Power Couplers Research Papers - Academia.edu (original) (raw)
In recent years substrate integrated waveguide technology (SIW) has been applied successfully to the conception of planar compact components for the microwave and millimeter waves applications. In this study, a V-band substrate integrated... more
In recent years substrate integrated waveguide technology (SIW) has been applied successfully to the
conception of planar compact components for the microwave and millimeter waves applications. In this
study, a V-band substrate integrated waveguide coupler, power divider and circulator are conceived and
optimized by Ansoft HFSS code. Thus, through this modeling, design considerations and results are
discussed and presented. Attractive features including compact size and planar form make these devices
structure easily integrated in planar circuits.
This project is mainly focused on force acting on the hydraulic scissor lift when it is extended and contracted. Generally, a hydraulic scissor lift is used for lifting and holding heavy weight components. Material selection plays a key... more
This project is mainly focused on force acting on the hydraulic scissor lift when it is extended and contracted. Generally, a hydraulic scissor lift is used for lifting and holding heavy weight components. Material selection plays a key role in designing a machine and also influence on several factor such as durability, reliability, strength, resistance which finally leads to increase the life of scissor lift. The design is performed by considering hydraulic scissor lift as a heavy load application and Three Axis movement of the load. Drafting & drawing of hydraulic system scissor lift is done using solid works with suitable modeling and analyze in solid work simulation. Hence, the analysis of the scissor lift includes Total deformation load, Equivalent stress, was done in solid work simulation in all responsible parameters were analyzed in order to check the compatibility of the design.
The Substrate Integrated Waveguide (SIW) technology is an attractive approach for the design of high performance microwave and millimeter wave components, as it combines the advantages of planar technology, such as low fabrication costs,... more
The Substrate Integrated Waveguide (SIW) technology is an attractive approach for the design of high
performance microwave and millimeter wave components, as it combines the advantages of planar
technology, such as low fabrication costs, with the low loss inherent to the waveguide solution. In this
study, a substrate integrated waveguide power divider, circulator and coupler are conceived and optimized
in [10-15] GHz band by Ansoft HFSS code. Thus, results of this modeling are presented, discussed and
allow to integrate these devices in planar circuits.
In recent years substrate integrated waveguide technology (SIW) has been applied successfully to the conception of planar compact components for the microwave and millimeter waves applications. In this study, a V-band substrate integrated... more
In recent years substrate integrated waveguide technology (SIW) has been applied successfully to the conception of planar compact components for the microwave and millimeter waves applications. In this study, a V-band substrate integrated waveguide coupler, power divider and circulator are conceived and optimized by Ansoft HFSS code. Thus, through this modeling, design considerations and results are discussed and presented. Attractive features including compact size and planar form make these devices structure easily integrated in planar circuits.
A big effort in R&D focused to the LINAC devices together with the know-how already deployed through emblematic projects, places DMP in the state of the art of the extreme precision mechanics. This mechanic culture makes DMP a natural... more
A big effort in R&D focused to the LINAC devices
together with the know-how already deployed through
emblematic projects, places DMP in the state of the art of
the extreme precision mechanics. This mechanic culture
makes DMP a natural partner in early stages of design or
driver of a comprehensive solution, optimizing industrial
risks, quality and due date. Surface roughness below
1 nanometer, figure errors better than 50 nanometers in
OFE copper enhances lifetime and performance of many
devices for LINACs. Research in joining techniques and
combining several alternative technologies to traditional
machining, improves figure stability and makes complex
cooling systems possible.
In this paper, a miniaturized front-end six-port receiver prototyped by 130 nm CMOS technology at 60 GHz frequency band is presented. The proposed six-port circuit consists of three compact 3dB branch-line couplers (BLC) and one... more
In this paper, a miniaturized front-end six-port
receiver prototyped by 130 nm CMOS technology at 60 GHz
frequency band is presented. The proposed six-port circuit
consists of three compact 3dB branch-line couplers (BLC) and
one compact Wilkinson power divider (WPD). Two
miniaturization techniques are used; meandering thin-film
microstrip transmission lines (MTFM) and capacitive loading
(CL). These two techniques lead to dramatic size reduction which
is desirable for MMIC technology. Moreover multi-level
metallization processes, offered for CMOS technology, is used.
The results are provided based on a full-wave commercial
electromagnetic package, ADS Agilent. The simulated results
show good impedance characteristics over 57-64 GHz frequency
band. The S-parameter results, as well as constellation diagram
of QPSK modulation with data rate of 3.52 Gbps for three
different cases confirm the capability of miniaturized six-port
circuit for high data-rate wireless personal area network
(WPAN) applications at 60 GHz frequency band.