Dielectric and Conductor Roughness Models Identification for Successful PCB and Packaging Interconnect Design up to 50 GHz (original) (raw)
DesignCon 2010 Practical identification of dispersive dielectric models with generalized modal S-parameters for analysis of interconnects in 6100 Gb / s applications
Yuriy Shlepnev
2009
View PDFchevron_right
Lessons learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond, DesignCon 2014
Yuriy Shlepnev
View PDFchevron_right
Lessons learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond, DesignCon 2014 - Presentation
Yuriy Shlepnev
View PDFchevron_right
DesignCon 2014 Lessons learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond
Wendem Beyene
2020
View PDFchevron_right
Roughness characterization for interconnect analysis
Yuriy Shlepnev
2011
View PDFchevron_right
Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects
Cemil Serdar Geyik
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
View PDFchevron_right
Practical methodology for analyzing the effect of conductor roughness on signal losses and dispersion in interconnects
Yuriy Shlepnev
2012
View PDFchevron_right
Broadband material model identification with GMS-parameters
Yuriy Shlepnev
2015
View PDFchevron_right
Unified approach to interconnect conductor surface roughness modelling
Yuriy Shlepnev
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017
View PDFchevron_right
A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 110 GHz
Kai Kang
IEEE Transactions on Microwave Theory and Techniques, 2008
View PDFchevron_right
Techniques for including dielectrics when extracting passive low-order models of high speed interconnect
Alberto Sangiovanni Vincentelli
2001
View PDFchevron_right
Evaluation of the propagation constants of differential PCB interconnections
G. Antonini
2007 IEEE Workshop on Signal Propagation on Interconnects, 2007
View PDFchevron_right
Transmission line modelling for multi-gigabit serial interfaces
Gerard Edwards
View PDFchevron_right
Signal integrity analysis of high-speed interconnects through a full-wave transmission line model
Antonio MAFFUCCI
Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005, 2005
View PDFchevron_right
Microwave frequency interconnection line model of a wafer level package
Junho Lee
IEEE Transactions on Advanced Packaging, 2002
View PDFchevron_right
Substrate design optimization for high speed links
nam pham
53rd Electronic Components and Technology Conference, 2003. Proceedings.
View PDFchevron_right
Systematic development of transmission-line models for interconnects with frequency-dependent losses
Vladimir Okhmatovski
IEEE Transactions on Microwave Theory and Techniques, 2001
View PDFchevron_right
Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
Andrew Tay
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004
View PDFchevron_right
Crosstalk analysis of high-speed interconnects and packages
Mani Soma
IEEE Proceedings of the Custom Integrated Circuits Conference
View PDFchevron_right
Electrical two and three dimensional modelling of high-speed board to board interconnections
Mark Gailus
1995
View PDFchevron_right
Electromagnetic modelling and simulation of multiconductor interconnect networks with inhomogeneous cylindrical substrate
Michel Nakhla
IEE Proceedings - Microwaves, Antennas and Propagation, 1997
View PDFchevron_right
High-frequency full-wave analysis of interconnects with inhomogeneous dielectrics through an enhance
andrea gaetano chiariello
2007
View PDFchevron_right
Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low- Cost FR-4 boards for 6-20 Gb/sec Applications
Yuriy Shlepnev
2009
View PDFchevron_right
Systematic application of a full-wave solver to developing scalable models for high-speed interconnects
Abraham Muñoz
2017
View PDFchevron_right
Semiempirical Model for IC Interconnects Considering the Coupling Between the Signal Trace and the Ground Plane
Mónico Linares Aranda
Circuits, Systems, and Signal Processing, 2018
View PDFchevron_right
Differential Extrapolation Method for Separating Dielectric and Rough Conductor Losses in Printed Circuit Boards
Marina Koledintseva
IEEE Transactions on Electromagnetic Compatibility, 2000
View PDFchevron_right
Modelling jitter induced by fibre weave effect in PCB dielectrics
Yuriy Shlepnev
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014
View PDFchevron_right
Decompositional electromagnetic analysis of digital interconnects
Yuriy Shlepnev
2013 IEEE International Symposium on Electromagnetic Compatibility, 2013
View PDFchevron_right