Chemistry and Physics, 2011
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Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints
Nikhilesh Chawla
Journal of Electronic Materials, 2003
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The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
Eric J Cotts
Journal of Electronic Materials, 2001
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Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
Vadim Silberschmidt, Paul P Conway
Acta Materialia, 2008
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Effects of solidification kinetics on microstructure formation in binary Sn-Cu solder alloys
Arne Dahle
Acta Materialia, 2010
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Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques
Marek Danielewski
Advanced Engineering Materials, 2014
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On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu
Nikhilesh Chawla
Metallurgical and Materials Transactions A, 2012
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A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints
Dr Ajay Kumar
Journal of Electronic Materials, 2020
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Effect of Ti on the interfacial reaction between Sn and Cu
Tomi Laurila, Vesa Vuorinen
Journal of Materials Science: Materials in Electronics, 2012
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Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging
Bi Cu
Materials Chemistry and Physics, 2001
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Intermetallics Formation and Growth at the Interface of Tin-Based Solder Alloys and Copper Substrates | NIST
Stephen Liu
2003
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Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System
Vesa Vuorinen
Journal of Electronic Materials, 2007
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Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
Eric J Cotts
Journal of Electronic Materials, 2004
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Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
Vesa Vuorinen
Microelectronics Reliability, 2009
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A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints
Nobumichi Tamura
JOM, 2006
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Cellular to dendritic transition during transient solidification of a eutectic Sn–0.7wt%Cu solder alloy
Noé Cheung
Materials Chemistry and Physics, 2012
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Mechanism of the Delayed Growth of Intermetallic Compound at the Interface between Sn-4.0Ag-0.5Cu and Cu-Zn Substrate
영호 김
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Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories
Lubov Zavalij
53rd Electronic Components and Technology Conference, 2003. Proceedings., 2003
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Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System
Ashim paul
Metallurgical and Materials Transactions A, 2011
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Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
AIMI NOORLIYANA HASHIM
Materials
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Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects
A. Freidin
Journal of Electronic Materials, 2020
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The Effect of Increased Cu Content on Microstructure and Melting of Utilized Sn-0.3Ag-0.7Cu Solder
Jozef Janovec
Research Papers Faculty of Materials Science and Technology Slovak University of Technology, 2018
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Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
Sunglak Choi, Thomas Bieler
Journal of Electronic Materials, 1999
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The formation of Cu 3 Sn intermetallic on the reaction of cu with 95Pb5Sn solder
Dennis Grivas
Journal of Electronic Materials, 1986
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Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps
Hyunsuk Chun
Journal of Electronic Materials, 2004
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Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni
Amauri Garcia
Journal of Electronic Materials, 2013
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Formation behaviour of reaction layer in Sn-3.0Ag-0.5Cu solder joint with addition of porous Cu interlayer
Nashrah Hani Jamadon
IOP conference series, 2014
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Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu 6 Sn 5 Intermetallic Compound
nitin jadhav
Journal of Electronic Materials, 2009
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Morphologies, orientation relationships and evolution of Cu< sub> 6 Sn< sub> 5 grains formed between molten Sn and Cu single crystals
Huajie Yang
Acta Materialia, 2008
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Growth kinetics of Cu–Sn intermetallic compounds at the interface of a Cu substrate and 42Sn–58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints
Hyuk-sang Kwon
Materials Chemistry and Physics, 2008
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Effect of ni on the formation of Cu6Sn5 and Cu3Sn intermetallics
Vesa Vuorinen
Ieee Transactions on Electronics Packaging Manufacturing, 2007
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The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder
Iziana Yahya
2018
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Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient
Amauri Garcia
Journal of Alloys and Compounds, 2015
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Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process
Chong Dong
Journal of Materials Science: Materials in Electronics, 2020
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