Appendix 1 for Fuchs and Kirchain's Journal of Lightwave Technology paper, "Process Based Cost Modeling of Photonics Manufacture (original) (raw)
Related papers
Semiconductor Device Fabrication Technology
Selective growth of InP in device fabrication
1992
Lithography Options for the 32 nm Half Pitch Node and Beyond
Mieke Goethals, eric hendrickx
IEEE Transactions on Circuits and Systems I: Regular Papers, 2000
Laser micromachining of through via interconnects in active die for 3D multichip module
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'
Full-wafer technology-A new approach to large-scale laser fabrication and integration
IEEE Journal of Quantum Electronics, 1991
Semiconductor processing and manufacturing
Progress in Photovoltaics: Research and Applications, 1997
Integrated optical and electronic interconnect printed circuit board manufacturing
D. Selviah, Shefiu S. Zakariyah, PhD, CEng, SMIEEE, MIET, AMIMA, AInstCT
Circuit …, 2008
Novel Fabrication and Packaging Technologies
2009
Preparation and test of special surfaces for epi-ready InP wafers
Materials Science and Engineering: B, 1997
Laser direct-write of embedded electronic components and circuits
SPIE Proceedings, 2005
OES diagnostics as a universal technique to control the Si etching structures profile in ICP
Scientific Reports, 2022
A Review on Laser Processing in Electronic and MEMS Packaging
Journal of Electronic Packaging, 2017
Integrated optical and electronic interconnect PCB manufacturing research
D. Selviah, Shefiu S. Zakariyah, PhD, CEng, SMIEEE, MIET, AMIMA, AInstCT
Circuit …, 2010
Journal of Photopolymer Science and Technology
MIT-OSU-HP Focus center on non-lithographic Technologies for MEMS and nEMS
Transfer of InP epilayers by wafer bonding
Journal of Crystal Growth, 2004
Integration of InP and InGaAs on 300 mm Si Wafers Using Chemical Mechanical Planarization
ECS Journal of Solid State Science and Technology
Advancement in Lithographic Techniques for Semiconductor Devices
2021
Vendor capability for low-thermal-expansion mask substrates for EUV lithography
Emerging Lithographic Technologies VI, 2002
Via and embedded resistor production in low cost lithographically printed substrates
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
Rapid laser prototyping of multichip modules
Submicron MOS process with 10:1 optical-projection printing and anisotropic dry etching
IEE Proceedings I Solid State and Electron Devices, 1983
2004 IEEE International Conference on Semiconductor Electronics, 2004
3 Device Fabrication Technology 1
1998
Integrated optical interconnections on printed circuit boards
SPIE Newsroom, 2007
Integration of Inline Single-side Wet Emitter Etch in PERC Cell Manufacturing
Energy Procedia, 2012
Packaging Approach for Integrating 40/45-nm ELK Devices Into Wire Bond and Flip-Chip Packages
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011
Proceedings of SPIE, 1999
Development and Implementation of C4NP Technology for 300 mm Wafers
Eric Perfecto, Sarah Knickerbocker
2007 Proceedings 57th Electronic Components and Technology Conference, 2007