Surface Mount Technology Process Optimization (original) (raw)
Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study
ali aman
Soldering & Surface Mount Technology, 2019
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Characterization of printed solder paste excess and bridge related defects
Diana Valentina Segura
2008 2nd Electronics Systemintegration Technology Conference, 2008
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Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components
Raden Achmad Chairdino Leuveano
Materials, 2014
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Effect of Temperature on Solder Paste During Surface Mount Technology Printing
sharizal aziz
2020
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Optimization Of Solder Paste Printing Parameters Using Design Of Experiments (DOE)
Jafri Rohani
2005
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Effect of solder volume on joint shape with variable chip-to-board contact pad ratio
Alan Mathewson
… and Packaging Poland …, 2008
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Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits
Livia Racz
ISIJ International, 1993
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iNEMI Solder Paste Deposition Project report — Optimizing solder paste printing for large and small components
Rita Mohanty
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Stencil printing process performance on various aperture size and optimization for lead-free solder paste
MOHD SYAKIRIN RUSDI
The International Journal of Advanced Manufacturing Technology, 2019
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A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits
Raj Bhatti, Emeka Amalu, G. Takyi
Microelectronic Engineering, 2011
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Impact of Low Silver Solder Pastes on Area Array Solder Joint Quality
Raiyo Aspandiar
2013
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iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components
Rita Mohanty
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009
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Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system
İsmail Fidan
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1998
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Innovations in Soldering Materials and Optimization of Solder Paste Printing and Inspection Parameters for System-in-Package Assembly
david Sbiroli
IMAPSource Proceedings
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Solder paste for fine line printing in hybrid microelectronics
Janeta Fajfar Plut
Microelectronics Journal, 1995
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The Metallurgical Approach on the Solder Voids Behaviour in Surface Mount Devices
IR. MOHABATTUL ZAMAN BUKHARI
Proceedings of the 1996 Asian Conference on X-Rays and Related Techniques in Research and Industry (ACXRI'96), 1996
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Dispelling the Black Magic of Solder Paste
Tony Facusse Lentz
2015
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Size Matters-The Effects of Solder Powder Size on Solder Paste Performance
Tony Facusse Lentz
2019
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Leaded and Lead-Free Solder Paste Evaluation Screening Procedure
Ronald C. Lasky
2007
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A novel placement method for mini-scale passive components in surface mount technology
Jingxi He
The International Journal of Advanced Manufacturing Technology, 2021
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Evaluation of chip-to-board interconnection using variable aspect ratio contact pad areas
A. Mathewson, F. Stam
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The Optimization of the Soldering Process Through Experiment Design
Felicia Banciu
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Solder spread: A criterion for evaluation of soldering
David M . Jacobson
Gold Bulletin, 1990
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An overview of surface finishes and their role in printed circuit board solderability and solder joint performance
Paul Vianco
Circuit World, 1999
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Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints
Tae-Kyu Lee, Hong-Tao Ma
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013
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Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology
Chien Chen Lee
Microelectronics …, 2007
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A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applications
Benny Hong
53rd Electronic Components and Technology Conference, 2003. Proceedings.
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Solder bumping via paste reflow for area array packages
Ning-Cheng Lee
2002
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Comparative Study on the Effect of Surface Finish on Mechanical Properties of Solder Joints
Alena Pietrikova
2023 46th International Spring Seminar on Electronics Technology (ISSE), 2023
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Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method
C.Y. Khor
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Characterization of coined solder bumps on PCB pads
Jae-Woong Nah
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
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European Microelectronics Packaging Conference Effects of Component Stand-off Height on Reliability of Solder Joints in Assembled Electronic Component
Jude Njoku
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Selective Solder Fine Pitch Components on High Thermal Mass Assembly
Gerjan Diepstraten
2019
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Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics
Abhijit Dasgupta
IEEE Transactions on Electronics Packaging Manufacturing, 2008
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Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB
Paul P Conway
Journal of Electronic Packaging, 2008
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