Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
Rakesh Pillai
Journal of Electronic Packaging, 2016
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Microstructure evolution in Sn–Bi and Sn–Bi–Cu solder joints under thermal aging
Bi Cu
Materials Chemistry and Physics, 2001
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Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
Sunglak Choi, Thomas Bieler
Journal of Electronic Materials, 1999
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The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
Eric J Cotts
Journal of Electronic Materials, 2001
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Microstructure Evolution During the Aging at Elevated Temperature of Sn-Ag-Cu Solder Alloys
Osvaldo Fornaro
Procedia Materials Science, 2012
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Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
Eric J Cotts
Journal of Electronic Materials, 2004
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The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rate
Iziana Yahya
Journal of Materials Science: Materials in Electronics, 2014
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Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu
MARCO MARQUES
Microelectronics Reliability, 2007
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On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu
Nikhilesh Chawla
Metallurgical and Materials Transactions A, 2012
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Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects
Dezhi Li
Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2005
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Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders
Huajie Yang
Materials Chemistry and Physics, 2011
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Intermetallic evolution between Sn-3.5Ag-1.0Cu-xZn lead free solder and copper substrate under long time thermal aging (x: 0, 0.1, 0.4, 0.7)
Iziana Yahya
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012
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The Effect of Increased Cu Content on Microstructure and Melting of Utilized Sn-0.3Ag-0.7Cu Solder
Jozef Janovec
Research Papers Faculty of Materials Science and Technology Slovak University of Technology, 2018
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Some aspects of nucleation and growth in Pb free Sn–Ag–Cu solder
T. Sack, L. Snugovsky, Polina Snugovsky
Materials Science and Technology, 2005
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The effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder
Iziana Yahya
2018
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Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process
Raymundo Arróyave
Computational Materials Science, 2011
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Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions
Mohammad Hamasha
Journal of Electronic Materials, 2015
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Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate
Luc PETIT
Intermetallics, 2013
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Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations
C R Kao
Materials Science and Engineering: A, 2005
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A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
C R Kao
Journal of Electronic Materials, 2003
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Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions
Lubomir Kovacik
Acta Materialia, 2012
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A Model for Intermetallic Growth in Thin Sn Joints Between Cu Substrates: Application to Solder Microjoints
Dr Ajay Kumar
Journal of Electronic Materials, 2020
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Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb– x Cu solder joints
hwa-teng Lee
Science and Technology of Welding and Joining, 2008
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Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling
philippe milesi
Microelectronics Reliability, 2018
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Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories
Lubov Zavalij
Electronic Components and Technology Conference, 2003
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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions
Faculty of Engineering University of Malaya
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Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C
Jun Hyung Lim
Journal of Materials Research, 2006
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Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation
budiman salam
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
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Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
AIMI NOORLIYANA HASHIM
Materials
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Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers
Vesa Vuorinen
Microelectronics Reliability, 2009
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Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead-free solder
LiN Qi
Journal of Alloys and Compounds, 2004
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Current stressing-induced growth of Cu 3Sn in Cu/Sn/Cu solder joints
Jui-Chao Kuo, Cheng-En Ho
Materials Letters, 2011
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Effects of solidification kinetics on microstructure formation in binary Sn-Cu solder alloys
Arne Dahle
Acta Materialia, 2010
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Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects
A. Freidin
Journal of Electronic Materials, 2020
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The Sn-3.5Ag-1.0Cu-0.1Zn/Cu Intermetallic Interface under Thermal Aging
Iziana Yahya
2012
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