Characterization of lead-free solders and under bump metallurgies for flip-chip package (original) (raw)

Electrical resistivity and creep behavior of hypoeutectic Sn–0.5Cu based solders for flip chip technology

A. A. El-Daly

Journal of Materials Science: Materials in Electronics, 2017

View PDFchevron_right

Thermo-mechanical FEM analysis of lead free and lead containing solder for Flip Chip applications

Mario GOnzalez

2005

View PDFchevron_right

High temperature reliability of lead-free solder joints in a flip chip assembly

Emeka Amalu

Journal of Materials Processing Technology, 2012

View PDFchevron_right

Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Kyung-Wook Paik

Journal of Electronic Materials, 2002

View PDFchevron_right

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliability

Kyung-Wook Paik

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001

View PDFchevron_right

Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

Kyung-Wook Paik, Jae-Woong Nah

Acta Materialia, 2004

View PDFchevron_right

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Hyunsuk Chun

Microelectronics Reliability, 2008

View PDFchevron_right

Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder

H. Oppermann, Christine Kallmayer

IEEE Transactions on Electronics Packaging Manufacturing, 2002

View PDFchevron_right

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

Ricky Lee

IEEE Transactions on Components and Packaging Technologies, 2006

View PDFchevron_right

Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions

영준 신

Journal of Mechanical Science and Technology, 2009

View PDFchevron_right

Reliability investigations of flip-chip solder bumps on palladium

Christine Kallmayer

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999

View PDFchevron_right

Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

Kyung-Wook Paik

Journal of Electronic Materials, 2005

View PDFchevron_right

A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applications

Benny Hong

53rd Electronic Components and Technology Conference, 2003. Proceedings.

View PDFchevron_right

Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

Dezhi Li

Materials Science and Engineering A-structural Materials Properties Microstructure and Processing, 2005

View PDFchevron_right

Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints

Ajit Mal

Journal of Applied Physics, 1999

View PDFchevron_right

Recent Lead-Free Solders Research Projects Thermal Fatigue Behavior of Sn-rich Pb-free Solders

Rajen Sidhu, Nikhilesh Chawla

2000

View PDFchevron_right

Investigation of flip chip under bump metallization systems of Cu pads

Jae-Woong Nah

IEEE Transactions on Components and Packaging Technologies, 2002

View PDFchevron_right

Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

Kyung-Wook Paik

Journal of Applied Physics, 2009

View PDFchevron_right

Electromigration in flip chip solder joints under extra high current density

C R Kao

Journal of Applied Physics, 2010

View PDFchevron_right

Addressing opportunities and risks of pb-free solder alloy alternatives

Stephen Tisdale

… , 2009. EMPC 2009. …, 2009

View PDFchevron_right

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Richard Coyle

JOM, 2015

View PDFchevron_right

C4NP - Lead Free Flip Chip Solder Bumping Manufacturing and Reliability Data

Luc Belanger

2006 7th International Conference on Electronic Packaging Technology, 2006

View PDFchevron_right

Investigation of bump crack and deformation on Pb-free flip chip packages

Jeremia Full

2010

View PDFchevron_right

Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip

Paul P Conway

IEEE Transactions on Components and Packaging Technologies, 2000

View PDFchevron_right

Reliability of Pb-free solder alloys in demanding BGA and CSP applications

Robert Healey

2008 58th Electronic Components and Technology Conference, 2008

View PDFchevron_right

Flip chip assembly on PCB substrates with coined solder bumps

Jae-Woong Nah

53rd Electronic Components and Technology Conference, 2003. Proceedings.

View PDFchevron_right

Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization

Tony Shao

Journal of Electronic Materials, 2003

View PDFchevron_right

Introductory Chapter: Overview of Pb-Free Solders and Effect of Multilayered Thin Film of Sn on the Lead-Free Solder Joint Interface

Monalisa Char

Lead Free Solders, 2019

View PDFchevron_right

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Mario Gonzalez

Microelectronics Reliability, 2007

View PDFchevron_right

Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints

Tae-Kyu Lee, Hong-Tao Ma

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013

View PDFchevron_right