A decision support system for the Alternative Assembly and Reflow Technology process (original) (raw)
Related papers
Surface Mount Technology Process Optimization
2010
An adhesive selection advisor for PCB assembly using surface mount technology
The International Journal of Advanced Manufacturing Technology, 1994
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1998
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1998
A Knowledge-Based System for Stencil Printing Process Planning and Control
Journal of the Chinese Institute of Industrial Engineers, 2007
Method of Operative Search of Solder Joints During Printed Circuit Boards Development
Computer Modeling and Intelligent Systems
Mehran University Research Journal of Engineering and Technology
A tool for errors detection in printed circuit boards production
Development of an intelligent system for the solder paste printing process
2000 TENCON Proceedings. Intelligent Systems and Technologies for the New Millennium (Cat. No.00CH37119), 2000
A General Decision-Making Method for the Rapid Manufacturing of Customized Parts
2003
Modeling and optimization of stencil printing operations: A comparison study
Computers & Industrial Engineering, 2008
Knowledge-based Adhesive Selection for SMT Assemblies
Soldering & Surface Mount Technology, 1992
A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies
Finite Elements in Analysis and Design, 1998
Characterization of printed solder paste excess and bridge related defects
2008 2nd Electronics Systemintegration Technology Conference, 2008
The International Journal of Advanced Manufacturing Technology, 2019
INCA: an expert system for process planning in PCB assembly line
[1988] Proceedings. The Fourth Conference on Artificial Intelligence Applications
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1998
Model of Assembling Process for Electronic Parts Integrated in Mechatronic Products
2013
Product/Process Design in Mass Placement Printed Circuit Board Assembly
Production and Operations Management, 2009
Applied Soft Computing, 2012
Production Planning in Printed Circuit Board Assembly
2002
Computer-aided process planning in printed circuit card assembly
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
On the selection of parts and processes during design of printed circuit board assemblies
Proceedings 1995 INRIA/IEEE Symposium on Emerging Technologies and Factory Automation. ETFA'95, 1995
An Expert System for Design of Blanking Dies for Sheet Metal Operations
2008
On the Work Process Organization of Surface Mounted Component Printing
1997
Optimization Of Solder Paste Printing Parameters Using Design Of Experiments (DOE)
2005
Raj Bhatti, Emeka Amalu, G. Takyi
Microelectronic Engineering, 2011
Selective Solder Fine Pitch Components on High Thermal Mass Assembly
2019
A forced directed component placement procedure for printed circuit boards
Circuits and Systems, IEEE Transactions …, 1979
Journal of Intelligent Manufacturing, 2000
2005
An ad hoc decision support method over additive vs. conventional manufacturing
MATEC Web of Conferences
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1998
Soldering & Surface Mount Technology, 2019
Effect of solder volume on joint shape with variable chip-to-board contact pad ratio
… and Packaging Poland …, 2008